Abstract: New methods are provided for manufacture ceramic resistive igniter elements that include injection molding of one or more layers of the formed element. Ceramic igniters also are provided that are obtainable from fabrication methods of the invention.

Abstract: New ceramic resistive igniter elements are provided that comprise a first conductive zone, a resistive hot zone, and a second conductive zone, all in electrical sequence. In preferred igniters, at least a substantial portion of the first conductive zone does not contact a ceramic insulator. Preferred igniters of the invention have a rounded cross-sectional shape for at least a portion of the igniter length.

Abstract: The invention provides new ceramic resistive heating elements and new methods for manufacturing ceramic resistive heating elements wherein the heating element body comprises two or more regions of differing resistivity, and wherein the heating elements are open face. Heating elements such as igniters and glow plugs also are provided obtainable from fabrication methods of the invention.

Abstract: New ceramic heating elements are provided that have a recessed portion for receiving an electrical lead. Such ceramic heating elements can provide a reduced cross-sectional dimension across element regions that interface with electrical lead(s) as well as a more secure engagement of an electrical lead. Heating elements can be highly useful in a variety of application, including e.g. for fuel ignition for gas cooking appliances as well as vehicular glow plugs.

Abstract: New methods are provided for manufacture ceramic elements that include injection molding of two, three or more distinct ceramic layers or regions that form the element. Ceramic elements also are provided that are obtainable from fabrication methods of the invention.

Abstract: The invention provides new methods for manufacture ceramic resistive heating elements that include forming a heating element body comprising comprises two or more regions of differing resistivity, and processing a portion of the element body to form a heating element. Heating elements such as igniters and glow plugs also are provided obtainable from fabrication methods of the invention.

Abstract: New methods are provided or manufacture ceramic resistive igniter elements that include sintering of the elements in the absence of substantially elevated pressures. Ceramic igniters also are provided that are obtainable from fabrication methods of the invention.

Abstract: New methods are provided for manufacture ceramic resistive igniter elements that include injection molding of one or more layers of the formed element. Ceramic igniters also are provided that are obtainable from fabrication methods of the invention.

Abstract: New methods are provided or manufacture ceramic resistive igniter elements that include extrusion of one or more layers of the formed element. Ceramic igniters also are provided that are obtainable from fabrication methods of the invention.

Abstract: New methods are provided or manufacture ceramic resistive igniter elements that include sintering of the elements in the absence of substantially elevated pressures. Ceramic igniters also are provided that are obtainable from fabrication methods of the invention.

Abstract: New ceramic resistive igniter elements are provided that comprise a first conductive zone, a resistive hot zone, and a second conductive zone, all in electrical sequence. In preferred igniters, at least a substantial portion of the first conductive zone does not contact a ceramic insulator. Preferred igniters of the invention have a rounded cross-sectional shape for at least a portion of the igniter length.

Abstract: The invention relates to multi-layer articles and methods of making such articles. The methods include first conditioning the surface of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned surface. The conditioned surface can be a high quality surface. Superconductor articles formed by these methods can exhibit relatively high critical current densities.

Abstract: Methods and articles for controlling the surface of an alloy substrate for deposition of an epitaxial layer. The invention includes the use of an intermediate layer to stabilize the substrate surface against oxidation for subsequent deposition of an epitaxial layer.

Abstract: The invention relates to multi-layer articles and methods of making such articles. The multi-layer superconductors can have one or more layers with an oriented termination plane. The methods include first conditioning the termination plane of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned termination plane. The conditioned termination plane can be a high quality termination plane. Superconductor articles formed by these methods can exhibit relatively high critical current densities.

Abstract: The invention relates to multi-layer articles and methods of making such articles. The multi-layer superconductors can have one or more layers with an oriented termination plane. The methods include first conditioning the termination plane of an underlying layer, such as a buffer layer or a superconductor layer, then disposing a layer of material on the conditioned termination plane. The conditioned termination plane can be a high quality termination plane. Superconductor articles formed by these methods can exhibit relatively high critical current densities.

Abstract: A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.

Abstract: A high purity titanium polycrystalline target with uniform grain size and near ideal (103) crystallographic orientation and a method of making. Uniform grain size from 10 .mu.m-500 .mu.m is achieved by using a fine grain five inch diameter titanium billet produced by hot working an electron beam cast billet. Greater than 80% (103) crystallographic orientation is achieved while maintaining uniform and optimal grain size in the target. The result is a higher collimated deposition rate with increased efficiency of bottom coverage of vias and a highly (002) oriented titanium film.

Abstract: A high performance, high density sputtering target and a method of making. An aluminum and non-aluminum reactive metal powder blend is subjected to cold pressing under pressure, machining, evacuating, and hot pressing under pressure. The aluminum and non-aluminum metal react directly to yield a high performance, high density sputter target containing greater than about 2% aluminum with substantially uniform composition across the body.

Abstract: A method of forming a sputter target/backing plate assembly comprises the steps of: providing a target fabricated from a first material having a coefficient of thermal expansion; providing a backing plate fabricated from a second material having a coefficient of thermal expansion; providing a block fabricated from a third material having a coefficient of thermal expansion; positioning the block on one side of the backing plate; positioning the target on the other side of the backing plate; and subjecting the target, backing plate and block to elevated temperature and pressure to bond the target, backing plate and block together. The third material is selected so as to have a coefficient of thermal expansion which counteracts the effects of the coefficients of thermal expansion of the first and second materials. The third material may be selected so as to have a coefficient of thermal expansion which is approximately the same as the coefficient of thermal expansion of the first material.