Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

Abstract: A thermal sensor package is provided. The thermal sensor package includes a carrier, an integrated circuit chip (IC), an adhesive, a thermal sensor, and a cover that are stacked form bottom to top. The carrier defines a space. The IC and thermal sensor are arranged in the space. At least one part of the adhesive is disposed between the thermal sensor and the IC. The cover closes the space defined by the carrier.

Abstract: A sensing device and a method for packaging the same are provided. The sensing device includes a lead frame, a chip, an insulated housing, a sensor, and a protector. The lead frame includes a first surface, a second surface opposite to the first surface, a first die-bonding area and a plurality of wire bonding areas of the lead frame disposed on the first surface, and a second die-bonding area disposed on the second surface. The chip is disposed in the first die-bonding area and is electrically connected to the plurality of wire bonding areas of the lead frame. The insulated housing covers the chip and a portion of the lead frame. The sensor is disposed on the second die-bonding area of the lead frame, and the protector is disposed on the sensor.

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Abstract: A light-emitting diode package structure, a light-emitting device and a method of making the same are provided. The light-emitting diode package structure includes an insulating base, a first conductive unit, a second conductive unit and at least one light-emitting diode chips. The first conductive unit is disposed on the insulating base. The second conductive unit is disposed on the insulating base and separated from the first conductive unit. The at least one light-emitting diode chips is electrically connected to the first conductive unit and the second conductive unit. Further, the first conductive unit has a first groove, and an outer surface thereof is divided by the first groove into two separated parts. In addition, the second conductive unit has a second groove, and the outer surface thereof is divided by the second groove into two separated parts.

Abstract: The instant disclosure relates to a proximity sensor having an electro-less plated optical shielding structure. The sensor includes a substrate panel having an emitter region and a receiver region; an emitter unit disposed on the emitter region and configured to emit electromagnetic signals at a particular wavelength; a receiver unit disposed on the receiver region and configured to respond to electromagnetic signals emitted by the emitter unit; a transparent molding unit disposed on the emitter region and the receiver region of the substrate panel; and an optical shielding layer selectively disposed on the external surfaces of the substrate panel and the transparent molding unit. The shielding layer has corresponding sensor ports for the emitter and the receiver units arranged toward a designated detection region. The electro-less plated optical shielding layer is highly configurable through proper masking and small in thickness, enabling further miniaturization of the sensor unit.

Abstract: Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter die is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

Abstract: Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising outer sidewalls, a first recess, a second recess and a partitioning divider disposed between the first and second recesses. The transmitter doe is positioned in the first recess, the receiver die is positioned within the second recess, and at least the partitioning divider of the housing comprises liquid crystal polymer (LCP) such that infrared light internally-reflected within the housing in the direction of the partitioning divider is substantially attenuated or absorbed by the LCP contained therein.

Abstract: An apparatus having a die, a carrier, and a plurality of shielding wires. The die has a top surface through which EMI is received. The carrier has a first surface on which the die is mounted by attaching the die to the first surface using a surface of the die other than the top surface. The carrier also includes a plurality of electrical traces, the die being connected to two of the traces. The shielding wires cross the top surface of the die and are connected to a shielding trace in the carrier. The shielding trace is held at a constant potential. The shielding wires are positioned such that the EMI received by the die is reduced below the level that would be received without the shielding wires. The die could include a light detector.

Abstract: An optical transceiver includes a substrate having first and second sides. A light emitter mounted to the first side. A light receiver is mounted to the first side and comprises a dielectric totally internally reflecting concentrator directing light to a photodetector. Amplification circuits are mounted to the second side and are electrically connected to the light emitter and the light receiver through the substrate. The light emitter and the light receiver are housed in separate molded housings. A DTIRC is used to provide a good link distance and a wide field of view.

Abstract: According to at least one embodiment of the invention, a method includes mounting a transmitting device and a receiving device on a circuit board, wherein the circuit board includes a layer that blocks waves (e.g., light waves) emitted from the transmitting device, and wherein the transmitting device and the receiving device are mounted in an area defined by the layer. The method further includes manipulating a structure to form a first compartment for the transmitting device and a second compartment for the receiving device, wherein the compartments are separated by a common wall such that each compartment is continuous with at least part of the common wall. The method further comprises mounting the structure on the circuit board.

Abstract: An optical transceiver device combines the functions of IrDa-compliant infrared transceivers and remote control devices. A receiver of the transceiver allows the remote control facilities of the transceiver to encompass bidirectional remote control capabilities. The first transmitter and the first receiver can be used for IrDA-compliant infrared communications, and the second transmitter and the first receiver can be used for remote control applications. A first frequency band for IrDA-compliant communications is approximately 805 nm to 900 nm, and a second frequency band for remote control communications is approximately 915 nm to 965 nm. The receiver designed for receiving signals in the first frequency band is not particularly selective and, as a result, is able to detect remote control signals transmitted in the second frequency band.

Abstract: A leadless lead frame electronic package (LLP) includes a lead frame of thermally-and-electrically conductive material encapsulated in an encapsulation of electrically-insulating material to define a planar mounting surface including an exposed web of encapsulation forming a portion of the planar mounting surface. The lead frame includes parallel internal and external planar surfaces with the external surface defining a recessed C-shaped channel therein for receiving the web of encapsulation. The external planar surface of the lead frame remains exposed through the encapsulation adjacent the web, with the web and the external planar surface adjacent the web extending generally co-planar with the mounting surface. The encapsulation is a transparent material forming a lens. The internal surface of the lead frame may include an attachment site for an optical component, with the lens being aligned with the attachment site for the optical component.