Abstract: A heat transfer device is disclosed that includes a plurality of electrodes that direct droplets to and from a hot spot to transfer heat from the hot spot to a filler fluid surrounding the droplet.

Abstract: A microchannel heat sink as well as method includes one or more microchannels through which a working fluid flows to remove heat from a heat-generating component, such as a microelectronic chip, and one or more recesses disposed in a surface communicated to the one or more of the microchannel to enhance heat transfer rate of the microchannel heat sink. The recesses can be located in a surface of a cover that closes off the microchannels. The one or more recesses can be located at one or more local hot spot regions to enhance heat transfer rates at the local regions as well as overall heat removal rate of the heat sink.

Abstract: A micropump including one or more microchannels for receiving a fluid and a plurality of electrodes arranged on a diaphragm and energized in a manner to provide an enhanced electrohydrodynamic flow of fluid through the one or more microchannels. The micropump may be used for pumping a working fluid for removing heat from a heat-generating electronic component or for delivery of a drug, medicine, or other treatment agent as or in a fluid to a patient.

Abstract: A gaseous fluid microscale pump device and method for creating a flow of gaseous heat transfer fluid, such as air, wherein the pump device includes an ion generating region including one or more electron-emitting cathode electrodes for generating unipolar ions in the fluid, and a pumping region disposed downstream of the ion generating region and including pumping electrodes for generating an electric field in a manner that imparts motion to the ions and thus the heat transfer fluid relative to a heat-generating electronic component.