Abstract: Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electrical performance of the interconnects without compromising mechanical reliability. The compliance of the interconnects varies from the center of the substrate to edges of the substrate. The variation in compliance can either be step-wise or continuous. Exemplary low-compliance interconnects include columnar interconnects and exemplary high-compliance interconnects include helix interconnects. A cost-effective implementation using batch fabrication of the interconnects at a wafer level through sequential lithography and electroplating processes may be employed.

Abstract: Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.

Abstract: Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.

Abstract: Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.

Abstract: Disclosed are apparatus comprising single-path and multiple-path compliant interconnects that are coupled between electrical contacts and that allow for increased electrical performance without compromising mechanical reliability. Exemplary apparatus comprises a conductive vertical anchor coupled at a first end to an electrical contact; and one or more conductive arcuate beams coupled at a first end to a second end of the vertical anchor, and coupled at a second end to a second electrical contact. One electrical contact comprises a die contact pad and the other electrical contact comprises a substrate contact pad. Alternatively, one electrical contact comprises a substrate contact pad and the other electrical contact comprises a printed circuit board contact pad. Also, one electrical contact comprises a die contact pad and the other electrical contact comprises a printed circuit board contact pad. Methods of fabricating the apparatus are also disclosed.

Abstract: Disclosed is a variable interconnect geometry formed on a substrate that allows for increased electrical performance of the interconnects without compromising mechanical reliability. The compliance of the interconnects varies from the center of the substrate to edges of the substrate. The variation in compliance can either be step-wise or continuous. Exemplary low-compliance interconnects include columnar interconnects and exemplary high-compliance interconnects include helix interconnects. A cost-effective implementation using batch fabrication of the interconnects at a wafer level through sequential lithography and electroplating processes may be employed.

Abstract: A multi-axis compliance spring includes at least an anchor portion attached to a surface of a substrate and a free portion detached from the substrate. The free portion includes at least one first section having at least one curvature originating from an internal stress in the free portion and a second section having at least one second curvature defined in a plane of the substrate prior to being detached from the free portion of the substrate.

Abstract: Electronic packages having compliant off-chip interconnects and methods of fabricating compliant off-chip interconnects are disclosed. A representative electronic package includes a substrate and a free-standing compliant off-chip interconnect. The free-standing compliant off-chip interconnect includes a first free-standing arcuate structure that is substantially parallel to the substrate. In addition, the method of fabricating free-standing arcuate structure compliant off-chip interconnects includes: depositing an arcuate structure compliant off-chip interconnect material; and forming the free-standing arcuate structure compliant off-chip interconnect.

Abstract: A multi-axis compliance spring includes at least an anchor portion attached to a surface of a substrate and a free portion detached from the substrate. The free portion includes at least one first section having at least one curvature originating from an internal stress in the free portion and a second section having at least one second curvature defined in a plane of the substrate prior to being detached from the free portion of the substrate.

Abstract: Electronic packages having compliant off-chip interconnects and methods of fabricating compliant off-chip interconnects are disclosed. A representative electronic package includes a substrate and a free-standing compliant off-chip interconnect. The free-standing compliant off-chip interconnect includes a first free-standing arcuate structure that is substantially parallel to the substrate. In addition, the method of fabricating free-standing arcuate structure compliant off-chip interconnects includes: depositing an arcuate structure compliant off-chip interconnect material; and forming the free-standing arcuate structure compliant off-chip interconnect.