Patents by Inventor Suresh Ramlingam

Suresh Ramlingam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LOW INSERTION LOSS PACKAGE PIN STRUCTURE AND METHOD
    Publication number: 20150222033
    Abstract: An apparatus for placement between a package and an integrated circuit board includes: an insert having: a substrate having a top side and a bottom side; a first set of pads at the top side of the substrate; a second set of pads at the bottom side of the substrate; and a plurality of vias in the substrate, the vias connecting respective pads in the first set to respective pads in the second set; wherein the insert has a thickness that is less than a spacing between the package and the integrated circuit board.
    Type: Application
    Filed: February 6, 2014
    Publication date: August 6, 2015
    Applicant: Xilinx, Inc.
    Inventors: Paul Y. Wu, Sarajuddin Niazi, Raymond E. Anderson, Suresh Ramlingam