Abstract: Password-less authentication and login onto an application are disclosed. A processor extracts Digital Driver's License (DDL) data from a user's computing device; extracts the DDL data of the user from an external database (i.e., DMV); validates the DDL data by comparing with the DDL data from the external database; creates, in response to validating, a DDL secret private key; allows successful registration of the computing device to utilize DDL data for login; and stores the DDL secret private key onto an internal database and a secured environment of the computing device. At login request by the user, when the processor determines that the computing device is successfully registered, it validates the DDL secret private key by comparing with data from the internal database; creates a new DDL secret private key and updates the internal database and the secured environment with the new DDL secret private key for subsequent login.

Abstract: A Transport Layer Security (TLS) handshake can be terminated early—i.e., before certificate validation—to reduce server-side demand, which can be particularly advantageous in counteracting Denial-of-Service (DOS) attacks and the like. To this end, an endpoint may provide a one-time password (OTP) in the client hello message during the initial steps of a TLS handshake or similar connection protocol. A gateway, upon receiving the client hello message, may generate its own OTP for comparison with the OTP in the client hello message. The endpoint and gateway may advantageously generate the OTP based on a secret provided by a threat management facility with a preexisting secure connection to the two entities. If the OTP provided in the client hello message and the OTP generated on the gateway are the same, then the TLS handshake may continue; otherwise, the Transmission Control Protocol (TCP) connection will be terminated by the gateway.

Abstract: A repository of replicated chunk files is analyzed to identify chunk files that meet at least a portion of combination criteria. Selected chunk files are associated together under a data protection grouping container. Erasure coding is applied to the data protection grouping container including by utilizing the selected chunk files as different data stripes of the erasure coding and generating one or more parity stripes based on the different data stripes.

Abstract: A zero trust network access (ZTNA) system provides secure access to applications hosted on a customer premises. The ZTNA system is modified to facilitate distributed and/or cloud-based deployments of components for a control plane and a data plane that cooperate to support a network-accessible front end for the customer's locally hosted applications. A customer-side connector can be further simplified for deployment by moving ZTNA components for, e.g., secure tunneling, authorization, and authentication into the cloud-based infrastructure, and by managing deployment and configuration of the connector through a threat management facility for the customer premises.

Abstract: In a cloud-based data plane for a zero trust network access system, a service proxy manages incoming user requests for access to ZTNA applications. A load balancer may be configured to retrieve connection information from the data plane such as connection counts, tunnel distributions, and so forth, and to use this information to provide load balancing information to the service proxy, so that the service proxy can specify a route to the customer premises through the data plane. Secure tunnels to a customer premises can also be scaled according to traffic using tunnel information available within the data plane. In one aspect, tunnels can be scaled up by checking for connections and only adding a new tunnel when existing tunnels are full. In another aspect, tunnels can be scaled down by removing existing connections as they are taken down by users, and timing out connections that exceed a timeout window.

Abstract: In order to efficiently manage a secure tunnel between a zero trust network access (ZTNA) connector (on the customer premises hosting a ZTNA application) and a cloud-based ZTNA data plane, tunnel components such as a WebSocket server can be run on the cloud platform that is hosting the data plane. As a significant advantage, this can simplify customer ZTNA deployments by permitting a reduction in the size and complexity of the ZTNA connector that is deployed to the customer premises.

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a thermally conductive material (TCM) to improve thermal energy storage and heat dissipation to improve a data transfer rate. The TCM surrounds the set of memory components and the processing device and is configured to dissipate heat from the processing device and the set of memory components.

Abstract: A vehicular control system includes a forward-viewing camera and a forward-sensing radar sensor disposed at a vehicle. Image data captured by the forward-viewing camera is processed at an advanced driver-assistance system (ADAS) and radar data captured by the forward-sensing radar sensor is processed at the ADAS ECU. As the vehicle travels along a road, and at least in part via processing at the ADAS ECU of (i) image data captured by the forward-viewing camera and (ii) radar data captured by the forward-sensing radar sensor, the ADAS ECU determines presence of a pothole or road debris or a speed bump ahead of the vehicle. Responsive to communication of the determined presence of the pothole or road debris or speed bump to another ECU of the vehicle, at least one selected from the group consisting of (i) the vehicle decelerates to mitigate impact and (ii) the vehicle is steered to avoid impact.

Abstract: A gateway performs silent authentication refreshes with an identity management platform in order to extend the expiration of a cookie provided to an endpoint that accesses network applications through the gateway.

Abstract: In order to use zero trust network resources distributed across multiple gateways, an agent is deployed on an endpoint of an enterprise network. The agent maps requests for specific applications to corresponding gateways. The agent may also multiplex or otherwise aggregate communications among different network applications and gateways in order to provide seamless, transparent access to the distributed resources at a single endpoint, and/or within a single interface.

Abstract: An example computer system for migration of information can include: one or more processors; and non-transitory computer-readable storage media encoding instructions which, when executed by the one or more processors, causes the computer system to create: a synchronization module programmed to migrate data from a source data store to a target data store, wherein the synchronization module is configured to control how much of the data is migrated; and a validation module programmed to validate the data between the source data store and the target data store.

Abstract: Exemplary methods, apparatuses, and systems include an environmental operations manager for controlling memory access of the memory device. The environmental operations manager receives a set of data bits for programming to a memory location. The environmental operations manager receives environmental condition data. The environmental operations manager delays programming of the set of data bits to the memory location and writing the set of data bits to a buffer location in response to determining that the environmental condition data satisfies a threshold.

Abstract: Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.

Abstract: A number of embodiments of the present disclosure include an solid state drive (SSD) enclosure comprising a first component, wherein the first component is configured to cover a first side of an SSD, a second component; and a third component, wherein the third component is configured receive the second component, wherein the third component is configured to be releasably coupled to the second component, and wherein the second component and the third component are configured to cover a second side of the SSD.

Abstract: A semiconductor device assembly is provided that includes a cooling system. The semiconductor device assembly includes a semiconductor die assembled onto a substrate. A channel is disposed at a back side of the semiconductor die to enable fluid to flow through the channel and cause heat to transfer from the semiconductor die to the fluid. The fluid is received through an inlet to enable the fluid to be flowed through the channel. After the fluid is flowed through the channel, the fluid is expelled through an outlet. In this way, a compact and effective cooling system for a semiconductor device assembly may be implemented.

Abstract: Methods, systems, and devices for thermal isolation for memory systems are described. The enclosed heatsink architectures may impede heat transfer from a first group of components to a second group components. Some examples include a partition (an air gap or other thermally insulating material) between multiple heatsinks. The heatsinks may each have heat transfer elements with various structures. In some examples, a first heatsink may overlap a second heatsink. The overlapping architecture may increase the size of the heatsink corresponding to the first set of components and increase their rate of heat exchange. In some examples, the heatsink architecture may include upper heatsinks and lower heatsinks. The enclosed heatsink architectures may reduce device overheating and time spent in thermal throttling, as well as improve the life expectancy, durability, efficiency, and performance of the memory devices. Increased efficiency in cooling the device may save energy costs.

Abstract: A system with a circuit with components, an enclosure with a top and a bottom, and a heat transfer device. The heat transfer device has an exterior surface with a first portion, a second portion, and a third portion, where the first portion faces opposite the second portion; and an interior surface with a fourth portion, a fifth portion, and a sixth portion, where the fourth portion faces the fifth portion. The first portion configured to thermally couple to the top of the enclosure. The second portion configured to thermally couple to the bottom of the enclosure. The fourth portion configured to couple to a component mounted on a primary side of the circuit board. The fifth portion configured to face a secondary side of the circuit board. The first heat transfer device configured to distribute thermal energy generated from a component to the top and bottom of the enclosure.

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a triangular shaped metal bracket to improve heat dissipation to improve a data transfer rate. The triangular shaped metal bracket being physically attached to an edge of the PCB at a base portion of the triangular shaped metal bracket. The triangular shaped metal bracket is thermally coupled to the set of memory components and the processing device of the PCB via the base portion along with a heat spreader on a primary and secondary side of the bracket. The triangular shaped metal bracket being configured to dissipate heat from the processing device and the set of memory components to at least a host device through a vertex portion of the triangular shaped metal bracket.

Abstract: Aspects of the present disclosure configure a memory sub-system processor to use a fin stack to improve heat dissipation to improve a data transfer rate. The processor measures temperature of at least one of the processing device or the set of memory components. The processor accesses a reference temperature for controlling data transfer rate between a host and the set of memory components. The processor compares the measured temperature with the reference temperature and, based on the comparison, adjusts the data transfer rate based on comparing the measured temperature with the reference temperature.

Abstract: A cloud computing platform provides zero trust network access as a service to a customer that maintains an application on-premises. In this context, the customer may be required to demonstrate ownership of a domain before the cloud computing platform will provide access to the on-premises application via the domain.