Abstract: A semiconductor device vertically mounted on a medium such as a printed circuit board, and a method of its manufacture, are disclosed. The semiconductor device includes a stack of semiconductor die having contact pads which extend to an active edge of the die aligned on one side of the stack. The active edges of the die are affixed to the PCB and the contact pads at the active edge are electrically coupled to the PCB. This configuration provides an optimal, high density arrangement of semiconductor die in the device, where a large number of semiconductor die can be mounted and electrically coupled directly to the PCT, without a substrate, without staggering the semiconductor die, and without using wire bonds.

Abstract: A semiconductor device vertically mounted on a medium such as a printed circuit board, and a method of its manufacture, are disclosed. The semiconductor device includes a stack of semiconductor die having contact pads which extend to an active edge of the die aligned on one side of the stack. The active edges of the die are affixed to the PCB and the contact pads at the active edge are electrically coupled to the PCB. This configuration provides an optimal, high density arrangement of semiconductor die in the device, where a large number of semiconductor die can be mounted and electrically coupled directly to the PCT, without a substrate, without staggering the semiconductor die, and without using wire bonds.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: Apparatuses, systems, methods, and computer program products are disclosed for preventing overheating, for annealing non-volatile memory. An apparatus may include an array of non-volatile storage elements. A heating element may be configured to heat a first set of the non-volatile storage elements to anneal the first set of non-volatile storage elements. A heat shield or cooling element may be configured to prevent a second set of the non-volatile storage elements from overheating during annealing of the first set of non-volatile storage elements, to mitigate data errors for data stored on the second set of non-volatile storage elements.

Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. Pillars, for example of solder, may also formed on the substrate, around the semiconductor die. The pillars are formed to a height above the substrate that is greater than the height of the substrate-mounted semiconductor die, including any wire bonds, above the substrate. A second group of one or more semiconductor die, such as flash memory die, may be affixed to the substrate, on top of the solder pillars without contacting the substrate-mounted semiconductor die.

Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.

Abstract: A low profile USB flash memory device, and methods of forming same, are disclosed. The USB flash memory device includes an integrated circuit memory portion and a USB connector. The memory portion and the USB connector may be integrally formed on the same substrate. The USB flash memory device includes a substrate on which is mounted one or more flash memory die, a controller die, passive components and an LED for indicating when the memory is being accessed. In contrast to prior art USB memory devices which used TSOP packages mounted on a printed circuit board, the semiconductor die of the present invention are affixed to the substrate and wire bonded in a SIP configuration. Omitting the encapsulated TSOP packages allows a reduction in the overall thickness of the USB flash memory device.

Abstract: In a particular embodiment, a connector includes a connector module and a set of conductive connectors coupled to the connector module. The set of conductive connectors is configured to electrically couple to a set of contacts of a memory module. The connector also includes a ground contact coupled to the connector module. The ground contact is configured to be coupled to a ground of the memory module and to a conductive shroud.

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract: A system of micro balls is disclosed for coupling an electronic component to a printed circuit board. The micro balls have a small diameter, and each contact pad may include an array of two or more micro balls. An example of a micro ball may include a polymer core, surrounded by a copper layer, which is in turn surrounded by a layer of solder.

Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A system of micro balls is disclosed for coupling an electronic component to a printed circuit board. The micro balls have a small diameter, and each contact pad may include an array of two or more micro balls. An example of a micro ball may include a polymer core, surrounded by a copper layer, which is in turn surrounded by a layer of solder.

Abstract: A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted.

Abstract: A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.

Abstract: Methods of forming integrated circuit packages having an LED molded into the package, and the integrated circuit package formed thereby. An integrated circuit including one or more semiconductor die, passive components and an LED may be assembled on a panel. The one or more semiconductor die, passive components and LED may all then be encapsulated in a molding compound, and the integrated circuits then singularized to form individual integrated circuit packages. The integrated circuits are cut from the panel so that a portion of the lens of the LED is severed during the singularization process, and an end of the lens remaining within the package lies flush with an edge of the package to emit light outside of the package.