Abstract: Systems and methods for decoratively coating a substrate are disclosed wherein the ink is diffused into the substrate, as opposed to onto the substrate. Substrates are able to comprise metals, plastics, bamboo, wood, glass, and metals wherein such materials can also be pre-coated. A system for transferring a decorative image to a substrate comprises a chamber configured to receive a substrate, a means for securing a transfer medium containing the decorative image to be transferred, an optional vacuum source coupled to the chamber, and a heat source removably coupled to the chamber. The transfer is positioned face down onto a surface of the substrate, secured into position. The vacuum source may be used to evacuate the chamber to more tightly pull the transfer medium to the substrate. Then the substrate and transfer are heated, and the transfer medium ink diffuses into the substrate, thereby diffusing the image into the substrate.

Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.

Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.

Abstract: A device enclosure includes a clad metal shell having a plurality of mounting structures attached thereto. Methods for manufacturing the device enclosure are also disclosed. In a particular method, the mounting structures are formed on a surface of the clad metal shell by nano molding technology. Alternatively, the mounting structures are formed by molding before being attached to the clad metal shell by an adhesive.

Abstract: An electronic device enclosure includes a first structural layer having a first surface and a second surface. A decorative feature is formed on the first surface of the first structural layer. The enclosure further includes a second structural layer, which is formed directly on the first surface of the first structural layer. The second structural layer is formed over the decorative feature by an overmolding process.

Abstract: Systems and methods for decoratively coating a substrate are disclosed wherein the ink is diffused into the substrate, as opposed to onto the substrate. Substrates are able to comprise metals, plastics, bamboo, wood, glass, and metals wherein such materials can also be pre-coated. A system for transferring a decorative image to a substrate comprises a chamber configured to receive a substrate, a means for securing a transfer medium containing the decorative image to be transferred, an optional vacuum source coupled to the chamber, and a heat source removably coupled to the chamber. The transfer is positioned face down onto a surface of the substrate, secured into position. The vacuum source may be used to evacuate the chamber to more tightly pull the transfer medium to the substrate. Then the substrate and transfer are heated, and the transfer medium ink diffuses into the substrate, thereby diffusing the image into the substrate.