Abstract: A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect.

Abstract: A method and system to control power consumption of a display system includes using a low power display and a normal power display. The low power display may be a reflective display and may be used when the environment is bright. The normal power display may be a transmissive display and may be used when the environment is not as bright.