Abstract: There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated sufficient resources without wasteful power consumption resulting from ramping up of performance through overestimating of voltage or frequency increases. Additionally, power management may be planned for longer periods, rather than looking only at immediate data to be processed and constantly fluctuating voltage and frequency. In this manner, power management can run more smoothly and efficiently compared to conventional means of power management that ignore data from a scheduler when determining power management policy.

Abstract: There is provided a semiconductor package configured for externally controlled power management. Instead of integrating voltage regulation on-chip as done conventionally, power regulation is moved externally to the PCB level, providing numerous package advantages including size, simplicity, power efficiency, integration flexibility, and thermal dissipation. In particular, the use of flip-chip package configurations provides ready access to power supply bumps, which also allows the use of a universal receiving PCB and power supply through simple reconfiguring of voltage traces. As a result, flexible power management can be implemented, and portions of semiconductor packages may be managed for performance or thermal considerations, which may be of particular use for applications such as multi-core processors.

Abstract: There is provided a method of scheduler assisted power management for semiconductor devices. By accessing and analyzing workload data for tasks to be completed, a scheduler may provide finer grained control for determining and implementing an efficient power management policy. In this manner, tasks with completion deadlines can be allocated sufficient resources without wasteful power consumption resulting from ramping up of performance through overestimating of voltage or frequency increases. Additionally, power management may be planned for longer periods, rather than looking only at immediate data to be processed and constantly fluctuating voltage and frequency. In this manner, power management can run more smoothly and efficiently compared to conventional means of power management that ignore data from a scheduler when determining power management policy.

Abstract: There is provided a semiconductor package configured for externally controlled power management. Instead of integrating voltage regulation on-chip as done conventionally, power regulation is moved externally to the PCB level, providing numerous package advantages including size, simplicity, power efficiency, integration flexibility, and thermal dissipation. In particular, the use of flip-chip package configurations provides ready access to power supply bumps, which also allows the use of a universal receiving PCB and power supply through simple reconfiguring of voltage traces. As a result, flexible power management can be implemented, and portions of semiconductor packages may be managed for performance or thermal considerations, which may be of particular use for applications such as multi-core processors.

Abstract: A CMOS integrated imager system formed on a single IC having a first mode in which the system operates using on-chip logic to generate complex timing on-chip and to use that timing for operation and also having a second mode of operation in which the on-chip logic is bypassed and an external timing system is used.

Abstract: A circuit for parametric testing of I/O's including bidirectionals includes logic which ties the I/O's into a single test chain. A pulse is applied moved down the chain to test the switching levels of the input buffers and the output buffers. The circuit features the ability to program the bidirectionals as either inputs (test mode 1) or outputs (test mode 2) and so allows for its input and output buffers to be tested. The test mode can be selected simply by writing to an externally accessed data register.