Patents by Inventor Suriyakala Suriya Ramalingam

Suriyakala Suriya Ramalingam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • REMOVABLE IC PACKAGE STIFFENER
    Publication number: 20170287799
    Abstract: A stiffener, an IC package and methods of fabrication of an IC package including a removable stiffener are shown. A removable stiffener for use with an integrated circuit (IC), including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Such a removable stiffener including at least one removal tab is shown. An IC package including a removable stiffener including a plurality of adhesive portions disposed between a surface of the stiffener and a surface of a substrate of the IC is shown. Methods of fabrication of an IC package including a removable stiffener are shown.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Steven A. Klein, Aditya S. Vaidya, Vijay Krishnan Subramanian, Santosh Sankarasubramanian, Pramod Malatkar, Suriyakala Suriya Ramalingam, Ashish Dhall
  • Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
    Patent number: 9640415
    Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: May 2, 2017
    Assignee: Intel Corporation
    Inventors: Randall D Lowe, Jr., Suriyakala Suriya Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora
  • ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PACKAGES AND ITS EXTENDIBILITY AS A BARRIER MATERIAL FOR THERMAL AND SEALANT MATERIALS
    Publication number: 20150166804
    Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.
    Type: Application
    Filed: December 1, 2014
    Publication date: June 18, 2015
    Inventors: Randall D. Lowe, JR., Suriyakala Suriya Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, JR., Arjun Krishnan, Hitesh Arora
  • Robust ink formulations for durable markings on microelectronic packages and its extendibility as a barrier material for thermal and sealant materials
    Patent number: 8900919
    Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: December 2, 2014
    Assignee: Intel Corporation
    Inventors: Randall D. Lowe, Jr., Suriyakala Suriya Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, Jr., Arjun Krishnan, Hitesh Arora
  • ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PACKAGES AND ITS EXTENDIBILITY AS A BARRIER MATERIAL FOR THERMAL AND SEALANT MATERIALS
    Publication number: 20140264957
    Abstract: Methods for covalently and indelibly anchoring a polyacrylate polymer using a UV-induced polymerization process in the presence of a photoinitiator to an oxide surface are disclosed herein. The methods and compositions prepared by the methods can be used as indelible marking materials for use on microelectronic packages and as solder and sealant barriers to prevent overspreading of liquids on the oxide surfaces of microelectronic packages. The polyacrylate polymers are covalently linked to the oxide surface by use during the printing and UV-curing process of an adhesion promoter having as a first domain an oxide-reactive silyl group, bonded via a linker to an acrylate-reactive group.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Inventors: Randall D. Lowe, JR., Suriyakala Suriya Ramalingam, Nisha Ananthakrishnan, James C. Matayabas, JR., Arjun Krishnan, Hitesh Arora