Abstract: Thermally isolating cable assemblies, systems using the assemblies, and methods for fabricating the assemblies are discussed. A cable assembly includes a first shielding cable comprising a first solderable material interleaved with a section of a second shielding cable comprising an exterior material that is a second solderable material and an inner material that is superconductive at and below a critical temperature. The cable assembly may be fabricated during the assembly of an apparatus, and, following assembly of the apparatus, a segment of the second shielding cable is etched to expose a portion of the inner material. Following fabrication of the cable assemblies, the apparatus may be installed in a cryogenic environment in which the inner material may be operable as a superconductor and may thermally isolate the cabling assembly distal to the exposed portion to reduce heat load to a superconducting circuit.

Abstract: A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.

Abstract: A method of fabricating a multilayer superconducting printed circuit board comprises first, forming a bimetal foil to overlie a substrate, the bimetal foil comprising a first layer of a first metal, a layer of a second metal, and a second layer of the first metal, and then etching the second layer of the first metal. Forming a bimetal foil to overlie a substrate may include forming a bimetal foil comprising a first layer of a normal metal, a layer of a superconducting metal, and a second layer of the normal metal. Etching the second layer of the first metal may include preparing a patterned image in the second layer of the first metal for etching, processing the patterned image through a cleaner, rinsing the patterned image, and then, immersing the patterned image in a microetch.