Abstract: Apparatus and methods are described for coupling a circuit component having piezoelectric properties, such as a ceramic capacitor, to a printed circuit board (PCB) by forming a first solder heel fillet and a second solder heel fillet that fixedly couple the circuit component to the PCB, where the first and second solder heel fillets have a height z that is less than a height h of the circuit component to reduce acoustic noise at the PCB caused by coupling the circuit component to the PCB. In various configurations, the first solder heel fillet and the second solder heel fillet can each fixedly coupled to: a bottom surface of the circuit component, a top surface of the PCB at a first solder pad and a second solder pad thereof, and a lower portion of each of a multiple side surfaces of the circuit component.

Abstract: A method of manufacturing semiconductor components (200, 400, 700) includes assembling, packaging, and testing the semiconductor components (200, 400, 700) while the semiconductor components (200, 400, 700) are mounted on an adhesive layer (220). The method of can also keep the semiconductor components (200, 400, 700) mounted on the adhesive layer (220) between each of the assembling, packaging, and testing steps.

Abstract: An electronic component (10) is formed by encasing individual components within a glass tube (20). The individual components can include a semiconductor die (11), leads (12,13), and dumets (16,17). The glass tube (20) is transparent and melts at a temperature less than other commercially available materials.