Patents by Inventor Suryadevera V. Babu

Suryadevera V. Babu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing slurries and methods for chemical mechanical polishing
    Patent number: 7186653
    Abstract: Aqueous polishing slurries for chemical-mechanical polishing are effective for polishing copper at high polish rates. The aqueous slurries according to the present invention may include soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent. Methods for polishing copper by chemical-mechanical planarization include polishing copper with low pressures using a polishing pad and a aqueous slurries including soluble salts of molybdenum dissolved in an oxidizing agent and molybdic acid dissolved in an oxidizing agent, particles of MoO3 dissolved in an oxidizing agent, and particles of MoO2 dissolved in an oxidizing agent.
    Type: Grant
    Filed: January 11, 2005
    Date of Patent: March 6, 2007
    Assignee: Climax Engineered Materials, LLC
    Inventors: Sunil Chandra Jha, Sreehari Nimmala, Sharath Hegde, Youngki Hong, Suryadevera V. Babu, Udaya B. Patri