Patents by Inventor Suryakant Patel

Suryakant Patel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11792327
    Abstract: One or more computing devices, systems, and/or methods for ringless voicemail detection are provided. In an example, a first call attempt to a phone number may be detected. In response to detecting a second call attempt to the phone number occurring within a first threshold timespan of the first call attempt being detected, first processing of the second call attempt is withheld. In response to the first call attempt being cancelled within a second threshold timespan of the first call attempt being detected, second processing of the second call attempt is performed based upon a policy.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: October 17, 2023
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jeffrey Allen Haltom, Kent Lanier Hallford, Jr., Nayankumar Suryakant Patel, Lulia Ann Barakat
  • Publication number: 20220232127
    Abstract: One or more computing devices, systems, and/or methods for ringless voicemail detection are provided. In an example, a first call attempt to a phone number may be detected. In response to detecting a second call attempt to the phone number occurring within a first threshold timespan of the first call attempt being detected, first processing of the second call attempt is withheld. In response to the first call attempt being cancelled within a second threshold timespan of the first call attempt being detected, second processing of the second call attempt is performed based upon a policy.
    Type: Application
    Filed: April 8, 2022
    Publication date: July 21, 2022
    Inventors: Jeffrey Allen Haltom, Kent Lanier Hallford, JR., Nayankumar Suryakant Patel, Lulia Ann Barakat
  • Patent number: 11303754
    Abstract: One or more computing devices, systems, and/or methods for ringless voicemail detection are provided. In an example, a first call attempt to a phone number may be detected. In response to detecting a second call attempt to the phone number occurring within a first threshold timespan of the first call attempt being detected, first processing of the second call attempt is withheld. In response to the first call attempt being cancelled within a second threshold timespan of the first call attempt being detected, second processing of the second call attempt is performed based upon a policy.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: April 12, 2022
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jeffrey Allen Haltom, Kent Lanier Hallford, Jr., Nayankumar Suryakant Patel, Lulia Ann Barakat
  • Publication number: 20180009580
    Abstract: Presented are a spout assembly, bottle and a method of forming. An exemplary spout assembly includes a tubular spout, the cylindrical spout having an endless wall defining a passage, the endless wall having a top open edge fluidly connecting the passage, a bottom open edge fluidly connecting the hollow passage, and at least three vertical ribs extending inwardly from the endless wall within the passage. The spout assembly further includes a tilted trough extending from the bottom open edge circumscribing the tubular spout, the trough having at least one opening located such that fluid flow is directed toward the at least one opening. The spout assembly still further includes a cylindrical side wall extending from the tilted trough.
    Type: Application
    Filed: July 5, 2017
    Publication date: January 11, 2018
    Inventors: Gary John Kieffer, Steven Michael Faes, Sriraj Suryakant Patel, Timothy James Walawender, Richard Royal Briggs, Dustin Bradley Dreese, Stephan Robert Crawford, Lynn Francis Knopp, Todd Daniel Lindsay, Timothy James Clark, Michael Pratt
  • Patent number: 7808798
    Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
    Type: Grant
    Filed: April 4, 2008
    Date of Patent: October 5, 2010
    Assignee: International Business Machines Corporation
    Inventors: John Michael Cotte, Brian Paul Gaucher, Janusz Grzyb, Nils Deneke Hoivik, Christopher Vincent Jahnes, John Ulrich Knickerbocker, Duixian Liu, John Harold Magerlein, Chirag Suryakant Patel, Ullrich R. Pfeiffer, Cornelia Kang-I Tsang
  • Patent number: 7518229
    Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
    Type: Grant
    Filed: August 3, 2006
    Date of Patent: April 14, 2009
    Assignee: International Business Machines Corporation
    Inventors: John Michael Cotte, Brian Paul Gaucher, Janusz Grzyb, Nils Deneke Hoivik, Christopher Vincent Jahnes, John Ulrich Knickerbocker, Duixian Liu, John Harold Magerlein, Chirag Suryakant Patel, Ullrich R. Pfeiffer, Cornelia Kang-I Tsang
  • Publication number: 20080186247
    Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
    Type: Application
    Filed: April 4, 2008
    Publication date: August 7, 2008
    Applicant: International Business Machines Corporation
    Inventors: John Michael Cotte, Brian Paul Gaucher, Janusz Grzyb, Nils Deneke Hoivik, Christopher Vincent Jahnes, John Ulrich Knickerbocker, Duixian Liu, John Harold Magerlein, Chirag Suryakant Patel, Ullrich R. Pfeiffer
  • Patent number: 7405303
    Abstract: The present invention relates to novel compounds of formula (I) with a variety of therapeutic uses, more particularly novel substituted quinoline compounds particularly useful for selective estrogen receptor modulation.
    Type: Grant
    Filed: February 22, 2005
    Date of Patent: July 29, 2008
    Assignee: SmithKline Beecham Corporation
    Inventors: William Joel Hoekstra, Aaron Bayne Miller, William John Zuercher, Harikrishna Suryakant Patel
  • Publication number: 20080029886
    Abstract: An apparatus is described incorporating an interposer having a cavity for a portion of an antenna structure, having conductor through vias, a top Si part having interconnection wiring and having pads for electrically mounting an integrated circuit chip thereon, wherein the top Si part mates with the interposer electrically and mechanically. The interposer and top Si part may be scaled to provide an array of functional units. The invention overcomes the problem of combining a high efficient antenna with integrated circuit chips in a Si package with signal frequencies from 1 to 100 GHz and the problem of shielding components proximate to the antenna and reduces strain arising from mismatching of TCEs.
    Type: Application
    Filed: August 3, 2006
    Publication date: February 7, 2008
    Applicant: International Business Machines Corporation
    Inventors: John Michael Cotte, Brian Paul Gaucher, Janusz Grzyb, Nils Deneke Hoivik, Christopher Vincent Jahnes, John Ulrich Knickerbocker, Duixian Liu, John Harold Magerlein, Chirag Suryakant Patel, Ullrich R. Pfeiffer, Cornelia Kang-I Tsang
  • Patent number: 7276787
    Abstract: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.
    Type: Grant
    Filed: December 5, 2003
    Date of Patent: October 2, 2007
    Assignee: International Business Machines Corporation
    Inventors: Daniel Charles Edelstein, Paul Stephen Andry, Leena Paivikki Buchwalter, Jon Alfred Casey, Sherif A. Goma, Raymond R. Horton, Gareth Geoffrey Hougham, Michael Wayne Lane, Xiao Hu Liu, Chirag Suryakant Patel, Edmund Juris Sprogis, Michelle Leigh Steen, Brian Richard Sundlof, Cornelia K. Tsang, George Frederick Walker
  • Publication number: 20060142411
    Abstract: A tooth whitening composition for imparting a natural white appearance to dental enamel, comprising: a whitening particulate comprising hydroxyapatite and a delivery system comprising a silicone resin and a silicone adhesive. Methods of imparting whiteness to a tooth in a mammal are also provided.
    Type: Application
    Filed: December 29, 2004
    Publication date: June 29, 2006
    Inventors: Sayed Ibrahim, Suryakant Patel, Suman Chopra, Michael Prencipe
  • Publication number: 20050069502
    Abstract: A tooth whitening system comprising a tooth whitening composition comprising a whitening agent and a hydrophobic polymer carrier. The tooth whitening composition is preferably substantially non-water soluble. The tooth whitening composition is applied to the surface of a tooth to be whitened in a mammal to effect whitening on the tooth surface. Methods of whitening a surface of a tooth are also provided.
    Type: Application
    Filed: August 12, 2004
    Publication date: March 31, 2005
    Inventors: Suman Chopra, Lynette Zaidel, Guisheng Pan, Suryakant Patel, Ryan Cameron, Michael Prencipe
  • Publication number: 20050038181
    Abstract: A stable, nonaqueous liquid tooth whitening composition comprised of an anhydrous peroxide compound dispersed in an orally acceptable hydrophobic organic material such as a silicone based pressure sensitive polymer which composition when applied topically to tooth surfaces forms an adherent layer containing the peroxide compound which peroxide compound is thereafter is released from the layer to effect tooth whitening.
    Type: Application
    Filed: August 15, 2003
    Publication date: February 17, 2005
    Inventors: Suman Chopra, Lynette Zaidel, Guisheng Pan, Suryakant Patel, Ryan Cameron, Michael Prencipe
  • Patent number: 6669930
    Abstract: A storage stable liquid peroxide whitening gel composition opacified with an organic and inorganic particles.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: December 30, 2003
    Assignee: Colgate Palmolive Company
    Inventors: Diego A. Hoic, Jobiah Sabelko, Prakasarao Mandadi, Suryakant Patel, Nagaraj Dixit, Michael Prencipe
  • Patent number: 6306371
    Abstract: An oral antiplaque composition comprising an orally acceptable vehicle and an effective antiplaque amount of silver zeolite and a stabilizing amount of a chloride salt.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: October 23, 2001
    Assignee: Colgate-Palmolive Company
    Inventors: Mike Wong, Prem Sreenivassan, Suryakant Patel, Nuran Nabi, John C. Brahms
  • Patent number: 5578293
    Abstract: An aqueous oral care composition containing a stannous ion releasing compound and a combination of a pyrophosphate salt, and an organic acid compound, the combination being present in the composition in an amount sufficient to effectively stabilize the stannous ion concentration.
    Type: Grant
    Filed: December 6, 1994
    Date of Patent: November 26, 1996
    Assignee: Colgate Palmolive Company
    Inventors: Michael Prencipe, Michael Burke, Suryakant Patel, Julie A. Miller
  • Patent number: 5487906
    Abstract: A method for the preparation of an aqueous stable premix containing a stannous ion releasing compound useful in the manufacture of an aqueous oral care composition containing a stable stannous ion releasing compound which comprises first dissolving the stannous compound in an aqueous solution of critic acid or its alkali metal salt to prepare the aqueous premix to the vehicle of the oral care composition.
    Type: Grant
    Filed: December 15, 1994
    Date of Patent: January 30, 1996
    Assignee: Colgate-Palmolive Company
    Inventors: Nagaraj Dixit, Gary Durga, Michael R. Burke, Michael Prencipe, Suryakant Patel