Abstract: A method and system for analyzing damage to a package to process a damage claim is disclosed. Each package contains one or more pieces of merchandise, internal packaging surrounding the merchandise, such as bubble sheets, and external packaging, such as an envelope or box. In accordance with the method of the present invention, the system is configured to determine the type of merchandise within a package, associate a fragility class with the merchandise, and determine the minimum packaging requirements for the merchandise by referencing one or more minimum packaging requirements matrices. Depending on the comparison of the package with the minimum packaging requirements, the present invention either approves or denies a damage claim for the package.

Abstract: A method and system for analyzing damage to a package to process a damage claim is disclosed. Each package contains one or more pieces of merchandise, internal packaging surrounding the merchandise, such as bubble sheets, and external packaging, such as an envelope or box. In accordance with the method of the present invention, the system is configured to determine the type of merchandise within a package, associate a fragility class with the merchandise, and determine the minimum packaging requirements for the merchandise by referencing one or more minimum packaging requirements matrices. Depending on the comparison of the package with the minimum packaging requirements, the present invention either approves or denies a damage claim for the package.

Abstract: A directory system for providing directory services in a communications network, including a plurality of memory segments for storing respective subsets of directory data for each directory object. The memory segments include attribute segments, object segments, and directory information tree (DIT) segments for respectively storing attribute, management, and hierarchical structure data for directory objects. The directory system monitors usage of directory data stored in the memory segments and redistributes at least a portion of the directory data in the memory segments based on the observed usage to improve the performance of directory services. The directory system also provides transactional messaging services to users.

Abstract: An ASIC type microcircuit package assembly has a die of at least about 20 millimeters square in size and utilizes as a die attach a polymeric adhesive incorporating a conductive filler. Such microcircuit package assemblies are produced by bonding the die to a substrate with the die attach, curing the die attach, and hermetically sealing the die bonded to the substrate. The microcircuit package assemblies thereby produced are characterized by stability at temperatures of up to about 360.degree. C. and under conditions of stress corresponding to a 12 pound pull following 1,000 temperature cycles between -65.degree. and 150.degree. C., and having a moisture level of less than about 5000 ppm.