Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: An apparatus including a primary device and at least one secondary device coupled to a substrate; a heat exchanger disposed on the primary device and on the at least one secondary device, wherein the heat exchanger includes at least one portion disposed over an area corresponding to the primary device or the at least one second device including a deflectable surface; and at least one thermally conductive conduit coupled to the heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including the heat exchanger including at least one floating section operable to move in a direction toward or away from at least one of the plurality of dice and at least one thermally conductive conduit disposed in a channel of the heat exchanger and connected to the at least one floating section; and coupling the heat exchanger to the multi-chip package.

Abstract: A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first passive heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second passive heat exchanger disposed on the at least one secondary device; at least one first spring operable to apply a force to the first heat exchanger in a direction of the primary device; and at least one second spring operable to apply a force to the second heat exchanger in the direction of the secondary device. A method including placing a passive heat exchanger on a multi-chip package, and deflecting a spring to apply a force in a direction of an at least one secondary device on the package.

Abstract: Embodiments of the present disclosure are directed towards a socket loading element and associated techniques and configurations. In one embodiment, an apparatus may include a loading element configured to transfer a compressive load from a heat spreader to a socket assembly, wherein the loading element is configured to form a perimeter around a die when the loading element is coupled with an interposer disposed between the die and the socket assembly and wherein the loading element includes an opening configured to accommodate the die. Other embodiments may be described and/or claimed.

Abstract: An apparatus including a primary device and at least one secondary device coupled in a planar array to a substrate; a first heat exchanger disposed on the primary device and having an opening over an area corresponding to the at least one secondary device; a second heat exchanger disposed in the opening on the at least one secondary device; at least one heat pipe coupled to the first heat exchanger and the second heat exchanger. A method including placing a heat exchanger on a multi-chip package, the heat exchanger including a first portion, a second portion and at least one heat pipe coupled to the first portion and the second portion; and coupling the heat exchanger to the multi-chip package.

Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: A gasketted thermal interface material (TIM) is described herein. The gasketted TIM includes a phase change thermal interface material and a curable thermal interface material. The curable thermal interface material surrounds the phase change thermal interface material. The gasketted TIM also includes a gasketted chamber, and the phase change thermal interface material is located within the gasketted chamber.

Abstract: A processor is described having a semiconductor chip having non volatile storage circuitry. The non volatile storage circuitry has information identifying a maximum operational frequency of the processor at which the processor's operation is guaranteed for an ambient temperature that corresponds to an extreme thermal event.

Abstract: Thermal management systems for semiconductor devices are provided. Embodiments of the invention provide two or more liquid cooling subsystems that are each capable of providing active cooling to one or more semiconductor devices, such as packaged processors. In operation, a first liquid cooling subsystem can provide active cooling to the semiconductor device(s) while the second cooling subsystem is circulating a heat transfer fluid within its own subsystem. The second liquid cooling subsystem can be then switched into operation and provides active cooling to the semiconductor device(s) while the first cooling subsystem is circulating heat transfer fluid within its own subsystem. In alternate embodiments, the heat transfer fluid remains in the subsystem, but does not circulate within the subsystem when the subsystem is not providing cooling to the semiconductor device(s). The subsystems comprise heat dissipation units.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: An apparatus may include an integrated circuit die having a plurality of temperature sensors and a control unit integrated thereon. The control unit can calculate an average die temperature based on readings from the plurality of temperature sensors, compare the average die temperature to a specification temperature and control an off-die cooling system based on the comparison.

Abstract: Disclosed are a hot plug method and a hot plug cartridge assembly for a card component (e.g., peripheral component interconnect compliant card). The cartridge assembly includes a carrier, a holder for the card component and a lever, the holder and lever being movably retained on the carrier. The lever has a camming surface, and the carrier has a protrusion following on the camming surface. Due to the configuration and positioning of the camming surface, lateral motion of the lever causes vertical movement of the lever and holder, to cause vertical movement of the card component. Lateral motion of the lever after introduction of the cartridge assembly into a system causes the card component to move vertically to cause connector structure of the card component to enter into contact with connectors of a circuit board of the system.