Abstract: A method of reducing the planarization defects produced during the manufacture of semiconductor devices. A sacrificial layer, having defects produced during a interconnection feature planarization step, is removed prior to the formation of subsequent layers to reduce the replication of unwanted defects.

Abstract: An air jet assembly supported over a polishing pad provides for raising flattened fibers pressed down by the polishing of semiconductor wafers and for blowing spent polishing materials and by-products off the pad. The polishing pad is supported on a rotatable platen and includes fibers which normally extend substantially perpendicular to an upper surface of the polishing pad. The fibers are coated with chemicals for polishing the surface of semiconductor wafers during the chip fabrication process. The fibers of the polishing pad tend to flatten down against the platen during the polishing process and spent polishing materials and by-products become embedded in the fibers of the pad. The air jet assembly is supported over the pad and includes an elongated pipe having an inlet port and a plurality of output ports. The inlet port is coupled to an air supply which forces air into the pipe and out through the outlet ports.