Patents by Inventor Susan Huang

Susan Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11408889
    Abstract: Provided herein are diagnostic antibodies that bind to glucocorticoid-induced tumor necrosis factor receptor (GITR). Such antibodies are useful for methods of detecting the expression of GITR in biological samples, for example, tumor tissue, and identifying a cancer patient likely to respond to anti-GITR immunotherapy or predicting whether a cancer patient will respond to anti-GITR immunotherapy.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: August 9, 2022
    Assignee: BRISTOL-MYERS SQUIBB COMPANY
    Inventors: Xi-Tao Wang, Olufemi A. Adelakun, Anne C. Lewin, Alan J. Korman, Mark J. Selby, Changyu Wang, Haichun Huang, Karla A. Henning, Nils Lonberg, Mohan Srinivasan, Michelle Minhua Han, Guodong Chen, Richard Y. Huang, Indrani Chakraborty, Susan Chien-Szu Wong, Huiming Li
  • Patent number: 10199516
    Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.
    Type: Grant
    Filed: July 8, 2017
    Date of Patent: February 5, 2019
    Assignee: International Business Machines Corporation
    Inventors: Brett Caroline Baker-O'Neal, Shu-Yun Chong, John Michael Cotte, Ronald Dean Goldblatt, Jeffrey Hedrick, Qiang Huang, Susan Huang, Laura Louise Kosbar, Rob Steeman, Roland Yudadibrata Utama
  • Publication number: 20170309760
    Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.
    Type: Application
    Filed: July 8, 2017
    Publication date: October 26, 2017
    Inventors: Brett Caroline Baker-O'Neal, Shu-Yun Chong, John Michael Cotte, Ronald Dean Goldblatt, Jeffrey Hedrick, Qiang Huang, Susan Huang, Laura Louise Kosbar, Rob Steeman, Roland Yudadibrata Utama
  • Patent number: 9716192
    Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: July 25, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Brett Caroline Baker-O'Neal, Shu-Yun Chong, John Michael Cotte, Ronald Dean Goldblatt, Jeffrey Hedrick, Qiang Huang, Susan Huang, Laura Louise Kosbar, Rob Steeman, Roland Yudadibrata Utama
  • Patent number: 9648728
    Abstract: A coreless organic substrate in which a mounting hole is formed near each corner of the substrate and is used during assembly processes to secure the substrate so as to prevent flexing.
    Type: Grant
    Filed: January 21, 2015
    Date of Patent: May 9, 2017
    Assignee: Altera Corporation
    Inventors: Vincent Hool, Susan Huang
  • Publication number: 20150325716
    Abstract: Photovoltaic devices are formed with electroplated metal grids that are effectively adhered to the devices. Metal-rich silicides, such as nickel silicides, are formed on the devices by annealing. The metal used in the anneal exhibits low stress. Annealing may be conducted in ambient air followed by removal of oxide and excess metal from the metal-rich silicide. Laser patterning of the antireflective coating of the devices can be used to expose the emitter to form front grid contacts. Doping of the emitter in the patterned region can be increased during laser patterning. The ratio of the centerline to centerline pitch per laser width is controlled to ensure sufficient adhesion of subsequently plated busbars.
    Type: Application
    Filed: March 19, 2015
    Publication date: November 12, 2015
    Inventors: Brett Caroline Baker-O'Neal, Shu-Yun Chong, John Michael Cotte, Ronald Dean Goldblatt, Jeffrey Hedrick, Qiang Huang, Susan Huang, Laura Louise Kosbar, Hwee Meng Lam, Christian Lavoie, Xiaoyan Shao, Rob Steeman
  • Publication number: 20150280022
    Abstract: Photovoltaic devices are formed by laser drilling vias through silicon substrates and, following surface preparation of the via sidewalls, plating a continuous, electrically conductive layer on the via sidewalls to electrically connect the emitter side of the cell with the back side of the cell. The electrically conductive layer can be formed on portions of a base emitter within the vias and on the back side of the substrate. Alternatively, the electrically conductive layer can be formed on a passivation layer on the via sidewalls and back side of the cell.
    Type: Application
    Filed: March 19, 2015
    Publication date: October 1, 2015
    Inventors: Brett Caroline Baker-O'Neal, Shu-Yun Chong, John Michael Cotte, Ronald Dean Goldblatt, Jeffrey Hedrick, Qiang Huang, Susan Huang, Laura Louise Kosbar, Rob Steeman, Roland Yudadibrata Utama
  • Publication number: 20150124425
    Abstract: An apparatus may be provided. The apparatus may comprise a core and a covering material disposed on a portion of the core. At least one opening may be disposed in the core. The at least one opening may expose at least one interior surface on the core. The at least one interior surface may be devoid of the covering material.
    Type: Application
    Filed: November 6, 2013
    Publication date: May 7, 2015
    Applicant: Cisco Technology, Inc.
    Inventors: Jing An, Luli Gong, Hua Yang, Hailong Zhang, Dewen Xu, Susan Huang, Mandy Hin Lam
  • Patent number: 8962374
    Abstract: A stack of a first anti-reflective coating (ARC) layer and a titanium layer is formed on a front surface of a semiconductor substrate including a p-n junction, and is subsequently patterned so that a semiconductor surface is physically exposed in metal contact regions of the front surface of the semiconductor substrate. The remaining portion of the titanium layer is converted into a titania layer by oxidation. A metal layer is plated on the metal contact regions, and a copper line is subsequently plated on the metal layer or a metal semiconductor alloy derived from the metal layer. A second ARC layer is deposited over the titania layer and the copper line, and is subsequently patterned to provide electrical contact to the copper line.
    Type: Grant
    Filed: June 27, 2012
    Date of Patent: February 24, 2015
    Assignee: International Business Machines Corporation
    Inventors: Satyavolu S. Papa Rao, Kathryn C. Fisher, Harold J. Hovel, Qiang Huang, Susan Huang, Young-Hee Kim
  • Patent number: 8946844
    Abstract: A stack of a first anti-reflective coating (ARC) layer and a titanium layer is formed on a front surface of a semiconductor substrate including a p-n junction, and is subsequently patterned so that a semiconductor surface is physically exposed in metal contact regions of the front surface of the semiconductor substrate. The remaining portion of the titanium layer is converted into a titania layer by oxidation. A metal layer is plated on the metal contact regions, and a copper line is subsequently plated on the metal layer or a metal semiconductor alloy derived from the metal layer. A second ARC layer is deposited over the titania layer and the copper line, and is subsequently patterned to provide electrical contact to the copper line.
    Type: Grant
    Filed: February 28, 2013
    Date of Patent: February 3, 2015
    Assignee: International Business Machines Corporation
    Inventors: Satyavolu S. Papa Rao, Kathryn C. Fisher, Harold J. Hovel, Qiang Huang, Young-hee Kim, Susan Huang
  • Publication number: 20140000693
    Abstract: A stack of a first anti-reflective coating (ARC) layer and a titanium layer is formed on a front surface of a semiconductor substrate including a p-n junction, and is subsequently patterned so that a semiconductor surface is physically exposed in metal contact regions of the front surface of the semiconductor substrate. The remaining portion of the titanium layer is converted into a titania layer by oxidation. A metal layer is plated on the metal contact regions, and a copper line is subsequently plated on the metal layer or a metal semiconductor alloy derived from the metal layer. A second ARC layer is deposited over the titania layer and the copper line, and is subsequently patterned to provide electrical contact to the copper line.
    Type: Application
    Filed: February 28, 2013
    Publication date: January 2, 2014
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Satyavolu S. Papa Rao, Kathryn C. Fisher, Harold J. Hovel, Qiang Huang, Young-hee Kim, Susan Huang
  • Publication number: 20140000691
    Abstract: A stack of a first anti-reflective coating (ARC) layer and a titanium layer is formed on a front surface of a semiconductor substrate including a p-n junction, and is subsequently patterned so that a semiconductor surface is physically exposed in metal contact regions of the front surface of the semiconductor substrate. The remaining portion of the titanium layer is converted into a titania layer by oxidation. A metal layer is plated on the metal contact regions, and a copper line is subsequently plated on the metal layer or a metal semiconductor alloy derived from the metal layer. A second ARC layer is deposited over the titania layer and the copper line, and is subsequently patterned to provide electrical contact to the copper line.
    Type: Application
    Filed: June 27, 2012
    Publication date: January 2, 2014
    Applicant: International Business Machines Corporation
    Inventors: Satyavolu S. PAPA RAO, Kathryn C. FISHER, Harold J. HOVEL, Qiang HUANG, Susan HUANG, Young-Hee KIM
  • Publication number: 20100187872
    Abstract: A bicycle seat includes a substantially horizontally extending seat portion and a monolithic metallic rail is connected to an underside of the seat portion so as to be connected with the guide on the top end of the seat post. The monolithic rail includes a connection portion, a rear portion and a front portion. The rear portion includes two extension rods which are connected to the rear end of the seat portion. The front portion is connected to the front end of the seat portion. The connection portion is longitudinally and adjustably attachable to the guide on the seat post of a bicycle. The rail can be used in place of the international parallel rail system and thus convert said bicycle seat from the international parallel rail system to the I-beam system.
    Type: Application
    Filed: January 27, 2009
    Publication date: July 29, 2010
    Inventor: Susan Huang
  • Patent number: 6400065
    Abstract: A transducer apparatus is disclosed having a spool member with a body portion and first and second elevated regions formed on the body portion. A PVDF film surrounds the spool member, the film including an inner surface facing the spool member and an outer surface opposite the inner surface. The film as surrounding the spool member has a predetermined frequency of resonance. Lateral ends of the film are secured together by a securing material. The securing material is such that the secured ends of the film will have substantially the same resonance frequency as a remainder of the film. The film includes a non-electrode area at a perimeter of the inner surface and an electrode material formed on a remainder of the inner surface. Upon securing the lateral edges of the film together, the securement is at overlapping non-electrode lateral edges of the film. The securing material may be any one of an adhesive in combination with screws or thermally deformable nails, adhesive alone, tape, or ultrasonic welding.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: June 4, 2002
    Assignee: Measurement Specialties, Inc.
    Inventors: Minoru Toda, Kyung-Tae Park, Susan Huang Zaks, Jeffrey D. Swan
  • Patent number: 6239535
    Abstract: A transducer apparatus is disclosed including a spool member having a body portion and first and second elevated regions formed on the body portion. A piezoelectric film such as a PVDF film surrounds the spool member and is spaced apart from the body portion of the spool member by an elevation of the elevated region, thereby forming a predetermined gap between the piezoelectric film and the body portion of the spool member. The predetermined gap is at least 0.1 mm and enables a predetermined resonance frequency in the piezoelectric film to control the resonance frequency of the transducer. Opposite lateral ends of the piezoelectric film are secured together such that secured ends of the piezoelectric film have substantially the same resonance frequency as a remainder of the piezoelectric film.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: May 29, 2001
    Assignee: Measurement Specialties Inc.
    Inventors: Minoru Toda, Kyung-Tae Park, Susan Huang Zaks, Jeffrey D. Swan