Abstract: The present invention provides a method and system that is capable of identifying an event type from a plurality of event types to direct an event translator to determine an event occurrence based on the event type. A method is provided for identifying the event type from a plurality of event types, determining an event occurrence based on the event type; and communicating the event occurrence. A system is also described.

Abstract: The present invention provides a method and system that is capable of identifying an event type from a plurality of event types to direct an event translator to determine an event occurrence based on the event type. A method is provided for identifying the event type from a plurality of event types, determining an event occurrence based on the event type; and communicating the event occurrence. A system is also described.

Abstract: The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

Abstract: The present invention provides a hybrid chip package that utilizes a high-speed BGA structure and a plurality of flexible and reliable QFP leads. More specifically, the QFP leads are attached to a peripheral region of a substrate to surround the attached BGA structure and replace solder bumps of a conventional BGA structure that would typically flack or crack during operational cycles to create an electrical open between the conventional BGA package and the attached printed circuit board.

Abstract: Printed circuit board has first, second and third sets of connection points operable to connects to first, second and third integrated circuits. Each set of connection points is arranged in a grid pattern having a center pairs of orthogonal axes intersect. The grids define parallel planes. The pairs of orthogonal axes of the second grid are rotated counterclockwise relative to those of the first grid by at least 5 but not more than 25 degrees. Signal connection points in the first and second grids are concentrated in corners closet to the center of the third grid. Signal connection points in the third grid are concentrated in the half closest to the centers of the first and second grids. Alternatively, when signal connection points are concentrated elsewhere in the grid, the pairs of axes for the second grid are rotated relative to those of the first by an amount other than 0, 45, 90, 135, 180, 225, 270 and 315 degrees. First and second sets of mounting holes attach first and second heat dissipators.