Abstract: Bonding of polystyrene foam details together to produce lost foam molds suitable for casting metallic details is accomplished by coating one of the two mating surfaces of the parts with a phenol-formaldehyde adhesive. The two parts are joined together and the mated assembly is placed in a microwave oven. Exposure of the assembly to microwave energy for a pre-selected period of time effects the bonding.

Abstract: A method of fabricating a microwave waveguide component wherein a plurality of joinable thermoplastic members are first formed. The members, when joined, comprise a microwave waveguide component having an internal surface that is adapted to be plated. The thermoplastic members are then bonded together. Then, the internal surface is plated to form the finished microwave waveguide component. The present method forms microwave components from plated, injection molded thermoplastic and reaction injection molded thermosetting plastics. In particular, the plastic components made using the present invention exhibit comparable electrical performance, as measured by voltage standing wave ratio (VSWR) and insertion loss, decreased device weight and cost, and reliable and repeatable manufacturability when compared with devices formed using metals, conventional thermosetting plastics that have been metallized, and molded, plated and soldered thermoplastics.

Abstract: A method and composition which provides both thermal control and electrostatic discharge protection to bodies in the space environment. The composition comprises: a) a chosen polymer or resin that forms a polymer that is an electronic insulator and is suitable for space applications; and b) a selected lithium salt as a dopant wherein said composition, when formed into a film or coating, provides a semiconductive film or coating having a volume resistivity of about 10.sup.6 to 10.sup.11 ohm-centimeter and a value of solar absorptance/total normal emittance within the range of about 0.305 to 0.595. In an alternative embodiment, the composition may optionally include tantalum pentoxide.

Abstract: Epoxy end-capped oligomers of 1,3-diolefin compounds of Formula I ##STR1## These oligomers are formed by: (a) reacting a 1,3-diolefin compound having 4 to 12 carbon atoms per molecule with a difunctional initiator comprising anionic reactive sites to form an intermediate living oligomer comprising two anionic end groups; and(b) reacting the intermediate living oligomer with a halohydrin compound to epoxidize the two anionic end groups and form the desired oligomer.The oligomers are subsequently reacted with an epoxidizing agent to form a polymer having epoxy-derived linkages at regular intervals along the chain of the polymer.

Abstract: A new group of silane compounds in which silicon atoms are linked together by a hydrocarbon chain and which comprise phenyl groups substituted with an epoxy group or an ethenyl group. The compounds of the present invention have the formula ##STR1## where R.sub.1 is selected from the group consisting of: (a) an aliphatic hydrocarbon group containing 2 to 10 carbon atoms, and(b) a group having the formula ##STR2## where n=1 to 3m=0 to 5;R.sub.2 and R.sub.2 ' are each selected from the group consisting of an alkyl group containing 1 to 4 carbon atoms, an unsubstituted aryl group, and a substituted aryl group; and R.sub.3 is selected from the group consisting of: ##STR3## where R.sub.4, R.sub.5, and R.sub.6 ae each selected from the group consisting of H, an alkyl group containing 1 to 4 carbon atoms, and an aryl group; and n=0 to 10.

Abstract: A method and composition which provides both thermal; control and electrostatic discharge protection to bodies in the space environment. The composition comprises: (a) a chosen polymer or resin that forms a polymer that is an electronic insulator and is suitable for space applications; and (b) a selected lithium salt as a dopant wherein said composition, when formed into a film or coating, provides a semiconductive film or coating having a volume resistivity of about 10.sup.6 to 10.sup.11 ohm-centimeter and a value of solar absorptance/total normal emittance within the range of about 0.305 to 0.595. In an alternative embodiment, the composition may optionally include tantalum pentoxide.

Abstract: A method for damping vibration between two bodies comprising providing a layer of a selected material between opposing surfaces of the bodies wherein said material comprises a cured polymer of a compound having the formula ##STR1## where: R.sub.1 is selected from the group consisting of:(a) an aliphatic hydrocarbon group containing 2 to 10 carbon atoms, and(b) a group having the formula ##STR2## where n=1 to 3m=0 to 5R.sub.2 and R.sub.2 ' are each selected from the group consisting of an alkyl group containing 1 to 4 carbon atoms, an unsubstituted aryl group, and a substituted aryl group; andR.sub.

Abstract: A method for rendering a substrate resistant to erosion by a plasma comprising oxygen by providing on the surface of the substrate a layer of a cured polymer of a compound having the formula ##STR1## where: R.sub.1 is selected from the group consisting of:(a) an aliphatic hydrocarbon group containing 2 to 10 carbon atoms, and(b) a group having the formula ##STR2## wherein n=1 to 3 m=0 to 5R.sub.2 and R.sub.2 ' are each selected from the group consisting of an alkyl group containing 1 to 4 carbon atoms, an unsubstituted aryl group, and a substituted aryl group; and R.sub.

Abstract: A new group of silane compounds in which silicon atoms are linked together by a hydrocarbon chain and which comprise phenyl groups substituted with an epoxy group or an ethenyl group. The compounds of the present invention have the formula ##STR1## where R.sub.1 is selected from the group consisting of:(a) an aliphatic hydrocarbon group containing 2 to 10 carbon atoms, and(b) a group having the formula ##STR2## where n=1 to 3m=0 to 5;R.sub.2 and R.sub.2 ' are each selected from the group consisting of an alkyl group containing 1 to 4 carbon atoms, an unsubstituted aryl group, and a substituted aryl group;and R.sub.3 is selected from the group consisting of: ##STR3## where R.sub.4, R.sub.5, and R.sub.6 are each selected from the group consisting of H, an alkyl group containing 1 to 4 carbon atoms, and an aryl group; and n=0 to 10.

Abstract: Epoxysilicone compounds are prepared by first reacting a dibromobenzene compound with magnesium in anhydrous ether solvent to form a Grignard reagent and subsequently reacting the Grignard reagent with allyl bromide to form a (bromophenyl)propene compound. Next, the (bromophenyl)propene compound is converted to the corresponding Grignard reagent, which is then reacted with a compound of the formula I below ##STR1## where n=1 to 6,R.sub.1 and R.sub.2 are each chosen from the group consisting of a C.sub.1 to C.sub.4 alkyl group, a substituted aryl group, and an unsubstituted aryl group.in tetrahydrofuran solvent to form an allyl-terminated silicone compound of formula II below ##STR2## Finally, the allyl-terminated silicone compound is reacted with a chosen epoxidizing agent to form the epoxysilicone compound of formula III below.

Abstract: A method for encapsulating an electrical component or forming a resin based filler reinforced composite article which comprises providing a rigid mold having a cavity and an opening in one surface of the mold connected to the cavity, and a chamber in which the mold is placed for applying heat and varying pressure to the mold contents. The chamber is preheated to the curing temperature of the resin and is maintained at this temperature. The component or filler is loaded into the mold cavity and the mold is placed in the preheated chamber. Then the mold cavity is filled with a low viscosity heat curable, thermosetting resin such as an epoxy resin. Next, the mold cavity is evacuated to a subatmospheric pressure to impose a vacuum on the mold to impregnate the component or filler with the resin, degas the mold cavity contents, and expand any voids in the resin. The vacuum is released to atmospheric pressure to collapse any gas bubbles remaining in the mold contents.

Abstract: Fiber-reinforced syntactic foam composites having a low specific gravity and a coefficient of thermal expansion of about 9.0.times.10.sup.-6 in/in/.degree.F. (16.2.times.10.sup.-6 cm/cm/.degree.C.) or less are prepared from a mixture of: a heat curable thermosetting resin comprising an uncured polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a chosen curing accelerator; hollow microspheres having a diameter of about 5 to 200 micrometers; and fibers having a length less than or equal to 250 micrometers. These composites are useful for forming lightweight structures for space applications.

Abstract: A highly fluid, solventless heat curable resin is formulated from an admixture comprising a polyglycidyl aromatic amine, a polycarboxylic acid anhydride curing agent, and a curing accelerator. The heat curable formulation exhibits low viscosity and is useful as an encapsulant and insulation for electrical members exposed to high electrical stress. Magnetic coils encapsulated with the cured formulation resist corona discharge at electrical stresses in excess of 2100 volts per mil.