Patents by Inventor Susan Lamtroung Levandoski

Susan Lamtroung Levandoski has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8119754
    Abstract: Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. These compositions exhibit enhanced high temperature properties, including hot strength, heat/humidity strength, and heat aging strength, without compromising initial tensile strength and fixture speeds and still possessing a room temperature cure.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: February 21, 2012
    Assignee: Henkel Corporation
    Inventors: Susan Lamtroung Levandoski, Christopher J. Verosky, Brian M. Czabaj
  • Publication number: 20110176886
    Abstract: A dry-to-the-touch moisture curing composition useful as a sealant and adhesive which includes a reactive modified methylene diisocyanate polymer component having isocyanate functionality of about 8% to about 18% by weight of the polymer.
    Type: Application
    Filed: March 30, 2011
    Publication date: July 21, 2011
    Applicant: Henkel Corporation
    Inventors: Susan Lamtroung Levandoski, Shabbir attarwala, Alfred A. DeCato, Ifeanyi Chris Broderick
  • Publication number: 20100084091
    Abstract: Room temperature curing structural adhesive compositions including polyurethane oligomers having multi-methacrylate functionality, cycloalkylmethacrylate, at least one maleimide-functionalized compound and a cure system are disclosed. These compositions exhibit enhanced high temperature properties, including hot strength, heat/humidity strength, and heat aging strength, without compromising initial tensile strength and fixture speeds and still possessing a room temperature cure.
    Type: Application
    Filed: December 8, 2009
    Publication date: April 8, 2010
    Applicant: Henkel Corporation
    Inventors: Susan Lamtroung Levandoski, Christopher J. Verosky, Brian M. Czabaj