Abstract: An automatic electrodeposition apparatus is disclosed. The desired substrate is brush plated by moving the brush on top of the plate. The brush may be selectively, and sequentially supplied with any one of a number of working solutions comprising conventional cleaning and plating solutions. De-ionized water and pressurized air may also be selectively fed to the brush for cleaning at desired time or job intervals throughout operation of the machine. A programmable logic controller controls feed of working solution, water, and air flow to the brush. It also controls brush movement and monitors electrodeposition through measurement of ampere-hours spent during operation.

Abstract: Methods of bonding a titanium containing sputter target member to a heat conductive backing member, such as a copper backing plate, and bonded target/backing plate assemblies are disclosed. Due to the poor wettability of titanium based materials, a uniform, thin film of aluminum is coated thereover and acts as an anchor layer for application of tin and/or indium based solder layers thereover to securely solder bond the target and backing plate. The aluminum coating is sputter coated onto the target. Then, the coated target is heated in an oxygen containing atmosphere. The thus treated titanium target is then ready for conventional solder joining to a copper backing plate or the like by use of tin, lead, and/or indium based solder metals.