Abstract: A one component bonding agent, method of using and articles produced therefrom, comprising from about 3 to 60% by weight of the total primer weight, of a first polymer, the first polymer comprising the reaction product of from about 15 to 85% by weight, based on the total weight of the first polymer, of a first oligomer, wherein the first oligomer comprises the reaction product of an epoxy functional silane and an amine functional monomer and a second oligomer including the reaction product of a monomeric isocyanate and a functionalized tri-alkoxysilane.

Abstract: A one component bonding agent, method of using and articles produced therefrom, comprising from about 3 to 60% by weight of the total primer weight, of a first polymer, the first polymer comprising the reaction product of from about 15 to 85% by weight, based on the total weight of the first polymer, of a first oligomer, wherein the first oligomer comprises the reaction product of an epoxy functional silane and an amine functional monomer and a second oligomer including the reaction product of a monomeric isocyanate and a functionalized tri-alkoxysilane.

Abstract: The present invention relates to methods of preparing a substrate for bonding that includes applying a cleanser to a reaction injection molded component. The substrate is dried to remove some or all of the liquid of the cleanser. The invention also relates to methods of bonding two substrates together. After cleaning the surface of one substrate with a basic solution, a primer may be applied to the cleaned surface or to a second substrate. An adhesive is then used to join the substrates together.