Patents by Inventor Susan Victoria Perz

Susan Victoria Perz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150307775
    Abstract: A method of preparing a composite article and the composite article prepared thereby are disclosed. The method comprises combining a precursor compound and nanoparticles produced via a plasma process to form a composition. The method further comprises forming the composite article from the composition. The composite article comprises a host matrix comprising SiO4/2 units with the nanoparticles dispersed in the host matrix.
    Type: Application
    Filed: March 26, 2015
    Publication date: October 29, 2015
    Inventors: James Allen Casey, Susan Victoria Perz, Charles Serrano, David Lawrence Witker
  • Patent number: 6706779
    Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds, epoxy functional compounds, or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: March 16, 2004
    Assignee: Dow Corning Corporation
    Inventors: Maneesh Bahadur, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 6703433
    Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
    Type: Grant
    Filed: May 12, 2000
    Date of Patent: March 9, 2004
    Assignee: Dow Corning Corporation
    Inventors: Maneesh Bahadur, Susan Victoria Perz, Toshio Suzuki
  • Publication number: 20020028303
    Abstract: This invention relates to radiation curable compositions comprising an alkenyl ether functional polyisobutylene, a cationic photoinitiator, and a miscible reactive diluent selected from specified organic vinyl ether compounds, epoxy functional compounds, or compounds having the formula R8Xb, wherein R8 is a non-silicon containing organic group, X is an organic group containing at-least one acrylate functional group, and b has a value of 1-3. The radiation curable compositions exhibit a low cure energy, have a high moisture vapor barrier, high damping characteristics, and a high refractive index, and provide a barrier to corrosive vapors and have maintained or enhanced modulus, tensile strength, and toughness.
    Type: Application
    Filed: August 27, 2001
    Publication date: March 7, 2002
    Inventors: Maneesh Bahadur, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 6350384
    Abstract: Multi-arm star polymers are derived from silicon containing dendrimers and have arms containing the moiety where each R′ can be the same or different and is an alkyl group containing 1-6 carbon atoms such as methyl and ethyl or an aryl group such as phenyl; R″ is alkylene radical —(CH2)a— in which a has a value of 2 or 3; and R′″ is the —(CH2)bCH3 group in which b has a value of 1-50. These compositions can be used for dissolving metals and other electrophiles.
    Type: Grant
    Filed: August 14, 2000
    Date of Patent: February 26, 2002
    Assignee: Dow Corning Corporation
    Inventors: Petar Radivoj Dvornic, Jin Hu, Agnes M. de Leuze-Jallouli, Michael James Owen, Paul Lane Parham, Susan Victoria Perz, Scott Daniel Reeves
  • Patent number: 6077892
    Abstract: The adhesion of cured polyolefin compositions to a variety of substrates is improved using as the adhesion promoter the combination of 1) an organic or organosilicon compound containing at least one epoxy group and 2) at least one compound containing a) at least one silanol or carbinol group or a hydrolyzable silanol group precursor, and b) at least one group that reacts during curing of the polyolefin.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: June 20, 2000
    Assignee: Dow Corning Corporation
    Inventors: Qian Jane Feng, Kenneth Michael Lee, Michael Andrew Lutz, Michael James Owen, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 6077500
    Abstract: Higher generation radially layered copolymeric dendrimers having a hydrophilic poly(amidoamine) or a hydrophilic poly(propyleneimine) interior and a hydrophobic organosilicon exterior are prepared by first reacting a hydrophilic dendrimer having --NH.sub.2 surface groups with an organosilicon compound, and then hydrosilating the resulting copolymeric dendrimer with another organosilicon compound in the presence of a noble metal catalyst. In an alternate embodiment, the radially layered copolymeric dendrimers are prepared by reacting a hydrophilic dendrimer having --NH.sub.2 surface groups directly with an organosilicon dendron or organosilicon hyperbranched polymer.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: June 20, 2000
    Assignees: Dow Corning Corporation, Dendritech, Incorporated
    Inventors: Petar R. Dvornic, Agnes M. deLeuze-Jallouli, Michael James Owen, Susan Victoria Perz
  • Patent number: 6060559
    Abstract: The presence in curable polyolefin compositions of a moisture curable organosilicon compound containing at least one alkenyloxy group bonded to the silicon atoms improves the adhesion to a variety of substrates that is developed during the curing reaction of polyolefin compositions cured by a hydrosilation reaction. The organosilicon compound is preferably a reaction product of ingredients comprising 1) a silane or bis-silylalkane containing at least three silicon-bonded moisture-reactive groups per molecule and 2) an organic compound containing at least one carbinol group and at least one ethylenically unsaturated group.
    Type: Grant
    Filed: September 4, 1998
    Date of Patent: May 9, 2000
    Assignee: Dow Corning Corporation
    Inventors: Qian Jane Feng, Robert Edward Kalinowski, Kenneth Michael Lee, Michael Andrew Lutz, Michael James Owen, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 6034179
    Abstract: The present invention provides adhesion promoters for curable polyolefin compositions wherein said adhesion promoters are selected from a specified group of hydrocarbyloxy-substituted organosilicon compounds and condensation products of these compounds. At least one hydrocarbyloxy group on each silicon atom of the adhesion promoter is derived from a polyhydric alcohol containing at least two hydroxyl groups per molecule and substantially no ethylenic unsaturation.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: March 7, 2000
    Assignee: Dow Corning Corporations
    Inventors: Qian Jane Feng, Kenneth Michael Lee, Michael Andrew Lutz, Michael James Owen, Susan Victoria Perz, Toshio Suzuki
  • Patent number: 5973044
    Abstract: This invention relates to organosilicon compositions useful as adhesion promoters for curable organopolysiloxanes, said organosilicon compositions being formed by reacting (A) a polyhydric alcohol, (B) an organosiloxane containing at least one organofunctional group and one hydroxyl or hydrolyzable group per molecule and (C) a silane containing at least three hydrolyzable groups per molecule.
    Type: Grant
    Filed: August 28, 1998
    Date of Patent: October 26, 1999
    Assignee: Dow Corning Corporation
    Inventors: Michael Andrew Lutz, Michael James Owen, Susan Victoria Perz
  • Patent number: 5938934
    Abstract: Dendritic polymer based networks consisting of well-defined hydrophilic and oleophilic (i.e., hydrophobic) domains, are capable of performing as nanoscopic sponges for electrophilic guest moieties such as (i) inorganic and organic cations; (ii) charged or polarized molecules containing electrophilic constituent atoms or atomic groups; and (iii) other electrophilic organic, inorganic, or organometallic species. As a result of such performance, the networks yield novel nanoscopic organo-inorganic composites which contain organosilicon units as an integral part of their covalently bonded matrix.
    Type: Grant
    Filed: January 13, 1998
    Date of Patent: August 17, 1999
    Assignees: Dow Corning Corporation, Dendritech Inc.
    Inventors: Lajos Balogh, Agnes M. deLeuze-Jallouli, Petar R. Dvornic, Michael J. Owen, Susan Victoria Perz, Ralph Spindler
  • Patent number: 5902863
    Abstract: Dendrimer-based networks are prepared from copolydendrimer precursors having well defined hydrophilic polyamidoamine (PAMAM) or polypropyleneimine (PPI) interiors, and organosilicon outer layers ending with .tbd.Si--OCH.sub.3 surface groups. These networks have precisely controllable size, shape, and spatial distribution, of nanoscopic hydrophilic and hydrophobic domains. Such constructs are prepared by crosslinking one type of copolydendrimer precursor, or by crosslinking mixtures of different copolydendrimers having different generations of PAMAM or PPI dendrimers in the interior, surrounded by different organosilicon exteriors. Crosslinking can be controlled by adding difunctional, trifunctional, or polyfunctional low molecular weight or oligomeric crosslinking agents; or by exposing a copolydendrimer having hydrolyzable surface groups to atmospheric moisture. Elastomeric dendrimer-based networks have low glass temperatures of -15.degree. C.
    Type: Grant
    Filed: July 21, 1997
    Date of Patent: May 11, 1999
    Assignees: Dow Corning Corporation, Michigan Molecular Institute
    Inventors: Petar R. Dvornic, Agnes M. deLeuze-Jallouli, Michael James Owen, Susan Victoria Perz
  • Patent number: 5861467
    Abstract: The present invention relates to radiation curable silicone vinyl ethers and methods for preparing silicone vinyl ethers. More particularly, the present invention relates compositions containing vinyl ether functional silicones and to the preparation and use of silicone vinyl ethers which are curable by addition of photocleavable acids and exposure to ultraviolet or electron beam radiation.
    Type: Grant
    Filed: May 18, 1993
    Date of Patent: January 19, 1999
    Assignee: Dow Corning Corporation
    Inventors: Valerie Joy Bujanowski, Shedric Oneal Glover, Susan Victoria Perz, Maris Jazeps Ziemelis, Gary Rex Homan, Michael Ward Skinner
  • Patent number: 5824761
    Abstract: The present invention relates to radiation curable silicone vinyl ethers and methods for preparing silicone vinyl ethers. More particularly, the present invention relates compositions containing vinyl ether functional silicones and to the preparation and use of silicone vinyl ethers which are curable by addition of photocleavable acids and exposure to ultraviolet or electron beam radiation.
    Type: Grant
    Filed: January 16, 1997
    Date of Patent: October 20, 1998
    Assignee: Dow Corning Corporation
    Inventors: Valerie Joy Bujanowski, Shedric Oneal Glover, Susan Victoria Perz, Maris Jazeps Ziemelis, Gary Rex Homan, Michael Ward Skinner
  • Patent number: 5739218
    Abstract: Radially layered copoly-dendrimers having unusual surface properties and novel applications have been synthesized and characterized. These are the first copolymeric dendrimers composed of a hydrophilic poly(amidoamine) (PAMAM) interior with hydrophobic organosilicon surfaces. These dendrimers have been prepared by surface modifications of an ethylene diamine core PAMAM dendrimer with (3-acryloxypropyl)methyldimethoxysilane, (3-acryloxypropyl)bis(vinyldimethylsiloxy)methylsilane, (3-acryloxypropyl)tris(trimethylsiloxy)silane, chloromethyltrimethylsilane, and chloromethyldimethylvinylsilane, to varying degrees of surface coverage. The obtained products were characterized by .sup.1 H, .sup.13 C, and .sup.29 Si NMR, and by DSC and TGA. The dendrimers with less completely covered organosilicon surfaces are water soluble, and have considerable surface activity, the best of which lowered the surface tension of water to less than 30 mN/m.
    Type: Grant
    Filed: June 2, 1997
    Date of Patent: April 14, 1998
    Assignees: Dow Corning Corporation, Michigan Molecular Institute
    Inventors: Petar R. Dvornic, Agnes M. deLeuze-Jallouli, Douglas Swanson, Michael James Owen, Susan Victoria Perz