Abstract: An EMI reduction device is interposed between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device contacts a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Abstract: An EMI reduction device coupled between to a printed circuit board (PCB) assembly and a heat sink is herein disclosed. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Abstract: The present invention provides a bezel attachment configuration for securing a detachable bezel to a metal chassis. The bezel attachment mechanism preferably includes the combination of a modified bezel post extending from and integral to the plastic body of the bezel and a bezel snap that is attached to the post. The post includes at least a first region and a second region, where the cross-sectional area of the second region is less than the cross-sectional area of the first region. The difference in cross-sectional areas creates a lip between the first region and the second region that the bezel snap catches on if moved in an upward direction towards the top of the bezel post. The lip of the post acts as a barrier to further movement of the bezel snap, thus providing a secure attachment of the bezel snap to the bezel. The secure bezel snap is inserted into an opening in the metal chassis.

Abstract: An EMI reduction device is coupled between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.

Abstract: A heat transfer device for use with a retention assembly is herein disclosed. The retention assembly is mounted over one or more connectors attached to a circuit board. The retention assembly houses one or more processor modules that mount into the connectors. The processor modules include a heat transfer device. The heat transfer device has a pair of rail guides that cover the outer edges of the processor module. The rail guides enable the processor module to slide in and out of the retention assembly thereby enabling the processor module to be securely mounted into the connector.

Abstract: A front squeeze trigger discharge assembly for use with a fire extinguisher having a pressurized extinguishing medium therein includes a housing defining a flow chamber. The housing has a front portion and a rear portion configured to rest in the hand of a user, and a pivotable trigger handle mounted to the housing and positioned at the front portion thereof. The pivotable trigger handle is configured for gripping by a user's fingers. The handle includes a pivot for rotating the handle relative to the housing between a first position and a second position toward the housing for discharging the extinguishing medium from the extinguisher. The handle includes a discharge nozzle positioned on the front of the housing and a discharge valve assembly operably connected to said trigger handle for providing a flow path between the container and the discharge nozzle. The trigger handle is pivotable from the first position to the discharge position inward of the housing by gripping the handle and pulling thereon, i.e.