Abstract: The present invention relates to a process for hydroxyalkylating terminal carboxylic acid groups. More specifically, this invention provides a process for preparing hydroxyl-functionalized materials, such as butadiene nitrile polymers, from carboxylic acid-functionalized materials, such as butadiene nitrile polymers, using a carbocyclic carbonate, such as ethylene carbonate, or a carbocyclic sulfite, such as ethylene sulfite.

Abstract: Adhesive compositions are disclosed which include acrylates, their polymers, and free radical initiators. The compositions include a multi-functional alpha-alkoxyalkyl (meth)acrylate compound and a free radical initiator. The multi-functional alpha-alkoxyalkyl (meth)acrylate compound is the reaction product of: (a) a (meth)acrylic acid or a (meth)acrylate ester having a free carboxylic acid group; and (b) a compound including two or more 1-alkenyl ether groups and free of acetal and ketal groups, or a compound free of acetal and ketal groups and including one or more 1-alkenyl ether groups and a (meth)acrylate group. The compositions are easier and less expensive to prepare than conventional acrylate compositions and degrade when contacted with an acid medium or when heated. The compositions are useful in a wide range of applications and are compatible with conventional adhesive additives.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak ?-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components including (a) the epoxidized reaction product of a multifunctional 1-alkenyl ether or 1-cycloalkenyl ether and an alkenyl carboxylic acid, the epoxidized reaction product having two or more thermally labile alpha-alkoxy ester linkages; and (b) a curing agent for the epoxy component. The epoxy composition, when cured, provides a composition which is thermally reworkable, the weak ?-alkoxy ester linkages providing for the reworkable aspect of the invention.

Abstract: The present invention discloses reworkable epoxy compositions suitable for encapsulation of and underfill for electronic components comprising (a) a curable epoxy component which is the reaction product of an epoxidized 1-alkenyl ether or 1-cycloalkenyl ether and a polycarboxylic acid, the reaction product being substantially free of unreacted acid or acid impurities; and (b) a curing agent for the epoxy component, wherein the reaction products of the epoxy composition are reworkable. The cured epoxy compositions of this invention contain thermally labile weak &agr;-alkoxy ester linkages which provide for the reworkable aspect of the invention.

Abstract: Compounds of the formula: wherein R1 is H or methyl, R2 is H or alkyl, R3 is C2-C4 alkylene, n is 0-4, n′ is 1-4, x is one or more, y is one or more, x+y=z, and A is a z-valent organic group linked to the group or groups on the left thereof through a carbon atom and is linked to the group or groups on the right thereof through an ether or ester oxygen atom, or, provided that x and y are both 1, a direct bond.

Abstract: The present invention is directed to radical-curable adhesive compositions which include a (meth)acrylate component; a thermal resistance-conferring component; and a radical cure-inducing composition. Reaction products of the compositions of this invention exhibit superior resistance of thermal degradation.

Abstract: The present invention is directed to radical-curable adhesive compositions which include a (meth)acrylate component; a thermal resistance-conferring component; and a radical cure-inducing composition. Reaction products of the compositions of the compositions of this invention exhibit superior resistance to thermal degradation.