Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii.

Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. a first type of hexagonal boron nitride primary particle agglomerates having a first average agglomerate size d50 comprised between 100 and 420 m; ii. optionally, hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 25 m; iii. optionally, a second type of hexagonal boron nitride primary particle agglomerates having a second average agglomerate size d50 which is lower than the first average agglomerate size d50; iv.