Patents by Inventor Susanne Kraeuter

Susanne Kraeuter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a battery, battery and integrated circuit
    Patent number: 10476112
    Abstract: A method of manufacturing a battery includes defining an active region and a bonding area in a first main surface of a first semiconductor substrate, forming a first ditch in the bonding area, forming an anode at the first semiconductor substrate in the active region, and forming a cathode at a carrier comprising an insulating material. The method further includes stacking the first semiconductor substrate and the carrier so that the first main surface of the first semiconductor substrate is disposed on a side adjacent to a first main surface of the carrier, a cavity being formed between the first semiconductor substrate and the carrier, and forming an electrolyte in the cavity.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: November 12, 2019
    Assignee: Infineon Technologies AG
    Inventors: Rafael Janski, Kamil Karlovsky, Susanne Kraeuter, Michael Sorger
  • Method of depositing a resin material on a semiconductor body with an inkjet process
    Patent number: 9818602
    Abstract: A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: November 14, 2017
    Assignees: Infineon Technologies AG, Technische Universität Graz
    Inventors: Stefan Schwab, Markus Heinrici, Rafael Janski, Susanne Kraeuter, Martin Mischitz
  • Method of Manufacturing a Battery, Battery and Integrated Circuit
    Publication number: 20170018813
    Abstract: A method of manufacturing a battery includes defining an active region and a bonding area in a first main surface of a first semiconductor substrate, forming a first ditch in the bonding area, forming an anode at the first semiconductor substrate in the active region, and forming a cathode at a carrier comprising an insulating material. The method further includes stacking the first semiconductor substrate and the carrier so that the first main surface of the first semiconductor substrate is disposed on a side adjacent to a first main surface of the carrier, a cavity being formed between the first semiconductor substrate and the carrier, and forming an electrolyte in the cavity.
    Type: Application
    Filed: July 14, 2016
    Publication date: January 19, 2017
    Inventors: Rafael Janski, Kamil Karlovsky, Susanne Kraeuter, Michael Sorger
  • Methods with Inkjet Processes and Their Application
    Publication number: 20160082718
    Abstract: A method a described which includes depositing a first component of a multicomponent system by means of an inkjet process, and depositing a second component of the multicomponent system by means of an inkjet process.
    Type: Application
    Filed: September 22, 2015
    Publication date: March 24, 2016
    Inventors: Stefan Schwab, Markus Heinrici, Rafael Janski, Susanne Kraeuter, Martin Mischitz