Abstract: Systems and methods for cooling a datacenter are disclosed. In at least one embodiment, a number of multi-dimensional column-based heat dissipation features enable cooling by a cooling media flowing there through so that an individual heat dissipation column having a first dimension and a second dimension may be supported, with the first dimension being normal relative to an axial flow path of the cooling media, with the second dimension being parallel or offset from parallel relative to the axial flow path and with the second dimension being more than the first dimension.

Abstract: The disclosed apparatus may include (1) a heatsink that includes a first vapor chamber that (A) contains fluid that dissipates heat and (B) is at least partially encompassed by a plate that contains at least one slot extending from a top surface of the plate to the first vapor chamber and (2) at least one fin that (A) encompasses a second vapor chamber (B) is secured within the slot in the plate of the heatsink such that (i) the fin extends from the heatsink and (ii) the fluid within the first vapor chamber is capable of flowing into the second vapor chamber. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed heatsink apparatus may include (i) a base that facilitates thermal transfer between a computing component and cooling airflow, (ii) a plurality of fins, extending from the base, that provide additional surface area to facilitate the thermal transfer between the computing component and the cooling airflow, (iii) at least one channel, defined within the plurality of fins, that facilitates a faster passage of a portion of the cooling airflow across the heatsink apparatus, and (iv) at least one air dam that prevents the cooling airflow from escaping a designated path on a printed circuit board. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a heatsink that includes a first vapor chamber that (A) contains fluid that dissipates heat and (B) is at least partially encompassed by a plate that contains at least one slot extending from a top surface of the plate to the first vapor chamber and (2) at least one fin that (A) encompasses a second vapor chamber (B) is secured within the slot in the plate of the heatsink such that (i) the fin extends from the heatsink and (ii) the fluid within the first vapor chamber is capable of flowing into the second vapor chamber. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include may include (1) an active power supply blank that (A) fits within a power supply slot of a network device that forwards network traffic and (B) generates airflow that cools the network device and (2) a power interface that electrically couples the active power supply blank to the network device, wherein the power interface enables the active power supply blank to (A) draw electrical power from the network device and (B) generate the airflow that cools the network device using the electrical power drawn from the network device. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed apparatus may include (1) a ganged heatsink base that (A) absorbs heat dissipated by a plurality of electronic components that consume differing amounts of power and (B) includes a plurality of thermal regions dedicated to absorbing the heat dissipated by the plurality of electronic components and (2) at least one thermal isolation engine that (A) is incorporated into the ganged heatsink base, (B) separates the plurality of thermal regions from one another, and (C) localizes the heat dissipated by the plurality of electronic components by maintaining at least some of the heat dissipated by one of the electronic components within the thermal region that absorbed the at least some of the heat such that the at least some of the heat does not migrate to another thermal region included in the ganged heatsink base. Various other apparatuses, systems, and methods are also disclosed.

Abstract: The disclosed heatsink apparatus may include (i) a base that facilitates thermal transfer between a computing component and cooling airflow, (ii) a plurality of fins, extending from the base, that provide additional surface area to facilitate the thermal transfer between the computing component and the cooling airflow, (iii) at least one channel, defined within the plurality of fins, that facilitates a faster passage of a portion of the cooling airflow across the heatsink apparatus and (iv) at least one air dam that prevents the cooling airflow from escaping a designated path on a printed circuit board. Various other apparatuses, systems, and methods are also disclosed.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: An apparatus is provided in one example embodiment and includes a faceplate having a plurality of slots arranged on a front portion of the faceplate, a top plate attached to a top portion of the faceplate, and a screen attached to the faceplate and the top plate. A channel may be disposed behind the faceplate and between a bottom surface of the top portion of the faceplate, a bottom surface of the top plate and a top surface of the screen. The screen may include a plurality of openings. In a specific embodiment, the apparatus may be removably attached to a removable line card of a switch. In a specific embodiment, air may be guided through the slots, by a fan operating behind the apparatus, along the channel and through the plurality of openings to one or more heat generating components on the line card.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.

Abstract: To increase air flow, an air intake/outtake (i.e., intake, outtake, or both) is positioned on a front surface of a housing, such as a rack-mounted computer network switch housing. The front surface includes jacks, controls, plugs, receptacles or other input/output for connection with the processor in the housing. The air intake/outtake is one or more openings on the front surface with the input/output components. In one embodiment, to avoid interference with the input/output components and increasing the height of the housing, the air intake/outtake is a slot extending most of or all of the distance between the sides of the housing and being above or below the input/output. An intermediate plate may be used to form and support the air intake/outtake.