Patents by Inventor Susheela Narasimhan

Susheela Narasimhan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11523539
    Abstract: A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.
    Type: Grant
    Filed: April 23, 2020
    Date of Patent: December 6, 2022
    Assignee: NVIDIA Corporation
    Inventors: Nelson Au, Glenn Wernig, Jeongyong Jeon, Susheela Narasimhan
  • Publication number: 20210259133
    Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.
    Type: Application
    Filed: August 12, 2020
    Publication date: August 19, 2021
    Inventors: Susheela NARASIMHAN, Michal L. SABOTTA
  • Publication number: 20210105913
    Abstract: A protective shroud includes a top plate, a first side plate that is adapted to be disposed proximate a first edge region of a plurality of cooling fins of a heat exchanger for an integrated circuit, and a second side plate that is adapted to be disposed proximate a second edge region of the plurality of cooling fins.
    Type: Application
    Filed: April 23, 2020
    Publication date: April 8, 2021
    Inventors: Nelson AU, Glenn WERNIG, Jeongyong JEON, Susheela NARASIMHAN
  • Publication number: 20200217599
    Abstract: An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.
    Type: Application
    Filed: August 29, 2019
    Publication date: July 9, 2020
    Inventors: Susheela Narasimhan, Sanjay Choudhry
  • Publication number: 20120213650
    Abstract: A cooling fan with dual rotation directions includes a fan frame unit, a driving control unit and an impeller. The fan frame unit has an air channel having first and second air-guiding openings on two sides of the air channel. A base is disposed between the first and second air-guiding openings. A first stationary blade unit is disposed at the first air-guiding opening and a second stationary blade unit is disposed at the second air-guiding opening. The driving control unit has a stator, a driving circuit and a rotation direction control circuit, wherein the stator is disposed on the base of the fan frame unit and the driving circuit is electrically connected to the stator and the rotation direction control circuit. The impeller is rotatably coupled with the stator of the driving control unit.
    Type: Application
    Filed: March 31, 2011
    Publication date: August 23, 2012
    Inventors: Don-Cheng Lee, Ming-Tsung Li, Nguyen Nguyen, Susheela Narasimhan, Hung-Chin Mai
  • Patent number: 8248013
    Abstract: A fan device with improved speed control module includes a stator, a rotor, and a speed control module. The stator has a driving unit outputting currents for the stator to generate alternative magnetic fields and thus turn the rotor. The speed control module includes a control unit and a speed adjusting circuit, with the control unit generating a control command for the driving unit and further outputting a state signal for the speed adjusting circuit to control whether a PWM signal enters the control circuit or not.
    Type: Grant
    Filed: March 26, 2009
    Date of Patent: August 21, 2012
    Assignee: Sunonwealth Electric Machine Industry Co, Ltd.
    Inventors: Alex Horng, Chun-Yuan Huang, Chung-Ken Cheng, Nguyen Nguyen, Susheela Narasimhan
  • Patent number: 8189348
    Abstract: In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.
    Type: Grant
    Filed: July 17, 2008
    Date of Patent: May 29, 2012
    Assignee: Cisco Technology, Inc.
    Inventors: Mohammad Reza Danesh Kadivar, Hong Huynh, Saeed Seyed, James T. Theodoras, II, Susheela Narasimhan
  • Publication number: 20100014268
    Abstract: In one embodiment, the present disclosure refers to an apparatus comprising a bracket having a base configured to receive and hold a first electronic element. The bracket comprises at least one flange extending from the base and at least one guide acting to align the bracket and first electronic element with a second electronic element. The bracket also comprises at least one fastener aligned with the at least one guide and acting to engage and hold the second electronic element.
    Type: Application
    Filed: July 17, 2008
    Publication date: January 21, 2010
    Inventors: Mohammad Reza Danesh Kadivar, Hong Huynh, Saeed Seyed, James T. Theodoras II, Susheela Narasimhan
  • Patent number: 7492598
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Grant
    Filed: September 20, 2006
    Date of Patent: February 17, 2009
    Assignee: Cisco Technology, Inc.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar
  • Publication number: 20080068809
    Abstract: Methods and apparatus for supporting heatsinks used to cool components of a board are disclosed. According to one aspect of the present invention, a carrier plate assembly that is arranged to be secured over a structure which has a first structure hole and a first component includes a carrier plate and a first heatsink. The carrier plate has a first plate mounting hole and a first opening defined therein. The first plate mounting hole is arranged to be aligned with the first structure hole such that a first axis is defined through the first plate mounting hole and the first structure hole. The first opening is arranged to be positioned over the first component. The first heatsink is positioned such that a first portion of the first heatsink protrudes through the opening and a second portion of the first heatsink is supported on the carrier plate.
    Type: Application
    Filed: September 20, 2006
    Publication date: March 20, 2008
    Applicant: CISCO TECHNOLOGY, INC.
    Inventors: Susheela Narasimhan, Nguyen T. Nguyen, Saeed Sayed, Mohammad Reza Danesh Kadivar
  • Patent number: 7167369
    Abstract: A circuit board module includes a circuit board having surface mount pads, a circuit board component mounted to the circuit board, and a heat sink assembly. The heat sink assembly includes a heat sink, a first clip holder and a second clip holder. Each clip holder is mounted to respective surface mount pads of the circuit board using a surface mount technology soldering process. The heat sink assembly further includes a clip having a first portion configured to fasten to the first clip holder, a second portion configured to fasten to the second clip holder, and a third portion coupled to the first and second portions. The third portion is configured to position the heat sink adjacent the circuit board component when the first and second portions are respectively fastened to the first and second clip holders.
    Type: Grant
    Filed: December 8, 2003
    Date of Patent: January 23, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Hong Huynh, Anthony King, Susheela Narasimhan
  • Patent number: 7088586
    Abstract: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.
    Type: Grant
    Filed: November 15, 2004
    Date of Patent: August 8, 2006
    Assignee: Cisco Technology, Inc.
    Inventors: Hong Huynh, Susheela Narasimhan, Michael Koken
  • Publication number: 20060103013
    Abstract: A dimpled heat spreader includes a central portion configured to couple to the circuit board component, an outer portion coupled to the central portion, and dimpled portions disposed within the outer portion. The outer portion is configured to extend from the central portion and support the dimpled portions beyond a footprint of the circuit board component when the central portion couples to the circuit board component. The dimpled portions of such a heat spreader provides more exposed surface area (e.g., per square inch) than conventional heat spreaders with flat end portions for improved and enhanced heat dissipation via natural convection into the ambient air. Moreover, a heat spreader with such dimpled portions is relatively easy and cost effective to make vis-à-vis more complex structures such as fins or posts thus enabling a manufacturer to produce dimpled heat spreaders using a high volume, low cost assembly process.
    Type: Application
    Filed: November 15, 2004
    Publication date: May 18, 2006
    Inventors: Hong Huynh, Susheela Narasimhan, Michael Koken
  • Patent number: 6728104
    Abstract: The heat sink of the present invention includes a device portion, a bend portion, and a support portion that thermally couples the circuit board component to a support member, thereby allowing for heat transfer from the circuit board component to the support member. The bend portion of the heat sink allows for displacement of the device portion relative to the support portion to limit the amount of stress generated by the heat sink on the circuit board component. The geometry of the heat sink further allows placement of the heat sink within the relatively narrow space conventionally formed between the circuit board and the support member.
    Type: Grant
    Filed: October 23, 2002
    Date of Patent: April 27, 2004
    Assignee: Cisco Technology, Inc.
    Inventors: Mudasir Ahmad, Susheela Narasimhan