Patents by Inventor Sushil Bharatan

Sushil Bharatan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110110550
    Abstract: A microphone system has a package with an interior, a MEMS microphone within the package interior and forming a backvolume between it and the package interior, and a MEMS valve coupled with at least one input aperture in the package. The package defines at least one input aperture (e.g., the prior noted aperture) for receiving an acoustic signal, and the MEMS microphone is mechanically coupled to at least a portion of one input aperture. The valve has a valve opening generally circumscribed by a valve seat. The valve is considered as having an open mode for permitting acoustic signal access into the package interior through the valve opening, and a closed mode for substantially preventing acoustic signal access into the package interior through the valve opening. The valve has a movable member configured to contact the valve seat when in the closed mode. This movable member is configured to move between the open mode and the closed mode in a direction that is generally perpendicular to the valve seat.
    Type: Application
    Filed: October 22, 2010
    Publication date: May 12, 2011
    Applicant: ANALOG DEVICES, INC.
    Inventors: Sushil Bharatan, Venkataraman Chandrasekaran, Xin Zhang, Michael W. Judy
  • Publication number: 20090202089
    Abstract: A MEMS microphone has an SOI wafer, a backplate formed in a portion of the SOI wafer, and a diaphragm adjacent to and movable relative to the backplate. The backplate has at least one trench that substantially circumscribes a central portion of the backplate.
    Type: Application
    Filed: March 26, 2009
    Publication date: August 13, 2009
    Applicant: ANALOG DEVICES, INC.
    Inventors: Xin Zhang, Thomas Chen, Sushil Bharatan, Aleksey S. Khenkin
  • Patent number: 7052939
    Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).
    Type: Grant
    Filed: November 26, 2002
    Date of Patent: May 30, 2006
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Wen Ling M. Huang, Sushil Bharatan, Carl Kyono, David J. Monk, Kun-Hin To, Pamela J. Welch
  • Publication number: 20040099878
    Abstract: A structure that reduces signal cross-talk through the semiconductor substrate for System-On-Chip (SOC) (2) applications, thereby facilitating the integration of digital circuit blocks (6) and analog circuit blocks (8) onto a single IC. Cross-circuit interaction through a substrate (4) is reduced by strategically positioning the various digital circuit blocks (6) and analog circuit blocks (8) in an isolated wells (10), (12), (16) and (20) over a resistive substrate (4). These well structures (10), (12), (16), and (20) are then surrounded with a patterned low resistivity layer (22) and optional trench region (24). The patterned low resistivity region (22) is formed below wells (10) and (12) and functions as a low resistance AC ground plane. This low resistivity region (22) collects noise signals that propagate between digital circuit blocks (6) and analog circuit blocks (8).
    Type: Application
    Filed: November 26, 2002
    Publication date: May 27, 2004
    Applicant: Motorola, Inc.
    Inventors: Wen Ling M. Huang, Sushil Bharatan, Carl Kyono, David J. Monk, Kun-Hin To, Pamela J. Welch