Patents by Inventor Susmriti Das Mahapatra

Susmriti Das Mahapatra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lids for integrated circuit packages with solder thermal interface materials
    Patent number: 11817369
    Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: November 14, 2023
    Assignee: Intel Corporation
    Inventors: Bamidele Daniel Falola, Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li, Amitesh Saha
  • CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL AND A SOLDER THERMAL INTERFACE MATERIAL
    Publication number: 20220102234
    Abstract: An integrated circuit (IC) package comprising a die having a front side and a back side. A solder thermal interface material (STIM) comprising a first metal is over the backside. The TIM has a thermal conductivity of not less than 40 W/mK; and a die backside material (DBM) comprising a second metal over the STIM, wherein the DBM has a CTE of not less than 18×10?6 m/mK, wherein an interface between the STIM and the DBM comprises at least one intermetallic compound (IMC) of the first metal and the second metal.
    Type: Application
    Filed: September 25, 2020
    Publication date: March 31, 2022
    Applicant: Intel Corporation
    Inventors: Susmriti Das Mahapatra, Malavarayan Sankarasubramanian, Shenavia Howell, John Harper, Mitul Modi
  • LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS
    Publication number: 20200388554
    Abstract: Disclosed herein are lids for integrated circuit (IC) packages with solder thermal interface materials (STIMs), as well as related methods and devices. For example, in some embodiments, an IC package may include a STIM between a die of the IC package and a lid of the IC package. The lid of the IC package may include nickel, the IC package may include an intermetallic compound (IMC) between the STIM and the nickel, and the lid may include an intermediate material between the nickel and the IMC.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 10, 2020
    Applicant: INTEL CORPORATION
    Inventors: Bamidele Daniel Falola, Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li, Amitesh Saha
  • SOLDER THERMAL INTERFACE MATERIAL (STIM) WITH DOPANT
    Publication number: 20200357764
    Abstract: Embodiments may relate to a microelectronic package comprising that includes a solder thermal interface material (STIM). The STIM may include indium and a dopant material which may provide a number of benefits to the STIM. The STIM may physically and thermally couple a die and an integrated heat spreader (IHS). Other embodiments may be described or claimed.
    Type: Application
    Filed: May 8, 2019
    Publication date: November 12, 2020
    Applicant: Intel Corporation
    Inventors: Susmriti Das Mahapatra, Bamidele Daniel Falola, Amitesh Saha, Peng Li
  • METHOD OF ELECTROPLATING TIN FILMS WITH INDIUM USING AN ALKANESULFONIC ACID BASED ELECTROLYTE
    Publication number: 20170321340
    Abstract: A method comprising incorporating indium into an entire Sn film for preventing the growth of whiskers from the Sn film, wherein the Sn film is applied to a metallic substrate.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 9, 2017
    Applicant: Washington State University
    Inventors: Indranath Dutta, Susmriti Das Mahapatra