Patents by Inventor Susumu Baba
Susumu Baba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11873398Abstract: Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.Type: GrantFiled: September 28, 2017Date of Patent: January 16, 2024Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Tatsushi Hayashi, Takashi Nishimura, Susumu Baba
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Publication number: 20220169827Abstract: Provided is a resin material capable of suppressing warpage of a cured product and shortening the baking time. The resin material according to the present invention contains a thermosetting compound that does not have an aromatic ring in a structural portion excluding a thermosetting functional group, has two or more CH3 terminals in a structural portion excluding a thermosetting functional group, and satisfies the following formula (X); and an inorganic filler, the resin material having a content of the inorganic filler of 30 wt % or more in 100 wt % of components excluding a solvent in the resin material: 0.1?A/(B×C)?0.6 . . . Expression (X) A: number of CH3 terminals of a structural portion excluding a thermosetting functional group of the thermosetting compound, B: number of thermosetting functional groups of the thermosetting compound, and C: number of carbon atoms of a structural portion excluding a thermosetting functional group of the thermosetting compound.Type: ApplicationFiled: March 27, 2020Publication date: June 2, 2022Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Akiko KUBO, Tatsushi HAYASHI, Yuko KAWAHARA, Susumu BABA
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Publication number: 20210284833Abstract: Provided is an interlayer insulating material that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The present invention is an interlayer insulating material used for a multilayer printed wiring board, which contains an epoxy compound, a curing agent, a silica, and a polyimide, and in which the polymide is a reactant of a tetracarboxylic anhydride and a dimer acid diamine, a content of the silica is 30% by weight or more and 90% by weight or less in 100% by weight of components excluding a solvent in the interlayer insulating material, and the total content of the epoxy compound and the curing agent in 100% by weight of components excluding the silica and a solvent in the interlayer insulating material is 65% by weight or more.Type: ApplicationFiled: September 28, 2017Publication date: September 16, 2021Inventors: Tatsushi Hayashi, Takashi Nishimura, Susumu Baba
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Publication number: 20210009749Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.Type: ApplicationFiled: March 15, 2019Publication date: January 14, 2021Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Sayaka WAKIOKA, Yuta OATARI, Kohei TAKEDA, Masami SHINDO, Takashi SHINJO, Yuko KAWAHARA, Susumu BABA, Tatsushi HAYASHI
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Patent number: 10767051Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.Type: GrantFiled: September 28, 2017Date of Patent: September 8, 2020Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Tatsushi Hayashi, Takashi Nishimura, Susumu Baba
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Publication number: 20200032059Abstract: Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 ?m or less, and the island part contains the polyimide.Type: ApplicationFiled: September 28, 2017Publication date: January 30, 2020Inventors: Tatsushi Hayashi, Takashi Nishimura, Susumu Baba
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Publication number: 20190031822Abstract: There is provided a resin composition with which the desmear properties can be enhanced, a cured product thereof can be made low in dielectric loss tangent, and the cured product can be made high in heat resistance.Type: ApplicationFiled: March 28, 2017Publication date: January 31, 2019Inventors: Tatsushi Hayashi, Susumu Baba
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Publication number: 20180213635Abstract: Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa·s or less at 25° C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound.Type: ApplicationFiled: September 29, 2016Publication date: July 26, 2018Inventors: Susumu Baba, Tatsushi Hayashi, Hiroshi Kouyanagi
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Patent number: 9324636Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.Type: GrantFiled: June 23, 2014Date of Patent: April 26, 2016Assignee: DAI NIPPON PRINTING CO., LTD.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Publication number: 20140299995Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.Type: ApplicationFiled: June 23, 2014Publication date: October 9, 2014Applicant: Dai Nippon Printing Co., Ltd.Inventors: Susumu BABA, Masachika MASUDA, Hiromichi SUZUKI
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Patent number: 8796832Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.Type: GrantFiled: February 23, 2012Date of Patent: August 5, 2014Assignee: Dai Nippon Printing Co., Ltd.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Patent number: 8647634Abstract: A recombinant avian infectious coryza vaccine and a process for preparing the same are provided. A process for preparing a recombinant avian infectious coryza vaccine which comprises step of constructing E. coli that may produce as an inclusion body a fusion peptide consisting of peptides derived from outer-membrane protein of Avibacterium paragarinarum serotype A and serotype C, step of culturing said E. coli and collecting and purifying inclusion body from culture, and step of preparing a preparation comprising said purified inclusion body, and an avian infectious coryza vaccine comprising as an active ingredient the fusion peptide. A linker sequence may be inserted between the respective peptides comprising the fusion peptide. For the peptide derived from the serotypes A and C, an amino acid sequence region of Region 2 or its vicinity responsible for protection from infection may be used.Type: GrantFiled: December 24, 2009Date of Patent: February 11, 2014Assignee: The Chemo-Sero-Therapeutic Research InstituteInventors: Ryuichi Sakamoto, Susumu Baba, Masashi Sakaguchi, Hiroshi Mizokami
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Publication number: 20130183330Abstract: A recombinant avian infectious coryza vaccine and a process for preparing the same are provided. A process for preparing a recombinant avian infectious coryza vaccine which comprises step of constructing E. coli that may produce as an inclusion body a fusion peptide consisting of peptides derived from outer-membrane protein of Avibacterium paragarinarum serotype A and serotype C, step of culturing said E. coli and colleting and purifying inclusion body from culture, and step of preparing a preparation comprising said purified inclusion body, and an avian infectious coryza vaccine comprising as an active ingredient the fusion peptide. A linker sequence may be inserted between the respective peptides comprising the fusion peptide. For the peptide derived from the serotypes A and C, an amino acid sequence region of Region 2 or its vicinity responsible for protection from infection may be used.Type: ApplicationFiled: September 14, 2012Publication date: July 18, 2013Applicant: THE CHEMO-SERO-THERAPEUTIC RESEARCH INSTITUTEInventors: Ryuichi SAKAMOTO, Susumu Baba, Masashi Sakaguchi, Hiroshi Mizokami
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Patent number: 8471371Abstract: A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.Type: GrantFiled: February 5, 2010Date of Patent: June 25, 2013Assignee: Dai Nippon Printing Co., Ltd.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Publication number: 20120175759Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal.Type: ApplicationFiled: February 23, 2012Publication date: July 12, 2012Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Patent number: 8148804Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device.Type: GrantFiled: January 13, 2009Date of Patent: April 3, 2012Assignee: Dai Nippon Printing Co., Ltd.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Publication number: 20120003257Abstract: A recombinant avian infectious coryza vaccine and a process for preparing the same are provided. A process for preparing a recombinant avian infectious coryza vaccine which comprises step of constructing E. coli that may produce as an inclusion body a fusion peptide consisting of peptides derived from outer-membrane protein of Avibacterium paragarinarum serotype A and serotype C, step of culturing said E. coli and colleting and purifying inclusion body from culture, and step of preparing a preparation comprising said purified inclusion body, and an avian infectious coryza vaccine comprising as an active ingredient the fusion peptide. A linker sequence may be inserted between the respective peptides comprising the fusion peptide. For the peptide derived from the serotypes A and C, an amino acid sequence region of Region 2 or its vicinity responsible for protection from infection may be used.Type: ApplicationFiled: December 24, 2009Publication date: January 5, 2012Applicant: The Chemo-Sero-Therapeutic Research InstituteInventors: Ryuichi Sakamoto, Susumu Baba, Masashi Sakaguchi, Hiroshi Mizokami
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Publication number: 20110006410Abstract: A semiconductor composite wiring assembly includes a wiring assembly and a lead frame. A copper wiring layer of the wiring assembly includes first terminals, second terminals, and wiring sections connecting the terminals. The second terminals and the lead frame are electrically connected by connecting members. The lead frame includes a die pad for mounting the wiring assembly, and lead sections located at outer positions. The die pad includes a central area in which a semiconductor chip is mounted via the wiring assembly, and a peripheral area connected to the central area with spaces formed therebetween that serve as resin-seal inflow spaces. The wiring assembly is positioned over the central area and the peripheral area so as to cover the central area completely and the peripheral area partially, and at least the central area and the peripheral area of the die pad are glued to the wiring assembly by resin paste.Type: ApplicationFiled: February 5, 2010Publication date: January 13, 2011Applicant: Dai Nippon Printing Co., Ltd.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Publication number: 20090189263Abstract: A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device electrically connects an electrode provided on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The metal substrate is provided on one side of the insulating layer. The copper wiring layer is provided on another side of the insulating layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode provided on the semiconductor chip. The second terminal is connected with the external wiring device.Type: ApplicationFiled: January 13, 2009Publication date: July 30, 2009Applicant: DAI NIPPON PRINTING CO., LTD.Inventors: Susumu Baba, Masachika Masuda, Hiromichi Suzuki
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Patent number: 7275005Abstract: An inspection system inspects appearances of a plurality of worked products held by a sheet-like inspection target sheet, and includes an image processing station provided at a first location and defect detection stations provided at one or a plurality of second locations away from the first location. The appearance inspection system includes a marking station. The image processing station images each of the worked products held by the inspection target sheet and extracts image-processed data serving as an inspection target. The defect detection station displays on a computer the image-processed data to urge an operator to detect a defect part, and outputs detection result data including position data on the defect part, based on an instruction from the operator. The marking station gives onto the image-processed inspection target sheet a mark representing the defect part, based on the detection result data output by the defect detection station.Type: GrantFiled: December 17, 2003Date of Patent: September 25, 2007Assignee: Dai Nippon Printing Co., Ltd.Inventors: Susumu Baba, Makoto Futami, Yuichiro Yotsumoto