Patents by Inventor Susumu Chihara

Susumu Chihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Exposure device, image formation apparatus, and method of manufacturing exposure device
    Patent number: 10095151
    Abstract: An exposure device according to one or more embodiments may include a board on which light emitting elements are arranged; an optical system disposed opposite to the board; and a support member which supports the board and the optical system. The exposure device may further include a cured body disposed on the support member and including a board contact surface to come into contact with the board.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: October 9, 2018
    Assignee: Oki Data Corporation
    Inventors: Manabu Imai, Susumu Chihara, Satoshi Fuyuno
  • EXPOSURE DEVICE, IMAGE FORMATION APPARATUS, AND METHOD OF MANUFACTURING EXPOSURE DEVICE
    Publication number: 20170184994
    Abstract: An exposure device includes: a board on which light emitting elements are arranged; an optical system disposed opposite to the board; a support member which supports the board and the optical system; and a cured body disposed on the support member and including a board contact surface to come into contact with the board, wherein the cured body is formed by curing a deformable material.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 29, 2017
    Applicant: Oki Data Corporation
    Inventors: Manabu IMAI, Susumu CHIHARA, Satoshi FUYUNO
  • Semiconductor apparatus, LED print head, and printer
    Patent number: 7456449
    Abstract: A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.
    Type: Grant
    Filed: November 30, 2004
    Date of Patent: November 25, 2008
    Assignee: Oki Data Corporation
    Inventors: Hiroyuki Fujiwara, Takahito Suzuki, Susumu Chihara, Mitsuhiko Ogihara, Ichimatsu Abiko, Masaaki Sakuta
  • Semiconductor apparatus, LED print head, and printer
    Publication number: 20050127389
    Abstract: A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.
    Type: Application
    Filed: November 30, 2004
    Publication date: June 16, 2005
    Inventors: Hiroyuki Fujiwara, Takahito Suzuki, Susumu Chihara, Mitsuhiko Ogihara, Ichimatsu Abiko, Masaaki Sakuta