Abstract: A substrate processing method includes (A) to (C) to be described below. (A) A substrate having a first main surface and a second main surface opposite to the first main surface, and having unevenness on each of the first main surface and the second main surface is prepared. (B) Based on a measurement result of the unevenness of a first surface between the first main surface and the second main surface of the substrate, the first surface is planarized by radiating a laser beam to the first surface. (C) After planarizing the first surface of the substrate, a second surface of the substrate opposite to the first surface is planarized by grinding the second surface.

Abstract: A replacing apparatus is configured to replace a processing tool in a processing apparatus. The processing apparatus includes a holder configured to hold a processing target object, a processing mechanism to which the processing tool configured to process the processing target object held by the holder is installed in a replaceable manner, and an exterior cover accommodating therein the holder and the processing mechanism. The replacing apparatus includes a replacing mechanism, a moving mechanism, a traveling table and a traveling mechanism. The replacing mechanism installs the processing tool to the processing mechanism, or separates the processing tool from the processing mechanism. The moving mechanism is configured to move the replacing mechanism from an outside of the exterior cover to an inside thereof through an entrance opening of the exterior cover. The traveling table supports the moving mechanism. The traveling mechanism is configured to allow the traveling table to travel.

Abstract: A processing apparatus includes a holder configured to hold a processing target object; a processing mechanism to which a processing tool configured to process the processing target object held by the holder is installed in a replaceable manner; and an exterior cover accommodating the holder and the processing mechanism therein. The exterior cover includes an entrance opening through which a replacing apparatus configured to replace the processing tool passes when advancing to an inside of the exterior cover from an outside thereof. The processing apparatus further includes a shutter configured to open or close the entrance opening of the exterior cover.

Abstract: Provided are: an information providing system, an information providing method and a computer program, which are able to detect a position on a screen of a display specified by each of multiple users who view the screen, and to provide each user with information according to the position.

Abstract: In a method for processing a plate object, etching is performed for a flat plate object by a predetermined etching method and the shape of the plate object after the etching is grasped in advance. In a grinding step, the plate object is ground into a grinding-finished shape that is a non-flat shape obtained by inverting the shape of the plate object after the etching to the reverse shape. When subsequent etching by the predetermined etching method is performed for a grinding-target surface, the plate object is formed into a flat shape with a uniform thickness.

Abstract: Provided are: an information providing system, an information providing method and a computer program, which are able to detect a position on a screen of a display specified by each of multiple users who view the screen, and to provide each user with information according to the position.

Abstract: A smart phone (1) of an embodiment of the present invention includes (i) a touch determining section (42) for determining whether or not a touch on a lock region, provided in a peripheral part of a touch panel (2), is detected and (ii) an application executing section (40) for switching, in accordance with a result determined by the touch determining section (42), between enabling and disabling of a specific function.

Abstract: In a method for processing a plate object, etching is performed for a flat plate object by a predetermined etching method and the shape of the plate object after the etching is grasped in advance. In a grinding step, the plate object is ground into a grinding-finished shape that is a non-flat shape obtained by inverting the shape of the plate object after the etching to the reverse shape. When subsequent etching by the predetermined etching method is performed for a grinding-target surface, the plate object is formed into a flat shape with a uniform thickness.