Abstract: A vacuum cleaner capable of shortening time for cleaning and thus performing efficient cleaning in accordance with a cleaning area. The vacuum cleaner includes a main casing, a driving wheel, a cleaning unit, a feature point extraction part, and a control unit. The driving wheel enables the main casing to travel. The cleaning unit cleans a floor surface. The feature point extraction part extracts feature points in a periphery of the main casing. The control unit controls the driving of the driving wheel to make the main casing autonomously travel. The control unit, at the start of cleaning, compares the feature points extracted by the feature point extraction part and feature points corresponding to a previously-stored cleaning area to specify a present cleaning area.

Abstract: A vacuum cleaner includes a charging unit including first and second light emitting parts arranged in positions separated from each other. The light emitting parts transmit respective guide signals to guide a vacuum cleaner body. The charging unit includes a charging unit controller to make the light emitting parts transmit the respective guide signals that are same guide signals and transmitted according to respective timings. The vacuum cleaner body includes a third light emitting part to transmit a demand signal. The vacuum cleaner body includes a light receiving part capable of receiving the respective guide signals transmitted from the first and second light emitting parts. A controller makes the body case travel toward the charging unit depending on respective receiving statuses at the light receiving part of the two guide signals transmitted from the first and second light emitting parts and according to the respective timings.

Abstract: Provided is an electric cleaning device capable of easily and reliably directing a camera toward an object and imaging the object. An electric cleaning device includes an electric vacuum cleaner main body capable of autonomously traveling, and a charging device that guides the electric vacuum cleaner main body, and can image an object. A control part has an imaging mode in which the control part makes a main body case travel so as to approach the charging device in line with guide signals received by a light receiving part, and performs imaging in a set direction with a camera based on the guide signals when the main body case reaches a position at a predetermined distance from the charging device.

Abstract: A vacuum cleaner includes a charging unit including first and second light emitting parts arranged in positions separated from each other. The light emitting parts transmit respective guide signals to guide a vacuum cleaner body. The charging unit includes a charging unit controller to make the light emitting parts transmit the respective guide signals that are same guide signals and transmitted according to respective timings. The vacuum cleaner body includes a third light emitting part to transmit a demand signal. The vacuum cleaner body includes a light receiving part capable of receiving the respective guide signals transmitted from the first and second light emitting parts. A controller makes the body case travel toward the charging unit depending on respective receiving statuses at the light receiving part of the two guide signals transmitted from the first and second light emitting parts and according to the respective timings.

Abstract: Provided is an electric cleaning device capable of easily and reliably directing a camera toward an object and imaging the object. An electric cleaning device includes an electric vacuum cleaner main body capable of autonomously traveling, and a charging device that guides the electric vacuum cleaner main body, and can image an object. A control part has an imaging mode in which the control part makes a main body case travel so as to approach the charging device in line with guide signals received by a light receiving part, and performs imaging in a set direction with a camera based on the guide signals when the main body case reaches a position at a predetermined distance from the charging device.

Abstract: A molding apparatus includes a cavity mold, a core mold, a core pin, and a cavity pin. After molten resin has been filled in a cavity, at least one of the core pin and the cavity pin is moved to be pressed onto the molten resin so that a part of the molten resin is compressed before the molten resin is cured, and a molded hole is formed by cutting off the compressed part of the molten resin by moving the core pin and the cavity pin.

Abstract: An optical disk drive device has an RF equalizer configured to generate an equalized RF signal by controlling a frequency characteristic of a delay time of an RF signal read out from an optical disk based on a control input signal, a playback clock extractor configured to extract a playback clock for reproducing data recorded on the optical disk from the equalized RF signal, and an RF rate controller configured to generate the control input signal inputted to the RF equalizer, wherein the control input signal is a signal for correcting waveform distortion of the RF signal by controlling the delay time of the RF signal dependent on a frequency of the playback clock.

Abstract: A current source circuit has a voltage application terminal that is applied with a prescribed voltage; an output terminal that outputs the current; a first MOS transistor of which a source is connected to the voltage application terminal; a second MOS transistor of which a source is connected to a drain of the first MOS transistor and a drain is connected to the output terminal; a third MOS transistor of which a source is connected to the voltage application terminal; a fourth MOS transistor of which a source is connected to a drain of the third MOS transistor and a drain is connected to the output terminal. The current source circuit, in a state where the bias voltage is applied to the first input terminal such that the predetermined current flows into the first and fourth MOS transistors, controls turning ON/OFF of the second MOS transistor and the third MOS transistor so as to synchronize according to the switch voltage applied to the second input terminal.

Abstract: An optical disk drive device has an RF equalizer configured to generate an equalized RF signal by controlling a frequency characteristic of a delay time of an RF signal read out from an optical disk based on a control input signal, a playback clock extractor configured to extract a playback clock for reproducing data recorded on the optical disk from the equalized RF signal, and an RF rate controller configured to generate the control input signal inputted to the RF equalizer, wherein the control input signal is a signal for correcting waveform distortion of the RF signal by controlling the delay time of the RF signal dependent on a frequency of the playback clock.

Abstract: A CMP apparatus 1 is constructed comprising a wafer chucking mechanism 20 which carries and holds a wafer W, a polishing pad 4 which performs polishing working on the surface of the wafer W that is being worked, and a polishing head 2 which holds the polishing pad 4. The polishing pad 4 held by the polishing head 2 performs polishing working on the surface that is being worked on the wafer W while being caused to move in contact with this surface that is being worked on the wafer W, which is carried and held by the wafer chucking mechanism 20. This polishing pad 4 has a rough polishing pad 4a that can partially work the surface that is being worked, and intermediate polishing and finishing polishing pads 4b and 4c that can uniformly work the entire surface of the surface that is being worked.

Abstract: The polishing body is attached to a substrates. The polishing body has a structure in which a polishing pad, a hard elastic member and a soft members are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufactured by Rodel, Inc. is used as the polishing pad. For example, a stainless steel plate is used as the hard elastic member. A Suba400 (commercial name) manufactured by Rodel, Inc. is used as the soft members. The polishing pad 6 has grooves in the polishing surface side. The residual thickness d of the areas of the grooves in the polishing pad is set so as to satisfy the condition 0 mm<d?0.6 mm. As a result, the ability to eliminate steps can be increased, thus allowing the “local pattern flatness” to be improved, while ensuring the “global removal uniformity”; furthermore, a polishing body with a long useful life can be obtained.

Abstract: An electric vacuum cleaner comprises an electric blower having a commutator motor connected to an alternate current power source though a switching element, a current detecting section detecting a load current flowing in the electric blower, a control section generating a control signal that controls the input power to the vacuum cleaner by adjusting a trigger time of the switching element, wherein a current detecting circuit sends a signal having a periodic waveform derived from the alternate current source to the control section. The control section sets an operation mode to a preparation mode or a cleaning mode. Initially, in the preparation mode a correction value of the load current is acquired with the trigger time set at a predetermined point. In the cleaning mode, the input power is controlled by varying the trigger time of the control signal according to a difference between a load current detected by the current detecting section and the correction value acquired in the preparation mode.

Abstract: A dressing apparatus DA is constructed from a pad holding mechanism 10 which holds a polishing pad 15 that has a doughnut disk-form pad surface 15a, and which causes this polishing pad 15 to rotate, a dressing tool 2 which has a substantially rectangular dressing surface 3, and a dressing tool holding mechanism 1 which holds the dressing tool 2 so that the dressing surface 3 of this dressing tool 2 is caused to face the pad surface 15a of the polishing pad 15 that is held and caused to rotate by the pad holding mechanism 10. The dressing tool holding mechanism 1 causes the held dressing tool 2 to contact the pad surface 15a in a state in which the centerline L1 in the direction of width of the dressing surface 3 is oriented so that this centerline extends in the radial direction of the pad surface 15a, and thus causes dressing to be performed. As a result, the flatness of the working surface following dressing can be improved.

Abstract: A wafer substrate having a wiring pattern formed between materials with a dielectric constant of 2 or less is polished with the polishing pressure being set at 0.01 to 0.2 psi. As a result, favorable polishing can be performed even in cases where a ultra-low-k material having the dielectric constant of 2 or less is used as an insulating material.

Abstract: The polishing body 4 is attached to a substrate 5. The polishing body 4 has a structure in which a polishing pad 6, a hard elastic member 7 and a soft member 8 are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial name) manufactured by Rodel, Inc. is used as the polishing pad 6. For example, a stainless steel plate is used as the hard elastic member 7. A Suba400 (commercial name) manufactured by Rodel, Inc. is used as the soft member 8. The polishing pad 6 has grooves 6 in the polishing surface side. The residual thickness d of the areas of the grooves 6a in the polishing pad 6 is set so as to satisfy the condition 0 mm<d?0.6 mm. As a result, the ability to eliminate steps can be increased, thus allowing the “local pattern flatness” to be improved, while ensuring the “global removal uniformity”; furthermore, a polishing body with a long useful life can be obtained.

Abstract: Polishing equipment, comprising a polishing head (30) having an opened hollow mixing tank (32) on the opposite side of the side thereof where a polishing pad (36) is installed, a slurry feed mechanism (50) for feeding slurry into the mixing tank (32), an additive liquid feed mechanism (60) for feeding additive liquid used by adding to the slurry into the mixing tank (32), and a mixed liquid feed tube (34) extending from the mixing tank (32) into the polishing head (30) and opened to near the rotating center of the polishing pad (36), wherein the slurry fed by the slurry feed mechanism (50) and the additive liquid fed by the additive liquid feed mechanism (60) are fed from the mixed liquid feed tube (34) to the outside of the polishing pad (36) in the mixed state in the mixing tank (32).

Abstract: A dressing apparatus DA is constructed from a pad holding mechanism 10 which holds a polishing pad 15 that has a doughnut disk-form pad surface 15a, and which causes this polishing pad 15 to rotate, a dressing tool 2 which has a substantially rectangular dressing surface 3, and a dressing tool holding mechanism 1 which holds the dressing tool 2 so that the dressing surface 3 of this dressing tool 2 is caused to face the pad surface 15a of the polishing pad 15 that is held and caused to rotate by the pad holding mechanism 10. The dressing tool holding mechanism 1 causes the held dressing tool 2 to contact the pad surface 15a in a state in which the centerline L1 in the direction of width of the dressing surface 3 is oriented so that this centerline extends in the radial direction of the pad surface 15a, and thus causes dressing to be performed. As a result, the flatness of the working surface following dressing can be improved.

Abstract: A CMP apparatus 1 is constructed comprising a wafer chucking mechanism 20 which carries and holds a wafer W, a polishing pad 4 which performs polishing working on the surface of the wafer W that is being worked, and a polishing head 2 which holds the polishing pad 4. The polishing pad 4 held by the polishing head 2 performs polishing working on the surface that is being worked on the wafer W while being caused to move in contact with this surface that is being worked on the wafer W, which is carried and held by the wafer chucking mechanism 20. This polishing pad 4 has a rough polishing pad 4a that can partially work the surface that is being worked, and intermediate polishing and finishing polishing pads 4b and 4c that can uniformly work the entire surface of the surface that is being worked.

Abstract: The wafer 11 that is the object of polishing is held by a polishing head 12, and rotates together with the polishing head 12. A polishing body 14 is attached to the polishing member 13 by bonding using an adhesive agent or two-sided adhesive tape, etc. As is shown in (b), the polishing body 14 is constructed by laminating a soft member 15, a hard elastic member 16 and a polishing pad 17. The hard elastic member 16 is constructed so that the amount of deformation of the hard elastic member 16 at the polishing load that is applied during polishing is smaller than the step difference that is permitted in the above-mentioned wafer in the interval corresponding to the maximum pattern of the above-mentioned semiconductor integrated circuits, and is larger than the TTV that is permitted in the above-mentioned wafer in the interval corresponding to one chip. As a result, the requirements of both “wafer global removal uniformity” and local pattern planarity” can be satisfied.

Abstract: The computational circuit adds a drain current of a first MIS transistor which is driven by inputting a signal obtained by superimposing an AC signal to a DC voltage, and a drain current of a second MIS transistor which is driven by inputting a signal obtained by superimposing the same AC signal as above but reversal in phase to the DC voltage, and subtracts a drain current of a third MIS transistor driven by supplying the DC voltage to the gate thereof so as to erase DC components of the outputs of the first and second MIS transistors. Thereby, it is possible to produce a current in proportional to square of the AC signal.