Abstract: A high-speed, high-density, small-sized, low-cost semiconductor device wherein the feeder substrate 2 for supplying power to the semiconductor elements 3 as a bare chip has the containers 2a for containing the semiconductor elements 3, the semiconductor elements 3 are bonded to the wiring layer 1b of the signal transmission substrate 1 for transmitting signals to the semiconductor elements 3 and contained in the containers 2a, the containers 2a are covered with the signal transmission substrate 1, and the signal transmission substrate 1 is superposed upon and bonded to the feeder substrate 2.

Abstract: A control electrode portion for passing electrons through a given electron-passing hole selected from a plurality of electron-passing holes provided on an insulating substrate is formed by coating the insulating substrate with a conductive film and dividing the into a plurality of conductive films as control electrodes. This structure obviates the mesh structure of electrons which are necessary in the case of arranging control electrodes on the insulating substrate, thereby realizing high-definition display devices with improved luminance.

Abstract: Planar display devices which have a small thickness and used as a display unit of a television set, a monitor or the like. A control electrode portion for passing electrons through a given electron-passing hole selected from a plurality of electron-passing holes provided on an insulating substrate is formed by coating the insulating substrate with a conductive film and dividing them into a plurality of conductive films as control electrodes. This structure obviates the mesh structure of electrons which are necessary in the case of arranging control electrodes on the insulating substrate, thereby realizing high-definition display devices with improved luminance.

Abstract: A local plating apparatus includes a fiber, a laser beam penetrating nozzle or a laser beam penetrating mask through which a laser beam can be directly irradiated on a portion to be plated when plating is conducted on the portion to be plated using a jet of plating solution. The apparatus enables a laser beam to reach the portion to be plated in a stable state, and ensures a high plating speed and uniform plating quality.

Abstract: A method of exposing the resist on a printed wiring board having through holes for connecting planar circuit patterns on the plane surfaces of the substrate is disclosed, wherein an electron beam direct writing system is utilized for scanning a converging electron beam as the exposure energy. The electron beam produced by the system enters the opening of the through hole, forming an inclination angle different from 0 degrees and up to 7 degrees with respect to the normal to the opening area of the through hole, such that the resist on the wall surface of the through hole is exposed simultaneously both by the direct and the reflected electron beam. The amount of exposure per unit area of the opening of the through hole may be controlled to 2 h/r times the amount of exposure per unit area over the planar surface of the substrate, wherein h and r are the depth and the radius of the through holes, respectively.

Abstract: The present invention is directed to a mixture thin film forming apparatus for accumulating gasified components on a substrate which is arranged in a reaction chamber. According to the present invention, respective components of a gas supply system, which are different in heat capacity from each other, are independently controlled in their temperatures by temperature control parts respectively, so that the respective components can be adjusted to desired temperatures. Thus, the gas supply system is prevented from deviation of temperature distribution, whereby the overall gas supply system can be adjusted within a prescribed temperature range. Thus, raw materials are prevented from precipitation, irregular reaction or the like, to enable stable gas supply.

Abstract: A thin high temperature heater includes an adhesive layer of Ti disposed an insulating substrate and a resistor layer of a Ti compound disposed the adhesive layer.

Abstract: A high temperature low density operating element includes a porous high temperature operating element film formed into a predetermined configuration and disposed on one surface of an insulating member with good heat conductivity, a resistive film with a high melting point and good heat conductivity having a higher density than the high temperature operating element film, formed into a predetermined configuration on a second surface of the insulating member with good heat conductivity, a lead wire connected to the resistive film, an insulating protective film disposed on the insulating member covering the resistive film.

Abstract: A fluorescence pattern forming method and apparatus includes electron beams being irradiated over a face panel, on which a fluorescence layer is formed, to form a fluorescence pattern on a color CRT. The fluorescence layer is formed by coating a slurry of fluorescence substance. According to predetermined pattern designing data, a control device causes the electron beams to be irradiated over the fluorescence layer on the face panel so that the fluorescence luminesces. This luminescence is detected by a light detector located on the convex side of the face panel. A correcting device gives a correcting signal to the control device to correct the irradiated position according to the detected light quantity.

Abstract: A thin film forming apparatus of the present invention comprises: a reaction chamber for receiving therein a substrate and a thin film forming gas; an ultraviolet laser beam oscillator for generating an ultraviolet laser beam for causing dissociation of the thin film forming gas to thereby form a thin film over the surface of the substrate; and a plasma generator for generating ions for controlling growth of a thin film.

Abstract: An electron-beam exposure apparatus having a correction function for correcting deflection distortion. The correction function is carried out by the provision of a correcting device including an analog correction unit 35 and a digital correction unit having a memory unit 10 for storing correction data other than data that can be expressed by a cubic function. The capacity of such a memory unit can be made smaller than that of conventional apparatuses.

Abstract: An apparatus for improving the surface quality of a rotary machine part in which a high density beam such as laser beam or electron beam is condensed with collimation to a parallelepiped spatial intensity distribution, the intensity being controllable. The beam is directed to a predetermined surface area of the rotary machine part rotating at a constant angular velocity. A solidified layer formed by rapid solidification of a surface portion of the rotary machine part, which is melted by irradiation by the condensed beam, and a transformation-hardened layer formed below the solidified layer are uniform in thickness, and the transformation-hardened layer is uniformly formed throughout the periphery of the rotary machine part, and thus no cracking and/or pitting occurs.

Abstract: A laser-beam operated machining apparatus capable of performing machining operations on a high-reflectivity material such as aluminum or copper. A nozzle is provided for applying a focused laser beam together with an assist gas to a surface of a workpiece to be machined. An annular electrode is provided on the end of the nozzle confronting the workpiece with the electrode being coaxial with the laser beam. An arc discharge is created between the annular electrode and the workpiece by applying a voltage between the annular electrode and the workpiece so as to cause an arc discharge therebetween.

Abstract: An apparatus for improving the surface quality of a rotary machine part in which a high density beam such as laser beam or electron beam is condensed with collimation to a parallelepiped spatial intensity distribution, the intensity being controllable. The beam is directed to a predetermined surface area of the rotary machine part rotating at a constant angular velocity. A solidified layer formed by rapid solidification of a surface portion of the rotary machine part, which is melted by irradiation by the condensed beam, and a transformation-hardened layer formed below the solidified layer are uniform in thickness, and the transformation-hardened layer is uniformly formed throughout the periphery of the rotary machine part, and thus no cracking and/or pitting occurs.

Abstract: A laser machining apparatus capable of performing high-quality and precise cuts on sharply angled or complexly configured portions of a plate-type workpiece with minimum burn-through loss of material due to thermal saturation. In accordance with the invention, values are prestored representing optimum laser output with respect to the speed of the laser beam relative to the workpiece for various types of workpiece material and thickness of the workpiece. These values are read out and the laser beam controlled in accordance therewith during cutting operations. Some of the values represent a continuous output and are applied for higher speed cutting, while others represent a pulsed output and are applied for lower speed cutting.

Abstract: In producing a motion picture screen from a workpiece by forming a surface with a number of continuously smoothly connected minute projections, a two-dimensional cutter which has a cutting edge constituted by a number of circular arcs connected together in a smooth wavy form lengthwise, each of the arcs having a predetermined curvature .rho..sub.1 and a predetermined central angle .theta..sub.1, and the centers of the neighboring arcs being on opposite sides of the cutting edge, is used to machine the surface of the workpiece by a relative movement between the workpiece and the cutter. A surface is machined that has in a section perpendicular to the length of the cutter a number of circular arcs connected together in a smooth wavy form lengthwise, each of the arcs having a predetermined curvature of .rho..sub.2 and a predetermined central angle .theta..sub.2 and the centers of the neighboring arcs being on opposite sides of the line. The workpiece thus machined can have aluminum, etc.

Abstract: One metallic plate is set upright on another metallic plate and a filler fills each corner formed of both plates. A deposit metal is deposited on and adjacent to each filler to weld the plates to form a recess on that portion to the deposit metal facing a non-welded portion located between the welded plates. Alternatively the recess may be formed by supplying an inert gas to a space formed between the two plates and simultaneously depositing a deposit metal on the plates across the space.

Abstract: In a welding apparatus for overlaying on a base metal, a reverse polarity soft plasma arc is formed between an electrode and the base metal and a welding rod is fed into the arc to weld the base metal by melting the welding rod and the feeding speed of the welding rod is controlled corresponding to the arc current to form a bead having low penetration.The electrode is oscillated and an active gas such as CO.sub.2 or O.sub.2 is incorporated in a shield gas at a rate controlled corresponding to the oscillation of the electrode.