Patents by Inventor Susumu INAKAWA

Susumu INAKAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
    Publication number: 20160141272
    Abstract: A semiconductor device which is provided with: a wiring substrate which has a first region, and a relay pad and a connection pad that are arranged outside the first region; a first semiconductor chip which has an electrode pad that is formed on one surface, and which is mounted on the first region of the wiring substrate; a first wire that connects the electrode pad and the relay pad with each other; and a second wire that connects the relay pad and the connection pad with each other.
    Type: Application
    Filed: June 5, 2014
    Publication date: May 19, 2016
    Inventor: Susumu Inakawa
  • SEMICONDUCTOR DEVICE
    Publication number: 20110074037
    Abstract: A device has a semiconductor chip, a wiring board, a support which supports the semiconductor chip on the wiring board and forms a gap between the semiconductor chip and the wiring board, and a sealing resin injected into the gap and covering the semiconductor chip.
    Type: Application
    Filed: September 23, 2010
    Publication date: March 31, 2011
    Inventors: Hidehiro TAKESHIMA, Susumu INAKAWA