Patents by Inventor Susumu Kida

Susumu Kida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Contactor having conductive particles in a hole as a contact electrode
    Patent number: 7202679
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Grant
    Filed: January 9, 2006
    Date of Patent: April 10, 2007
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Publication number: 20060119374
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Application
    Filed: January 9, 2006
    Publication date: June 8, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Patent number: 7038477
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: May 2, 2006
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Patent number: 6937038
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Grant
    Filed: February 26, 2003
    Date of Patent: August 30, 2005
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Publication number: 20050110509
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Application
    Filed: December 29, 2004
    Publication date: May 26, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Publication number: 20030141884
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Application
    Filed: February 26, 2003
    Publication date: July 31, 2003
    Applicant: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Contactor having conductive particles in a hole as a contact electrode
    Patent number: 6545363
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: April 8, 2003
    Assignee: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays
    Patent number: 6476417
    Abstract: A semiconductor device for picking up an image includes a lens-mounting unit provided with a lens for picking up an image; a semiconductor chip having a light-receiving element formed on a circuit-forming surface thereof, the light-receiving element converting light from the lens into an image signal; a flexible substrate provided between the lens-mounting unit and the semiconductor chip so as to supply the image signal to an external circuit; and a shading plate blocking light transmitting through the flexible substrate toward the semiconductor chip so as to substantially remove an influence of the light on the light-receiving element.
    Type: Grant
    Filed: March 28, 2001
    Date of Patent: November 5, 2002
    Assignee: Fujitsu Limited
    Inventors: Toshiyuki Honda, Susumu Kida, Hideo Suzuki
  • Image-pickup semiconductor device having a lens, a light-receiving element and a flexible substrate therebetween with a shading plate blocking undesired light rays
    Publication number: 20020047119
    Abstract: A semiconductor device for picking up an image comprises a lens-mounting unit provided with a lens for picking up an image; a semiconductor chip having a light-receiving element formed on a circuit-forming surface thereof, the light-receiving element converting light from the lens into an image signal; a flexible substrate provided between the lens-mounting unit and the semiconductor chip so as to supply the image signal to an external circuit; and a shading plate blocking light transmitting through the flexible substrate toward the semiconductor chip so as to substantially remove an influence of the light on the light-receiving element.
    Type: Application
    Filed: March 28, 2001
    Publication date: April 25, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Toshiyuki Honda, Susumu Kida, Hideo Suzuki
  • Contactor having conductive particles in a hole as a contact electrode
    Publication number: 20020013010
    Abstract: A contactor is provided which contactor comprises an insulating substrate, a concave portion formed in the insulating substrate and extending in a perpendicular direction from a surface thereof, and elastic conductive particles disposed in the concave portion. A part of one of the conductive particles protrudes from the surface of the insulating substrate.
    Type: Application
    Filed: January 8, 2001
    Publication date: January 31, 2002
    Applicant: Fujitsu Limited
    Inventors: Shigeyuki Maruyama, Susumu Kida, Naoyuki Watanabe, Takafumi Hashitani, Ei Yano, Ichiro Midorikawa
  • Semiconductor device with leads engaged with notches
    Patent number: 6111312
    Abstract: A semiconductor device is provided. This semiconductor device includes a resin package, a semiconductor chip, and leads consisting of inner leads and outer leads. The rear surface of the semiconductor chip and the inner leads are situated substantially on the same plane. The resin package is provided with notches on its mounting surface. The outer leads are bent inward along the exterior of the resin package and pulled around to the mounting surface, so that the edges of the outer leads are engaged with the notches.
    Type: Grant
    Filed: June 2, 1999
    Date of Patent: August 29, 2000
    Assignee: Fujitsu Limited
    Inventors: Yosuke Hirumuta, Yuji Akashi, Susumu Kida
  • Package for electronic device and method for producing same
    Patent number: 4590672
    Abstract: A package having an enclosure for accommodating an electronic device, and the process of producing same. The process comprises the steps of providing a lead frame which has at least a final layer electroplated on the outerlead area thereof; bonding an electronic device in the enclosure; connecting the electronic device with an innerlead area of the lead frame by means of wires; and, thereafter, sealing the enclosure with fused glass in such a manner that the outerlead area extends out of the glass.
    Type: Grant
    Filed: July 20, 1982
    Date of Patent: May 27, 1986
    Assignee: Fujitsu Limited
    Inventors: Shokichi Shimizu, Hideji Aoki, Susumu Kida, Yuki Kanazawa
  • Highly reliable hermetically sealed package for a semiconductor device
    Patent number: 4558346
    Abstract: A semiconductor device having a hermetically sealed package which includes a package substrate having a gold layer, an integrated-circuit chip attached to the gold layer, a terminal metal chip attached to the gold layer so as to ground the terminal metal chips leads, bonding wires, a cap, and glass layers for sealing the device. The terminal metal chip has a lower coating layer made of a gold-silicon type of alloy for attachment. The bond strength of the terminal metal chip is not decreased although a heat treatment is carried out to seal the glass.
    Type: Grant
    Filed: March 23, 1983
    Date of Patent: December 10, 1985
    Assignee: Fujitsu Limited
    Inventors: Susumu Kida, Hayato Usami, Hideji Aoki