Abstract: A power converter comprising: a power conversion circuit to convert an input power into a direct current power or an alternating current power; a base member made of resin on which the power conversion circuit is mounted; a cover member, wherein the power conversion circuit is housed between the cover member and the base member; a coolant flow path provided in an interior of the base member, through which a coolant for cooling the power conversion circuit is circulated; and a temperature sensor provided on the base member, to sense the temperature of the coolant circulating through the coolant flow path, wherein the temperature sensor has a conductive member including at least a thermistor, and at least a part of the conductive member is surrounded by a resin wall formed of an insulating material.

Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.

Abstract: A power converter comprising: a power conversion circuit to convert an input power into a direct current power or an alternating current power; a base member made of resin on which the power conversion circuit is mounted; a cover member, wherein the power conversion circuit is housed between the cover member and the base member; a coolant flow path provided in an interior of the base member, through which a coolant for cooling the power conversion circuit is circulated; and a temperature sensor provided on the base member, to sense the temperature of the coolant circulating through the coolant flow path, wherein the temperature sensor has a conductive member including at least a thermistor, and at least a part of the conductive member is surrounded by a resin wall formed of an insulating material.

Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.

Abstract: A power conversion unit is provided with a power conversion module performing conversion between direct current power and alternating current power, a first bus bar connected to the power conversion module and inputting and outputting the power, a chassis housing the power conversion module, and a terminal connecting the first bus bar and a second bus bar connected to an external device. The terminal and at least a part of the chassis are integrally formed of a resin.

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6?B/A?1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract: A bus bar unit is provided with a plurality of bus bars and an insulating holder. The insulating holder holds the bus bars in a parallel arrangement and insulates between the bus bars. The insulating holder includes a molded portion, a wall portion and a groove portion. The molded portion covers an entire periphery of at least one bus bar from among the plurality of the bus bars. The wall portion is provided at a position spaced apart from a side surface of the molded portion to insulate the bus bars. The groove portion holds a remaining bus bar between the molded portion and the wall portion.

Abstract: A bus bar unit is provided with a plurality of bus bars and an insulating holder. The insulating holder holds the bus bars in a parallel arrangement and insulates between the bus bars. The insulating holder includes a molded portion, a wall portion and a groove portion. The molded portion covers an entire periphery of at least one bus bar from among the plurality of the bus bars. The wall portion is provided at a position spaced apart from a side surface of the molded portion to insulate the bus bars. The groove portion holds a remaining bus bar between the molded portion and the wall portion.

Abstract: An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10° C. to 250° C. and a heating speed is 10° C./min, and wherein T2 is 30° C. or higher, and T4?T2 is greater than 0° C. but 80° C. or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

Abstract: An anisotropic conductive film for anisotropically conductively connecting a terminal of a first electronic component and a terminal of a second electronic component, the anisotropic conductive film including: a conductive particle-containing layer, which contains an adhesive layer-forming component and conductive particles, wherein the conductive particle-containing layer has two endothermic peaks in differential scanning calorimetry where endothermic peak temperatures are measured under conditions that a measuring temperature range is from 10° C. to 250° C. and a heating speed is 10° C./min, and wherein T2 is 30° C. or higher, and T4?T2 is greater than 0° C. but 80° C. or less, where T2 is a temperature of the endothermic peak present at a lower temperature side, and T4 is a temperature of the endothermic peak present at a higher temperature side.

Abstract: A method for manufacturing a mounting body comprising: a mounting step of mounting an electronic component onto a wiring board via an anisotropic conductive film containing a binder having an epoxy resin as a primary constituent and conductive particles having a compressive hardness (K) of 500 kgf/mm2 or more when compressively deformed by 10%, wherein a relation between a thickness (A) of the binder and an average particle diameter (B) is 0.6?B/A?1.5 and an elastic modulus of the binder after curing is 50 MPa or more at 100° C.; and a remounting step of mechanically peeling to detach the electronic component and the wiring board in the case of a problem occurring in mounting of the mounting step and reusing the wiring board to perform the mounting step.

Abstract: Provided is an electronic circuit device in which the bonding state of electrodes can be detected easily with high precision. The electronic circuit device has a stack structure in which a plurality of electronic circuit boards (1a, 1b, 100a, 100b, 100c) are stacked in three or more layers through ball electrodes (10a, 10b, 20a, 20b) bonded to electrode pads (30a, 30b, 40b, 50a, 60a), wherein the electrode pads are disposed such that transmission shaded images of a pair of the electrode pads provided between adjacent layers partially overlap each other and have a non-overlapping region in which the transmission shaded images of the pair of electrode pads are free from overlapping and such that the transmission shaded image of the non-overlapping region is at least partially free from overlapping with transmission shaded images of all the other electrode pads.

Abstract: Provided is an electronic circuit device in which the bonding state of electrodes can be detected easily with high precision. The electronic circuit device has a stack structure in which a plurality of electronic circuit boards (1a, 1b, 100a, 100b, 100c) are stacked in three or more layers through ball electrodes (10a, 10b, 20a, 20b) bonded to electrode pads (30a, 30b, 40b, 50a, 60a), wherein the electrode pads are disposed such that transmission shaded images of a pair of the electrode pads provided between adjacent layers partially overlap each other and have a non-overlapping region in which the transmission shaded images of the pair of electrode pads are free from overlapping and such that the transmission shaded image of the non-overlapping region is at least partially free from overlapping with transmission shaded images of all the other electrode pads.