Patents by Inventor Susumu Mitani

Susumu Mitani has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solder alloy for die bonding
    Patent number: 10189119
    Abstract: An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding which contains 0.05% by mass to 3.0% by mass of antimony and the remainder consisting of bismuth and inevitable impurities, and a solder alloy for die bonding which contains 0.01% by mass to 2.0% by mass of germanium and the remainder consisting of bismuth and inevitable impurities.
    Type: Grant
    Filed: January 21, 2014
    Date of Patent: January 29, 2019
    Assignees: Nihon Handa Co., Ltd., Fuji Electric Co., Ltd.
    Inventors: Takeshi Asagi, Susumu Mitani, Hirohiko Watanabe, Masayoshi Shimoda
  • SOLDER ALLOY FOR DIE BONDING
    Publication number: 20150258637
    Abstract: An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding which contains 0.05% by mass to 3.0% by mass of antimony and the remainder consisting of bismuth and inevitable impurities, and a solder alloy for die bonding which contains 0.01% by mass to 2.0% by mass of germanium and the remainder consisting of bismuth and inevitable impurities.
    Type: Application
    Filed: January 21, 2014
    Publication date: September 17, 2015
    Applicants: Nihon Handa Co., Ltd., Fuji Electric Co., Ltd.
    Inventors: Takeshi Asagi, Susumu Mitani, Hirohiko Watanabe, Masayoshi Shimoda
  • Ultrasonic inspecting apparatus
    Patent number: 4571999
    Abstract: In an ultrasonic inspecting apparatus, propagation time is measured between a transmitting point of an ultrasonic wave from outer circumference of a subject material and a receiving point of the ultrasonic wave at another point on the outer circumference spaced apart from the transmitting point by a predetermined angle, and a predetermined sequence of operations is performed with the measured propagation times and the known constants, thereby internal information concerning the material, including location and shape of a defect existing therein, is provided.
    Type: Grant
    Filed: April 20, 1984
    Date of Patent: February 25, 1986
    Assignees: Nippon Telegraph and Telephone Public Corporation, Mitsubishi Denki Kabushiki Kaisha
    Inventors: Kishio Arita, Susumu Mitani, Hideo Sakai, Yoshikazu Sudo, Yoshitaka Koide, Haruzi Sato, Yoshio Habuka, Takashi Kozakai, Hiroji Tanaka