Abstract: A photoelectric sensor comprises a control unit which performs a measuring process for data on an amount of light input from a light-receiving unit. The control unit measures the length TPS of period (from point a to point d) from when measurement data starts to change in the direction of a threshold P0 to when the amount of received light returns to the level at which the measurement data started to change, and the length TON of period (from point b to point c) for which the detection signal is ON-level. The control unit then outputs information on a margin for TPS with respect to TON on a display unit provided for the photoelectric sensor or to an external device in order to display them.

Abstract: A photoelectric sensor comprises a control unit which performs a measuring process for data on an amount of light input from a light-receiving unit. The control unit measures the length TPS of period (from point a to point d) from when measurement data starts to change in the direction of a threshold P0 to when the amount of received light returns to the level at which the measurement data started to change, and the length TON of period (from point b to point c) for which the detection signal is ON-level. The control unit then outputs information on a margin for TPS with respect to TON on a display unit provided for the photoelectric sensor or to an external device in order to display them.

Abstract: A semiconductor package for surface mounting has a substrate having electrode patterns formed on both its surfaces which are electrically connected through passages such as throughholes formed through the substrate, all of these electrode patterns having a metal film formed by an electrolytic plating process. Semiconductor chips are wire-bonded onto one its surfaces (mounting surface) which is sealed with a resin layer. Lead-in wires each with one end exposed externally are included only those of the electrode patterns on the back surface of the substrate opposite its mounting surface such that the mounting surface has no lead-in wires with a part exposed externally.

Abstract: A semiconductor package for surface mounting has a substrate having electrode patterns formed on both its surfaces which are electrically connected through passages such as throughholes formed through the substrate, all of these electrode patterns having a metal film formed by an electrolytic plating process. Semiconductor chips are wire-bonded onto one its surfaces (mounting surface) which is sealed with a resin layer. Lead-in wires each with one end exposed externally are included only those of the electrode patterns on the back surface of the substrate opposite its mounting surface such that the mounting surface has no lead-in wires with a part exposed externally.

Abstract: A sensor has an emitting device for emitting radiation pulses repeatedly and a receiving device for receiving these pulses. The receiving device includes a converter such as a photoelectric converter to convert the received radiation pulses into electrical pulses. On the basis of a known waveform characteristic or characteristics of true electrical pulse it is judged if a pulse which appears on the output line of the converter is a true electrical pulse caused by receiving the radiation pulse emitted from the emitting device or a false electrical pulse caused by noise. The result of this judgment is outputted from an output device. The emitting device may serve to emit the pulses according to a specified bit pattern and the receiving device may serve to compare the pattern of received pulses with a standard bit pattern and to thereby distinguish between true and false electrical pulses.

Abstract: A light detecting IC has a single light receiving element, a first signal processing circuit for processing signals outputted from this light receiving element, a pair of input terminals for receiving signals from outside, a second signal processing circuit for processing signals received from outside through the input terminals, and a switch circuit for selecting one from these two signal processing circuits and outputting results of processing by the selected signal processing circuit. A divided photodiode with two light receiving elements may be connected to the input terminals. Alternatively, another light receiving element which has a larger light receiving surface than the single light receiving element installed on the IC may be connected to one of the pair of input terminals.

Abstract: A photoelectric sensor transmits pulsed light repetitively, receives light which may include noise and generates a corresponding electrical reception signal. The level of reception signal is compared with a specified threshold value at a timing which is slightly delayed from the timing of light transmission. A sensor output is generated on the basis of the result of this comparison. If periodically changing noise is present and the reception signal has an AC waveform, the level of the reception signal is compared with another threshold value proximal to an AC zero level. The timing of next light transmission is controlled on the basis of the result of the second comparison.

Abstract: A photoelectric sensor has an emitting device for emitting radiation pulses repeatedly and a receiving device for receiving these pulses. The receiving device includes a converter such as a photoelectric converter to convert the received radiation pulses into electrical pulses. On the basis of a known waveform characteristic or characteristics of true electrical pulse it is judged if a pulse which appears on the output line of the converter is a true electrical pulse caused by receiving the radiation pulse emitted from the emitting device or a false electrical pulse caused by noise. The result of this judgment is outputted from an output device. The emitting device may serve to emit the pulses according to a specified bit pattern and the receiving device may serve to compare the pattern of received pulses simultaneously with two or more standard bit patterns and to thereby distinguish between true and false electrical pulses.

Abstract: A photoelectric sensor transmits pulsed light repetitively, receives light which may include noise and generates a corresponding electrical reception signal. The level of reception signal is compared with a specified threshold value at a timing which is slightly delayed from the timing of light transmission. A sensor output is generated on the basis of the result of this comparison. If periodically changing noise is present and the reception signal has an AC waveform, the level of the reception signal is compared with another threshold value proximal to an AC zero level. The timing of next light transmission is controlled on the basis of the result of the result of the second comparison.

Abstract: A sensor has an emitting device for emitting radiation pulses repeatedly and a receiving device for receiving these pulses. The receiving device includes a converter such as a photoelectric converter to convert the received radiation pulses into electrical pulses. On the basis of a known waveform characteristic or characteristics of true electrical pulse it is judged if a pulse which appears on the output line of the converter is a true electrical pulse caused by receiving the radiation pulse emitted from the emitting device or a false electrical pulse caused by noise. The result of this judgment is outputted from an output device. The emitting device may serve to emit the pulses according to a specified bit pattern and the receiving device may serve to compare the pattern of received pulses with a standard bit pattern and to thereby distinguish between true and false electrical pulses.

Abstract: A light detecting IC has a single light receiving element, a first signal processing circuit for processing signals outputted from this light receiving element, a pair of input terminals for receiving signals from outside, a second signal processing circuit for processing signals received from outside through the input terminals, and a switch circuit for selecting one from these two signal processing circuits and outputting results of processing by the selected signal processing circuit. A divided photodiode with two light receiving elements may be connected to the input terminals. Alternatively, another light receiving element which has a larger light receiving surface than the single light receiving element installed on the IC may be connected to one of the pair of input terminals.