Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

Abstract: An engraved plate which includes a substrate and an insulating layer on a surface of the substrate wherein a concave portion which increases in width toward an opening and to which the substrate is exposed is formed at the insulating layer, and an engraved plate, a substrate with conductor layer pattern manufactured by a transferring method using the engraved plate, and a conductor layer pattern are provided.

Abstract: A semiconductor device fabrication process comprising an encapsulation step of carrying out encapsulation by vacuum pressure differential printing by the use of a liquid resin encapsulant containing a solvent in an amount of from 5% by weight to 50% by weight, and preferably from 25% by weight to 50% by weight. The encapsulation step comprises: printing the liquid resin encapsulant by vacuum pressure differential printing in such a way that; the encapsulant covers at least an internal connecting terminal provided on a substrate, a semiconductor chip, and a wire interconnecting the internal connecting terminal and the semiconductor chip; and that the thickness of the encapsulant lying above the wire at the highest position of the wire comes to be at least 0.8 times the thickness of the encapsulant lying beneath the wire at the same position; and curing or drying the encapsulant.

Abstract: A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The cavity portion capable of mounting the semiconductor chip (1) at the center portion of the substrate is formed by press forming with a projected portion (13a) of a die (13) while adhering a press shapeable wiring body comprising a copper wiring (12) which becomes wiring material, a barrier layer (11) such as nickel alloy or the like, and a copper foil (10) which is a carrier layer, to a plastic substrate (14,15), so as to have wiring (2) buried into a surface of the substrate and to form a ramp between an inner connection terminal portion connecting to the semiconductor chip (1) and an external connection terminal portion connecting to an external connection terminals (5), the internal and external connection terminal portions being two edge portions of the wiring (2).

Abstract: A multistylus head device which comprises a vast plurality of insulated wires embedded in an insulating substrate having through-holes. The present multistylus device is characterized in that the insulated wires have their respective free terminals exposed on one edge of said insulating substrate and disposed in parallel at predetermined equal intervals in close proximity to each other to form electrodes and have their other terminals exposed respectively on the inner walls of said through-holes; and said other exposed terminals of the insulated wires are connected respectively to metal layers electrolessly deposited on the inner walls of the through-holes. The present multistylus head device is compact in size and excellent in reliability of terminal connection and is capable of recording a transmitted information with high density of printing.