Patents by Inventor Susumu Omi
Susumu Omi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8824516Abstract: In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.Type: GrantFiled: September 6, 2013Date of Patent: September 2, 2014Assignee: Sharp Kabushiki KaishaInventors: Toshiyuki Kawakami, Tomoki Ono, Shigetoshi Ito, Susumu Omi
-
Publication number: 20140010252Abstract: In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.Type: ApplicationFiled: September 6, 2013Publication date: January 9, 2014Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki KAWAKAMI, Tomoki ONO, Shigetoshi ITO, Susumu OMI
-
Patent number: 8548019Abstract: In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.Type: GrantFiled: April 3, 2012Date of Patent: October 1, 2013Assignee: Sharp Kabushiki KaishaInventors: Toshiyuki Kawakami, Tomoki Ono, Shigetoshi Ito, Susumu Omi
-
Publication number: 20120230357Abstract: In a GaN-based laser device having a GaN-based semiconductor stacked-layered structure including a light emitting layer, the semiconductor stacked-layered structure includes a ridge stripe structure causing a stripe-shaped waveguide, and has side surfaces opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.Type: ApplicationFiled: April 3, 2012Publication date: September 13, 2012Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki KAWAKAMI, Tomoki ONO, Shigetoshi ITO, Susumu OMI
-
Patent number: 7804880Abstract: In one embodiment of the present invention, a long-life nitride semiconductor laser element is disclosed wherein voltage characteristics do not deteriorate even when the element is driven at high current density. Specifically disclosed is a nitride semiconductor laser element which includes a p-type nitride semiconductor and a p-side electrode formed on the p-type nitride semiconductor. In at least one embodiment, the p-side electrode has a first layer which is in direct contact with the p-type nitride semiconductor and a conductive second layer formed on the first layer, and the second layer contains a metal element selected from the group consisting of Ti, Zr, Hf, W, Mo and Nb, and an oxygen element.Type: GrantFiled: June 2, 2006Date of Patent: September 28, 2010Assignee: Sharp Kabushiki KaishaInventors: Shigetoshi Ito, Kunihiro Takatani, Susumu Omi
-
Publication number: 20090095964Abstract: In one embodiment of the present invention, a long-life nitride semiconductor laser element is disclosed wherein voltage characteristics do not deteriorate even when the element is driven at high current density. Specifically disclosed is a nitride semiconductor laser element which includes a p-type nitride semiconductor and a p-side electrode formed on the p-type nitride semiconductor. In at least one embodiment, the p-side electrode has a first layer which is in direct contact with the p-type nitride semiconductor and a conductive second layer formed on the first layer, and the second layer contains a metal element selected from the group consisting of Ti, Zr, Hf, W, Mo and Nb, and an oxygen element.Type: ApplicationFiled: June 2, 2006Publication date: April 16, 2009Inventors: Shigetoshi Ito, Kunihiro Takatani, Susumu Omi
-
Patent number: 7167489Abstract: According to an aspect of the present invention, a nitride semiconductor laser device includes a nitride semiconductor active layer, and a stripe-shaped waveguide for guiding light generated in the active layer. At least one pair of light-absorbing films are provided in at least local regions on the opposite sides of the stripe-shaped waveguide, to reach a distance within 0.3 ?m from the waveguide. According to another aspect of the present invention, a gan-based semiconductor laser device includes first conductivity type semiconductor layers, a semiconductor active layer and second conductivity type semiconductor layers stacked sequentially. The laser device further includes a ridge stripe provided to cause a refractive index difference for confinement of light in a lateral direction crossing a longitudinal direction of a cavity, and a current-introducing window portion provided on the ridge stripe.Type: GrantFiled: July 18, 2002Date of Patent: January 23, 2007Assignee: Sharp Kabushiki KaishaInventors: Toshiyuki Kawakami, Yukio Yamasaki, Tomoki Ono, Shigetoshi Ito, Susumu Omi
-
Patent number: 7041523Abstract: In a wafer having an LD structure 251 formed on a GaN-based substrate 250, cleavage guide grooves 252 are formed in its surface by scribing from above the LD structure 251 with a diamond needle. The cleavage guide grooves 252 are formed one along each of stripe-shaped waveguides 253 formed parallel to the <1-100> direction of the wafer, and are formed in the shape of broken lines in the <11-20> direction of the wafer.Type: GrantFiled: April 2, 2004Date of Patent: May 9, 2006Assignee: Sharp Kabushiki KaishaInventors: Toshiyuki Kawakami, Yukio Yamasaki, Shigetoshi Ito, Susumu Omi
-
Publication number: 20050030995Abstract: In a GaN-based laser device (100) having a GaN-based semiconductor stacked-layered structure including a light emitting layer (106), the semiconductor stacked-layered structure includes a ridge stripe structure (111) causing a stripe-shaped waveguide, and has side surfaces (117, 118) opposite to each other to sandwich the stripe-shaped waveguide in its width direction therebetween. At least part of at least one of the side surfaces (117, 118) is processed to prevent the stripe-shaped waveguide from functioning as a Fabry-Perot resonator in the width direction.Type: ApplicationFiled: September 1, 2004Publication date: February 10, 2005Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Kawakami, Tomoki Ono, Shigetoshi Ito, Susumu Omi
-
Patent number: 6842470Abstract: A nitride-type compound semiconductor laser device includes a substrate and a layered structure provided on the substrate. A light absorption layer having a bandgap smaller than a bandgap of an active layer in the layered structure is provided in a position between the cladding layer, which is provided on a side opposite to a mount surface with respect to the active layer, and a surface of the layered structure which is opposite to the mount surface.Type: GrantFiled: November 22, 2002Date of Patent: January 11, 2005Assignee: Sharp Kabushiki KaishaInventors: Susumu Omi, Toshiyuki Okumura, Kazuhiko Inoguchi
-
Publication number: 20040245537Abstract: According to an aspect of the present invention, a nitride semiconductor laser device includes a nitride semiconductor active layer (106), and a stripe-shaped waveguide for guiding light generated in the active layer. At least one pair of light-absorbing films (112) are provided in at least local regions on the opposite sides of the stripe-shaped waveguide, to reach a distance within 0.3 &mgr;m from the waveguide. According to another aspect of the present invention, a GaN-based semiconductor laser device includes first conductivity type semiconductor layers (103-105), a semiconductor active layer (106) and second conductivity type semiconductor layers (107-110) stacked sequentially. The laser device further includes a ridge stripe (111) provided to cause a refractive index difference for confinement of light in a lateral direction crossing a longitudinal direction of a cavity, and a current-introducing window portion (114) provided on the ridge stripe.Type: ApplicationFiled: March 18, 2004Publication date: December 9, 2004Inventors: Toshiyuki Kawakami, Yukio Yamasaki, Tomoki Ono, Shigetoshi Ito, Susumu Omi
-
Publication number: 20040191942Abstract: In a wafer having an LD structure 251 formed on a GaN-based substrate 250, cleavage guide grooves 252 are formed in its surface by scribing from above the LD structure 251 with a diamond needle. The cleavage guide grooves 252 are formed one along each of stripe-shaped waveguides 253 formed parallel to the <1-100> direction of the wafer, and are formed in the shape of broken lines in the <11-20> direction of the wafer.Type: ApplicationFiled: April 2, 2004Publication date: September 30, 2004Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Kawakami, Yukio Yamasaki, Shigetoshi Ito, Susumu Omi
-
Patent number: 6737678Abstract: In a wafer having an LD structure 251 formed on a GaN-based substrate 250, cleavage guide grooves 252 are formed in its surface by scribing from above the LD structure 251 with a diamond needle. The cleavage guide grooves 252 are formed one along each of stripe-shaped waveguides 253 formed parallel to the <1-100>direction of the wafer, and are formed in the shape of broken lines in the <11-20>direction of the wafer.Type: GrantFiled: July 3, 2002Date of Patent: May 18, 2004Assignee: Sanyo Electric Co., Ltd.Inventors: Toshiyuki Kawakami, Yukio Yamasaki, Shigetoshi Ito, Susumu Omi
-
Publication number: 20030103539Abstract: A nitride-type compound semiconductor laser device includes a substrate and a layered structure provided on the substrate. A light absorption layer having a bandgap smaller than a bandgap of an active layer in the layered structure is provided in a position between the cladding layer, which is provided on a side opposite to a mount surface with respect to the active layer, and a surface of the layered structure which is opposite to the mount surface.Type: ApplicationFiled: November 22, 2002Publication date: June 5, 2003Inventors: Susumu Omi, Toshiyuki Okumura, Kazuhiko Inoguchi
-
Patent number: 6549552Abstract: A nitride-type compound semiconductor laser device includes a substrate and a layered structure provided on the substrate. A light absorption layer having a bandgap smaller than a bandgap of an active layer in the layered structure is provided in a position between the cladding layer, which is provided on a side opposite to a mount surface with respect to the active layer, and a surface of the layered structure which is opposite to the mount surface.Type: GrantFiled: August 31, 1998Date of Patent: April 15, 2003Assignee: Sharp Kabushiki KaishaInventors: Susumu Omi, Toshiyuki Okumura, Kazuhiko Inoguchi
-
Publication number: 20030030053Abstract: In a wafer having an LD structure 251 formed on a GaN-based substrate 250, cleavage guide grooves 252 are formed in its surface by scribing from above the LD structure 251 with a diamond needle. The cleavage guide grooves 252 are formed one along each of stripe-shaped waveguides 253 formed parallel to the <1-100>direction of the wafer, and are formed in the shape of broken lines in the <11-20>direction of the wafer.Type: ApplicationFiled: July 3, 2002Publication date: February 13, 2003Applicant: SHARP KABUSHIKI KAISHAInventors: Toshiyuki Kawakami, Yukio Yamasaki, Shigetoshi Ito, Susumu Omi
-
Patent number: 5182630Abstract: A semiconductor device is provided with: a semiconductor element having a mounting face; a lead frame including a die pad having an upper surface on which the semiconductor element is mounted with the mounting face facing to the upper surface of the die pad. The die pad has such an outer shape that a central portion of each sides opposed to each other is caved more inward than an outer shape of the mounting face of the semiconductor element. The semiconductor device is also provided with: a resin film coated on a lower surface of the die pad, and a portion of the mounting face of the semiconductor element, exposed at the central portion of each side of the die pad which is opposed to each other; and a package body made of molding compound for encapsulating the semiconductor element, the die pad and the resin film. The resin film is made of resin having a high adhesiveness with respect to the semiconductor element, the die pad and the molding compound of the package body.Type: GrantFiled: February 7, 1992Date of Patent: January 26, 1993Assignee: Sharp Kabushiki KaishaInventors: Susumu Omi, Kazuya Fujita