Patents by Inventor Susumu Sakuragi

Susumu Sakuragi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer circuit board and method for manufacturing same
    Publication number: 20040148766
    Abstract: The present invention provides the miniaturization and weight reduction of the multi-layer circuit board and improvement in the processability thereof. The multi-layer circuit board comprises a substrate 10, on at least one surface of a substrate 10, a first electrical conductive circuit (metal plating film 30) disposed on the substrate 10, an resin layer 20 disposed on the first electrical conductive circuit and a second electrical conductive circuit (metal plating film 30) disposed on the resin layer. The resin layer 20 is composed of a resin compound including benzocyclobutene resin, particulate inorganic filler and ultraviolet absorbent.
    Type: Application
    Filed: January 15, 2004
    Publication date: August 5, 2004
    Inventors: Jinichi Noguchi, Shukichi Takii, Satoshi Ootsuki, Hiroyuki Makino, Susumu Sakuragi, Masaru Tanaka, Toshio Komiyatani, Iji Onozuka