Abstract: To realize a roundness measuring instrument of which the measurement precision when there is eccentricity has been improved.

Abstract: In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations by an A/E (air/electricity) converter 18. The detected value is compared with the master reference value by a controller 20 to convert the detected value into the inside diameter of the hole 22A. Thereby, the shape of various holes can be measured.

Abstract: In a measuring apparatus 10, an arm 36 is lowered to insert a measuring sphere 30 into a hole 22A in a workpiece 22, and further the measuring sphere 30 is lowered in the depth direction of the hole 22A. Thereby, the back pressure of compressed air is detected at a plurality of locations by an A/E converter 18. The detected value is compared with the master reference value by a controller 20 to convert the detected value into the inside diameter of the hole 22A. Thereby, the shape of various holes can be measured.

Abstract: A cylindrically formed master work is inserted into a work socket hole, and the master work is held at the center of the work socket hole by injecting compressed air from the inner circumferential face of the work socket hole toward the center of the work socket hole. In this state, the master work is rotated, and the end face of the master work is imaged three times with a CCD camera at different rotational angles. By computing the positions of bore centers from the three sets of obtained image data and the center of a circle passing those bore centers, the external shape center of the master work projected on the CCD is determined. Thus, the position of the external shape center of the work is easily and accurately determined.

Abstract: The rotational center of a grinding wheel is eccentric to a slicing side in a slice feed direction with regard to the rotational center of an inner diameter saw. As a result, the diameter of the grinding wheel can be smaller, and the slice movement distance of the ingot can be shorter. Therefore, it is possible to provide a low-priced slicing machine with built-in grinder wherein a slicing time is short and the grinding face is accurate.

Abstract: In an apparatus and a method for slicing a cylindrical semiconductor ingot into thin wafer pieces using an inner peripheral sliding blade, a grind stone shaft with a grind stone mounted to the tip end thereof is located movably axially within a rotor provided with the inner perpheral sliding blade so that the grind stone shaft and rotor can be rotated integrally but axially movable relative to each other. the grind stone and slicing blade are arranged effieciently so that, after the semiconductor ingot is sliced with the slicing blade, the grind stone approaches the end face of the ingot to grind it. This can save a lapping step, thereby improving working efficiency.

Abstract: In an apparatus and a method for slicing a cylindrical semiconductor ingot into thin wafer pieces using an inner peripheral sliding blade, a grind stone shaft with a grind stone mounted to the tip end thereof is located movably axially within a rotor provided with the inner peripheral sliding blade so that the grind stone shaft and rotor can be rotated integrally but axially movable relative to each other. The grind stone and slicing blade are arranged efficiently so that, after the semiconductor ingot is sliced with the slicing blade, the grind stone approaches the end face of the ingot to grind it. This can save a lapping step, thereby improving working efficiency.

Abstract: An internal peripheral edge type blade holding device for use in an internal peripheral edge type slicing machine used when a silicone ingot is sliced into thin pieces each having a thickness of the order of several hundred microns in a semiconductor manufacturing process. In the blade holding device, a head assembly for stretching and holding an internal peripheral edge blade is supported to a rotary plate through 4 plate springs spaced at 90.degree. intervals. Accordingly, when stretching the internal peripheral edge blade, even if the tension assembly is deformed because of the anisotropic property of the blade, such deformation can be absorbed by the plate springs and thus is not transmitted to the rotary plate, so that the swaying of the edge of the internal peripheral edge blade can be prevented in cutting the ingot.