Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate is bonded on a part of a ceramic substrate so as to expose an outer peripheral edge portion of the ceramic substrate in an integrally bonded member, the integrally bonded member is set on a treating apparatus while being covered with a masking member having a window portion from which the circuit pattern forming metal plate of the integrally bonded member is exposed.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed.

Abstract: A manufacturing machine for rod-shaped articles comprises a wrapping section (4) for forming a rod-shaped article by wrapping a filler material in a wrapper. The wrapping section has a forming bed (6) for guiding a garniture tape (10), which is used to form the rod-shaped article, in travel. The manufacturing machine further comprises a cooling system for cooling the forming bed (10). The cooling system is provided with cooling passages (43, 45, 47, 49, 143, 145, 149) formed in portions 6A to 6D of the forming bed (6) and a circuit for supplying a coolant to the cooling passages.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Abstract: A manufacturing machine for rod-shaped articles comprises a wrapping section (4) for forming a rod-shaped article by wrapping a filler material in a wrapper. The wrapping section has a forming bed (6) for guiding a garniture tape (10), which is used to form the rod-shaped article, in travel. The manufacturing machine further comprises a cooling system for cooling the forming bed (10). The cooling system is provided with cooling passages (43, 45, 47, 49, 143, 145, 149) formed in portions 6A to 6D of the forming bed (6) and a circuit for supplying a coolant to the cooling passages.

Abstract: The present invention provides a method of forming a circuit pattern on an integrally bonded member, the method not requiring a correction step of a laminate film or a resist film which has been necessary at the time of wet treatment of the integrally bonded member. After a circuit pattern forming metal plate 13 is bonded on a part of a ceramic substrate 12 so as to expose an outer peripheral edge portion of the ceramic substrate 12 in an integrally bonded member 10, the integrally bonded member 10 is set on a treating apparatus 30 while being covered with a masking member 20 having a window portion 22 from which the circuit pattern forming metal plate 13 of the integrally bonded member 10 is exposed.

Abstract: The surface to be plated of a composite made of a metallic and a non-metallic material is degreased and otherwise cleaned and immersed in a palladium activator fluid conditioned with a hydrogencarbonate to a pH of 2˜5. After this pretreating process, the composite is plated with a metal and becomes most suitable for use as a material for heat sink on hybrid ICs since it can be efficiently soldered and has better corrosion resistance.

Abstract: There is provided a method for producing a metal/ceramic bonding article, the method including the steps of: arranging a metal plate 12 of an overall-rate solid solution type alloy on a ceramic substrate 10; and heating the metal plate 12 and the ceramic substrate 10 in a non-oxidizing atmosphere at a temperature of lower than a melting point of the alloy to bond the metal plate 12 directly to the ceramic substrate 10. According to this method, it is possible to easily bond an alloy plate directly to a ceramic substrate, and it is possible to inexpensively provide an electronic member for resistance without causing the alloy plate to be deteriorated.

Abstract: There is provided a molding method of a thermosetting resin in which the formation of a flash can be prevented. This molding method comprises pouring or injecting the thermosetting resin into a mold, and then heating and molding it, and the method further comprises the step of locally heating an unnecessary gap and its peripheries of the mold, which are not concerned with the molding of the thermosetting resin into a desired article having a required shape, whereby the resin in the gap and its peripheries are promptly set to reduce the leakage of the resin into the unnecessary gap.

Abstract: A developer-regulating member includes a rubber elastomer blade pressed against the surface of a developer-feeding member and a holder for holding the rubber elastomer blade. The holder is warped in the direction of flattening the face of part of the rubber elastomer blade, that face being pressed against the surface of the developer-feeding member.

Abstract: A guidance system for an unmanned transporting vehicle which runs along a guide track. The guide track is composed of a belt-shaped light reflective material and laid out on a floor or the like. The unmanned transporting vehicle has two rows of photodetectors longitudinally arranged thereon forwardly of the front wheel. Since the two rows of the photodetectors are spaced apart from each other with a distance less than the width of the guide track, increasingly forwardly photodetectors begin failing to detecting the guide track earlier when the vehicle runs off the guide track. The vehicle is equipped with control means for controlling the steering mechansim of the vehicle in response to the detection count value such that the front wheel is swivelled to correct the vehicle deviation at a sufficiently early stage.