Abstract: A method of manufacturing a semiconductor device having a metal oxide film with workpiece accommodated in a chamber, includes: supplying a precursor gas containing a metal complex into the chamber to form a precursor layer on the workpiece from the precursor gas; supplying an oxidizing gas into the chamber to oxidize the precursor layer so that a metal oxide layer is formed, the oxidizing gas being a gas containing H2O or a gas having a functional group containing hydrogen atoms in the metal complex and containing an oxidant to generate H2O by reaction with the functional group; supplying an H2O removal gas containing alcohols or amines into the chamber to remove H2O adsorbed onto the metal oxide layer; and executing a plurality of cycles each including the supplying a precursor gas and the supplying an oxidizing gas. At least some of the cycles includes the supplying an H2O removal gas.

Abstract: A method of manufacturing a semiconductor device having a metal oxide film with workpiece accommodated in a chamber, includes: supplying a precursor gas containing a metal complex into the chamber to form a precursor layer on the workpiece from the precursor gas; supplying an oxidizing gas into the chamber to oxidize the precursor layer so that a metal oxide layer is formed, the oxidizing gas being a gas containing H2O or a gas having a functional group containing hydrogen atoms in the metal complex and containing an oxidant to generate H2O by reaction with the functional group; supplying an H2O removal gas containing alcohols or amines into the chamber to remove H2O adsorbed onto the metal oxide layer; and executing a plurality of cycles each including the supplying a precursor gas and the supplying an oxidizing gas. At least some of the cycles includes the supplying an H2O removal gas.

Abstract: A method and apparatus of forming a thin film using an organic metal compound gas and oxidizing agents are disclosed. The method includes performing a first film formation process of forming a thin film on an object to be processed using an organic metal compound gas and a first oxidizing agent; performing an annealing process of supplying a second oxidizing agent having stronger oxidizing power than the first oxidizing agent into the reaction chamber while an interior of the reaction chamber is heated to a predetermined temperature; and performing a second film formation process of forming a thin film on the thin film formed in the first thin film formation process using the organic metal compound gas and the second oxidizing agent.

Abstract: A method and apparatus of forming a thin film using an organic metal compound gas and oxidizing agents are disclosed. The method includes performing a first film formation process of forming a thin film on an object to be processed using an organic metal compound gas and a first oxidizing agent; performing an annealing process of supplying a second oxidizing agent having stronger oxidizing power than the first oxidizing agent into the reaction chamber while an interior of the reaction chamber is heated to a predetermined temperature; and performing a second film formation process of forming a thin film on the thin film formed in the first thin film formation process using the organic metal compound gas and the second oxidizing agent.

Abstract: A molding packaging material includes a heat resistant resin layer as an outer layer, a metal foil layer, and a first adhesive agent layer arranged there between. The first adhesive agent layer is constituted by an adhesive agent containing a two-part curing type polyester polyurethane resin made of a polyester resin as a main ingredient and a multifunctional isocyanate compound as a curing agent. The polyester resin is made from dicarboxylic acid and dialcohol, the dicarboxylic acid contains aliphatic carboxylic acid whose number of methylene of a methylene chain is an even number and aromatic carboxylic acid, and a content rate of the aromatic carboxylic acid to a total amount of aliphatic carboxylic acid and aromatic carboxylic acid is 40 to 80 mol %. The polyester resin is 8,000 to 25,000 in number average molecular weight (Mn) and 15,000 to 50,000 in weight average molecular weight (Mw), and a ratio thereof (Mw/Mn) is 1.3 to 2.5.

Abstract: A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 ?m, the concave-convex pattern of the support film having concave parts with a width of 0.05 to 100 ?m, a depth of 0.05 to 10 ?m, and a ratio of the depth of the concave part to the width of the concave part of up to 1.5, (B) disposing the transfer film on the crystalline substrate, and transferring the concave-convex film onto the crystalline substrate to produce a crystalline substrate having the concave-convex film thereon, (C) etching the crystalline substrate having the concave-convex film thereon to form a concave-convex structure on the surface of a crystalline substrate.

Abstract: A transfer film having a transfer layer disposed on a support film provided with the concave-convex structure, wherein the transfer layer includes a shape retaining layer and an adhesive layer, both the shape retaining layer and the adhesive layer containing a condensation product of a metal alkoxide, and the support film, the shape retaining layer, and the adhesive layer being disposed in this order.

Abstract: A method of producing the crystalline substrate having a concave-convex structure includes: (A) forming a transfer film by forming a concave-convex film on a support film on the surface having a concave-convex pattern thereon so that thickness of the residual film of the concave-convex film is 0.01 to 1 ?m, the concave-convex pattern of the support film having concave parts with a width of 0.05 to 100 ?m, a depth of 0.05 to 10 ?m, and a ratio of the depth of the concave part to the width of the concave part of up to 1.5, (B) disposing the transfer film on the crystalline substrate, and transferring the concave-convex film onto the crystalline substrate to produce a crystalline substrate having the concave-convex film thereon, (C) etching the crystalline substrate having the concave-convex film thereon to form a concave-convex structure on the surface of a crystalline substrate.

Abstract: A molding packaging material includes a heat resistant resin layer as an outer layer, a metal foil layer, and a first adhesive agent layer arranged there between. The first adhesive agent layer is constituted by an adhesive agent containing a two-part curing type polyester polyurethane resin made of a polyester resin as a main ingredient and a multifunctional isocyanate compound as a curing agent. The polyester resin is made from dicarboxylic acid and dialcohol, the dicarboxylic acid contains aliphatic carboxylic acid whose number of methylene of a methylene chain is an even number and aromatic carboxylic acid, and a content rate of the aromatic carboxylic acid to a total amount of aliphatic carboxylic acid and aromatic carboxylic acid is 40 to 80 mol %. The polyester resin is 8,000 to 25,000 in number average molecular weight (Mn) and 15,000 to 50,000 in weight average molecular weight (Mw), and a ratio thereof (Mw/Mn) is 1.3 to 2.5.

Abstract: A transfer film includes a support film and a transfer layer having a thickness of 0.01 to 10 ?tm laminated on the support film, wherein the transfer layer contains a siloxane oligomer and the content of silicon atoms relative to the total numbers of carbon, oxygen and silicon atoms as measured by X-ray photoelectron spectroscopy of the transfer layer is from 5 to 33%.

Abstract: Members including light guide plate 4 and others are accommodated in frame 23. Primary light emitted from point—like light source(s) (LED(s)) 14 is supplied to incidence face 6 of light guide plate 4 through window(s) 31 with which frame 23 provided. Positioning—projections formed on incidence face 6 are put into light-guide-plate-positioning-holes 24 with which frame 23 provided, restricting movement of light guide plate 4. Each window 31 of frame 23 has upper portion and lower portion which shade edges of upper and lower ends of incidence face 6, respectively. This prevents a part of the primary light from entering into light guide plate 4 via any edge of upper or lower ends of incidence face 6, avoiding abnormal emission from occurring. Another light guide plate 5 disposed at the back side of light guide plate 4 may be supplied with light generally in the same way.

Abstract: An emission face of a light guide plate is divided into two portions, a first emission part having a large area and a second emission part having a small area, by a straight line extending from a generally lateral-center position of the incidence face perpendicularly to the incidence face. A slope is formed on the emission face in the vicinity of the incidence face. The slope is formed so that thickness of the light guide plate decreases from a side end portion of the first emission part toward a side end portion of the second emission part in a cross section vertical to the straight line. Further, thickness of the light guide plate may decrease gradually according to an increasing distance along the straight line from the incidence face.

Abstract: Overlapping first and second light guide plates have incidence faces located opposite to each other. Each light guide plate has an emission restraint region, an emission gradually-increasing region and an emission promotion region arranged in order from incidence face toward distal end face. In each emission gradually-increasing region, emission light quantity increases gradually away from each emission restraint region toward each emission promotion region. The emission gradually-increasing regions of the light guide plates overlap each other. The emission promotion region of the second light guide plate overlaps with the emission restraint region of the first light guide plate while the emission restraint region of the second light guide plate overlaps the emission promotion region of the first light guide plate. Light from LEDs is limited by windows. Color-mixing of the LED-light occurs in each emission restraint region to become whitened light gaining emission intensity in the emission promotion regions.

Abstract: An incidence face is formed at a corner portion of a light guide plate having a generally rectangular emission face, being supplied with primary light form a primary light source. The incidence face has a configuration which obtained by applying undulation-modification to an imaginary incidence face that cuts off the corner portion obliquely. This undulation-modification gives the incidence face first and second incidence regions. The first incidence region is provided with unevenness that produces an inner propagation light having a diverging angle greater than that which would be obtained under an imaginary case where primary light was refracted on incident to the imaginary incidence face. The second incidence region is provided with slopes inclined with respect to the imaginary incidence face, causing the emission face to have a reduced unbalance in brightness.

Abstract: Emission of a surface light source device is prevented from having brightness-unevenness, having a uniformalized brightness. A plurality of LEDs are disposed opposite to an incidence face of a light guide plate. A reflection sheet is disposed along a back face of the light guide plate while a cover member for the LEDs is disposed on an emission face in the vicinity incidence face. A light diffusion member, first and second light control members are laminated disposed along a part of the emission face which is not covered by the cover member. A top of the reflection sheet is secluded a predetermined distance L from the incidence face to provided a part which is not covered by the reflection sheet in the vicinity of the incidence face. The predetermined distance L may be given, for example, by L=2h·tan ? (where h=thickness of light guide plate at incidence face, ?=critical angle at an interface between light guide plate and air.

Abstract: A light guide plate has a peripheral side part (cut-off part of corner portion C1) providing an incidence face. Light of LED enters into the light guide plate through the incidence face, being emitted from an emission face to illuminate a LCD panel or the like, after becoming inner propagation light. The emission face is divided into two portions, a first emission part having a large area and a second emission part having a small area, by a straight line extending from a generally lateral-center position of the incidence face perpendicularly to the incidence face. A slope is formed on the emission face in the vicinity of the incidence face. The slope is formed so that thickness of the light guide plate decreases from a side end portion of the first emission part toward a side end portion of the second emission part in a cross section vertical to the straight line.

Abstract: An incidence face is formed at a corner portion of a light guide plate having a generally rectangular emission face, being supplied with primary light form a primary light source. The incidence face has a configuration which obtained by applying undulation-modification to an imaginary incidence face that cuts off the corner portion obliquely. This undulation-modification gives the incidence face first and second incidence regions. The first incidence region is provided with unevenness that produces an inner propagation light having a diverging angle greater than that which would be obtained under an imaginary case where primary light was refracted on incident to the imaginary incidence face. The second incidence region is provided with slopes inclined with respect to the imaginary incidence face, causing the emission face to have a reduced unbalance in brightness.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

Abstract: The number of components of a high frequency power amplifier is reduced. A bias resistance ratio is adjusted in accordance with a change in the threshold voltage Vth of a transistor. A high frequency power amplifier has a plurality of amplifying systems. Each of these systems has an input terminal to which a signal to be amplified is supplied, an output terminal, a bias terminal, a plurality of amplifying stages which are sequentially cascaded between the input and output terminals, and a bias circuit connected to the bias terminal and each of the amplifying stages to apply a bias potential to the amplifying stage. The amplifying stage includes a control terminal for receiving an input signal and the bias potential supplied to the stage and a first terminal for transmitting an output signal of the stage.

Abstract: A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.