Abstract: An image forming apparatus (100) includes: an intermediate transfer belt (15B) provided in a body housing (3); an opening/closing unit (30); a second transfer roller (152) provided in the opening/closing unit (30) and in contact with the intermediate transfer belt (15B) when the opening/closing unit (30) is closed; a guide member (31) provided in the opening/closing unit (30) turnably and guiding a sheet to a contact area between the intermediate transfer belt (15B) and the second transfer roller (152); a conductive sheet (32) covering the guide member (31); and a conductive spring (33) provided in the opening/closing unit (30) and biasing the guide member (31) toward the intermediate transfer belt (15B) via the conductive sheet (32) to press the guide member (31) to the body housing (3), wherein when the opening/closing unit (30) is opened, the guide member (31) is in contact with the conductive spring (32) by gravity.

Abstract: In the semiconductor element, a second electrode is higher than a first electrode, and the first electrode and the second electrode have substantially the same height positions of the upper surfaces. In the semiconductor element, since the first electrode and the second electrode can be formed at the same time, it is possible to form the semiconductor element including the first electrode and the second electrode by a small number of processes.

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1?dimension d2) is 10 ?m or less.

Abstract: An image forming apparatus has an apparatus main body, a sheet conveyance passage, a cover member, a conveyance unit, a sheet tray, a first sheet feeding portion, and a feed unit. The sheet conveyance passage is inside the apparatus main body. The conveyance unit is inside the cover member and is supported to be pivotable between an open position and a closed position. The first sheet feeding portion has a feed unit. The conveyance unit has a swing guide of which a lower end part is swingably supported on the apparatus main body and which, in the closed position, is located in a first position to face the feed unit and constitute part of the sheet conveyance passage and, in the open position, is located in a second position to be located away from the feed unit.

Abstract: A mounting board includes an electronic component having at least a pair of first terminals, and a circuit board having at least a pair of second terminals. The first terminal and the second terminal are bonded to each other by a bonding material. The first terminal, the second terminal, and the bonding material are disposed inside a recessed portion formed in a resin layer such that the periphery thereof is surrounded by the resin layer. When a total thickness of the first terminal, the second terminal, and the bonding material is a dimension h1, the dimension h1 is 1 ?m to 20 ?m. When a width of the first terminal is a dimension d1 and a width of the recessed portion of the resin layer is a dimension d2, a value of (dimension d2—dimension d1) is 10 ?m or smaller.

Abstract: A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a base material of the electronic component; a base material of the wiring substrate; and a joint portion that includes at least an electrode of the electronic component and an electrode of the wiring substrate, and that joins the base material of the electronic component and the base material of the wiring substrate. The joint portion includes a material having an absorption coefficient of 2×10{circumflex over (?)}5 cm?1 or more for light of a wavelength of 250 to 1000 nm. The base material of at least one component of the electronic component and the wiring substrate consists of a material having an absorption coefficient of 1.5×10{circumflex over (?)}5 cm?1 or less for the light of a wavelength of 250 to 1000 nm.

Abstract: A joint structure, in which an electronic component and a wiring substrate are joined to each other, includes: a first layer being provided on one side of the electronic component and the wiring substrate, and being composed of a first metal containing Sn; a second layer being provided on the other side of the electronic component and the wiring substrate, and being composed of a second metal that forms an intermetallic compound with Sn; and a third layer being provided at a joint interface between the first layer and the second layer, and being composed of an intermetallic compound of the first metal and the second metal. An average thickness of the third layer is 0.1 ?m or more to 0.5 ?m or less.

Abstract: An image forming apparatus includes a body, a conveyance unit, an image carrier, a transfer unit, and a pre-transfer guide. The body has a sheet passage for conveying sheets along inner and outer conveyance surfaces mutually facing. The conveyance unit includes the outer conveyance surface and is supported pivotably between an open position and a closed position relative to the inner conveyance surface. The transfer unit rotatably supports a transfer roller. The pre-transfer guide includes a first guide on the outer conveyance surface and a second guide on the inner conveyance surface. The first guide has a contact segment protruding toward the second guide. The first guide and the transfer unit are supported independently swingably relative to the transfer unit. The first guide is urged toward the second, and the distance between the two guide surfaces is restricted by the contact segment touching a contacted portion.

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

Abstract: An image forming apparatus includes a body, a conveyance unit, an image carrier, a transfer unit, and a pre-transfer guide. The body has a sheet passage for conveying sheets along inner and outer conveyance surfaces mutually facing. The conveyance unit includes the outer conveyance surface and is supported pivotably between an open position and a closed position relative to the inner conveyance surface. The transfer unit rotatably supports a transfer roller. The pre-transfer guide includes a first guide on the outer conveyance surface and a second guide on the inner conveyance surface. The first guide has a contact segment protruding toward the second guide. The first guide and the transfer unit are supported independently swingably relative to the transfer unit. The first guide is urged toward the second, and the distance between the two guide surfaces is restricted by the contact segment touching a contacted portion.

Abstract: An image forming apparatus has an apparatus main body, a sheet conveyance passage, a cover member, a conveyance unit, a sheet tray, a first sheet feeding portion, and a feed unit. The sheet conveyance passage is inside the apparatus main body. The conveyance unit is inside the cover member and is supported to be pivotable between an open position and a closed position. The first sheet feeding portion has a feed unit. The conveyance unit has a swing guide of which a lower end part is swingably supported on the apparatus main body and which, in the closed position, is located in a first position to face the feed unit and constitute part of the sheet conveyance passage and, in the open position, is located in a second position to be located away from the feed unit.

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

Abstract: A bonding structure is a bonding structure which bonds a light emitting element and a substrate and includes a first electrode formed on the light emitting element, a second electrode formed on the substrate, and a bonding layer which bonds the first electrode and the second electrode, and the bonding layer contains a first bonding metal component and a second bonding metal component different from the first bonding metal component.

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.